Datasheet BC846BS (NXP) - 9
| 制造商 | NXP |
| 描述 | 65 V, 100 mA NPN/NPN general-purpose transistor pair |
| 页数 / 页 | 12 / 9 — NXP Semiconductors. BC846BS. 65 V, 100 mA NPN/NPN general-purpose … |
| 文件格式/大小 | PDF / 101 Kb |
| 文件语言 | 英语 |
NXP Semiconductors. BC846BS. 65 V, 100 mA NPN/NPN general-purpose transistor. 11. Soldering
该数据表的模型线
文件文字版本
NXP Semiconductors BC846BS 65 V, 100 mA NPN/NPN general-purpose transistor 11. Soldering
2.65 solder lands 2.35 1.5 0.6 0.4 (2×) 0.5 (4×) solder resist (4×) solder paste 0.5 0.6 occupied area (4×) (2×) 0.6 Dimensions in mm (4×) 1.8 sot363_fr
Fig 12. Reflow soldering footprint SOT363 (SC-88)
1.5 solder lands 4.5 0.3 2.5 solder resist occupied area 1.5 Dimensions in mm preferred transport direction during soldering 1.3 1.3 2.45 5.3 sot363_fw
Fig 13. Wave soldering footprint SOT363 (SC-88)
BC846BS_1 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 01 — 24 August 2009 9 of 12
Document Outline 1. Product profile 1.1 General description 1.2 Features 1.3 Applications 1.4 Quick reference data 2. Pinning information 3. Ordering information 4. Marking 5. Limiting values 6. Thermal characteristics 7. Characteristics 8. Test information 8.1 Quality information 9. Package outline 10. Packing information 11. Soldering 12. Revision history 13. Legal information 13.1 Data sheet status 13.2 Definitions 13.3 Disclaimers 13.4 Trademarks 14. Contact information 15. Contents
2.65 solder lands 2.35 1.5 0.6 0.4 (2×) 0.5 (4×) solder resist (4×) solder paste 0.5 0.6 occupied area (4×) (2×) 0.6 Dimensions in mm (4×) 1.8 sot363_fr
Fig 12. Reflow soldering footprint SOT363 (SC-88)
1.5 solder lands 4.5 0.3 2.5 solder resist occupied area 1.5 Dimensions in mm preferred transport direction during soldering 1.3 1.3 2.45 5.3 sot363_fw
Fig 13. Wave soldering footprint SOT363 (SC-88)
BC846BS_1 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 01 — 24 August 2009 9 of 12
Document Outline 1. Product profile 1.1 General description 1.2 Features 1.3 Applications 1.4 Quick reference data 2. Pinning information 3. Ordering information 4. Marking 5. Limiting values 6. Thermal characteristics 7. Characteristics 8. Test information 8.1 Quality information 9. Package outline 10. Packing information 11. Soldering 12. Revision history 13. Legal information 13.1 Data sheet status 13.2 Definitions 13.3 Disclaimers 13.4 Trademarks 14. Contact information 15. Contents