Datasheet BC846DS (NXP) - 8
| 制造商 | NXP |
| 描述 | 65 V, 100 mA NPN/NPN general-purpose transistor pair |
| 页数 / 页 | 12 / 8 — NXP Semiconductors. BC846DS. 65 V, 100 mA NPN/NPN general-purpose … |
| 文件格式/大小 | PDF / 105 Kb |
| 文件语言 | 英语 |
NXP Semiconductors. BC846DS. 65 V, 100 mA NPN/NPN general-purpose transistor. Test information. 8.1 Quality information
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NXP Semiconductors BC846DS 65 V, 100 mA NPN/NPN general-purpose transistor 8. Test information 8.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use in automotive applications.
9. Package outline
3.1 1.1 2.7 0.9
6 5 4
0.6 0.2 3.0 1.7 2.5 1.3 pin 1 index
1 2 3
0.40 0.26 0.95 0.25 0.10 1.9 Dimensions in mm 04-11-08
Fig 11. Package outline SOT457 (SC-74) 10. Packing information Table 8. Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number Package Description Packing quantity 3000 10000
BC846DS SOT457 4 mm pitch, 8 mm tape and reel; T1 [2] -115 -135 4 mm pitch, 8 mm tape and reel; T2 [3] -125 -165 [1] For further information and the availability of packing methods, see Section 14. [2] T1: normal taping [3] T2: reverse taping BC846DS_1 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 01 — 17 July 2009 8 of 12
Document Outline 1. Product profile 1.1 General description 1.2 Features 1.3 Applications 1.4 Quick reference data 2. Pinning information 3. Ordering information 4. Marking 5. Limiting values 6. Thermal characteristics 7. Characteristics 8. Test information 8.1 Quality information 9. Package outline 10. Packing information 11. Soldering 12. Revision history 13. Legal information 13.1 Data sheet status 13.2 Definitions 13.3 Disclaimers 13.4 Trademarks 14. Contact information 15. Contents
NXP Semiconductors BC846DS 65 V, 100 mA NPN/NPN general-purpose transistor 8. Test information 8.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use in automotive applications.
9. Package outline
3.1 1.1 2.7 0.9
6 5 4
0.6 0.2 3.0 1.7 2.5 1.3 pin 1 index
1 2 3
0.40 0.26 0.95 0.25 0.10 1.9 Dimensions in mm 04-11-08
Fig 11. Package outline SOT457 (SC-74) 10. Packing information Table 8. Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number Package Description Packing quantity 3000 10000
BC846DS SOT457 4 mm pitch, 8 mm tape and reel; T1 [2] -115 -135 4 mm pitch, 8 mm tape and reel; T2 [3] -125 -165 [1] For further information and the availability of packing methods, see Section 14. [2] T1: normal taping [3] T2: reverse taping BC846DS_1 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 01 — 17 July 2009 8 of 12
Document Outline 1. Product profile 1.1 General description 1.2 Features 1.3 Applications 1.4 Quick reference data 2. Pinning information 3. Ordering information 4. Marking 5. Limiting values 6. Thermal characteristics 7. Characteristics 8. Test information 8.1 Quality information 9. Package outline 10. Packing information 11. Soldering 12. Revision history 13. Legal information 13.1 Data sheet status 13.2 Definitions 13.3 Disclaimers 13.4 Trademarks 14. Contact information 15. Contents