Datasheet ZSSC4175D-01 (IDT) - 3

link to page 19 link to page 19 link to page 20 link to page 20 link to page 21 link to page 21 link to page 21 link to page 21 link to page 21 link to page 21 link to page 23 link to page 23 link to page 23 link to page 24 link to page 26 link to page 27 link to page 28 link to page 28 link to page 28 link to page 28 link to page 29 link to page 30 link to page 30 link to page 31 link to page 32 link to page 33 link to page 5 link to page 12 link to page 13 link to page 17 link to page 22 link to page 22 link to page 24 link to page 27 ZSSC4175D-01 Datasheet 7.7 NVM OEM Data Memory ...19 7.8 Over-Voltage and Short-Circuit Protection ..19 8. Fault-Safe Operation ..20 8.1 Fault-Safe Operation Modes ...20 8.2 Fault Messaging ..21 8.2.1 Overview ...21 8.2.2 SENT Fast Channel Fault Codes ...21 8.2.3 SENT Status Bits ..21 8.2.4 SENT SDM Channel Status Codes ..21 8.2.5 Timing Definitions ...21 9. Fault Checks ...23 9.1 Overview ..23 9.2 Hardware Fault Checks ...23 9.3 Application Monitors ..24 9.4 Transmission Fault Checks ...26 10. Application Circuit and External Components ..27 11. ESD Protection and EMC Specification ..28 11.1 ESD Protection ..28 11.2 Electromagnetic Emission ...28 11.3 Conducted Susceptibility (DPI) ..28 12. Reliability and RoHS Conformity ..29 13. Package Outline Drawings ...30 14. Marking Diagram ..30 15. Glossary ...31 16. Ordering Information ...32 17. Revision History ..33
List of Figures
Figure 1. Pin Assignments for 4  4 mm 24-QFN Package – Top View ...5 Figure 2. Block Diagram ..12 Figure 3. Main Signal Path of the ZSSC4175D-01 Application ...13 Figure 4. SDM Cycle Example ..17 Figure 5. Output Update Timing Diagram ...22 Figure 6. Fault Messaging Timing Diagram ..22 Figure 7. Fault Check Thresholds ...24 Figure 8. Application Circuit Example of a Temperature Sensor with SENT Output ...27 © 2019 Integrated Device Technology, Inc. 3 June 7, 2019 Document Outline 1. Pin Assignments 2. Pin Descriptions 3. Absolute Maximum Ratings 4. Operating Conditions 5. Electrical Characteristics 6. Interface Characteristics and Nonvolatile Memory 7. Circuit Description 7.1 General Operation Description 7.2 Signal Path 7.3 Signal Conditioning 7.3.1 Thermocouple Sensor Signal Conditioning 7.3.2 Internal Temperature Sensor Signal Conditioning 7.4 Analog Front-End 7.4.1 Overview 7.4.2 SCCM 7.4.3 Input Multiplexer 7.4.4 Programmable Gain Amplifier 7.4.5 Analog-to-Digital Converter 7.5 Signal Measurement 7.5.1 Thermocouple Element Measurement 7.5.2 Internal Temperature Measurement 7.5.3 Isolation Conductance Measurement (Giso) 7.5.4 Thermocouple Resistor Measurement (Ropen) 7.5.5 Measurement Cycle 7.6 SENT Output 7.6.1 Overview 7.6.2 SENT Fast Channel Modes and Frame Format 7.6.3 SENT SDM Channel Modes 7.6.4 SENT Output Operation Modes 7.6.5 SENT Pulse Shaping 7.7 NVM OEM Data Memory 7.8 Over-Voltage and Short-Circuit Protection 8. Fault-Safe Operation 8.1 Fault-Safe Operation Modes 8.2 Fault Messaging 8.2.1 Overview 8.2.2 SENT Fast Channel Fault Codes 8.2.3 SENT Status Bits 8.2.4 SENT SDM Channel Status Codes 8.2.5 Timing Definitions 9. Fault Checks 9.1 Overview 9.2 Hardware Fault Checks 9.3 Application Monitors 9.4 Transmission Fault Checks 10. Application Circuit and External Components 11. ESD Protection and EMC Specification 11.1 ESD Protection 11.2 Electromagnetic Emission 11.3 Conducted Susceptibility (DPI) 12. Reliability and RoHS Conformity 13. Package Outline Drawings 14. Marking Diagram 15. Glossary 16. Ordering Information 17. Revision History