Datasheet LTM4664 (Analog Devices) - 4

LTM4664
ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION (Note 1) 4:1 Divider
V 16 INS1, SW1, SW2, INSNSS1+, INSNSS1–, 15 FAULTS1, FAULTS2 ...–0.3V to 60V 14 VINS2, VINS2F, INSNSS2+, INSNSS2–, PGOODS1, 13 PGOODS2, EXTVCCS1, EXTVCCS2, SW3, SW4, 12 OVP_SET, VOUT2_SET, OVP_TRIP, V 11 OUT1 ...–0.3V to 40V V 10 OUT2 ... 0.3V to 20V 9 INTVCCS1, INTVCCS2 ...OUTPUT ONLY, RATED 6V 8 RUNS1, RUNS2 .. –0.3V to 6V 7 UVS1, UVS2, HYS_PRGMS1, HYS_PRGMS2, 6 TIMERS1, TIMERS2, FREQS1, 5 4 FREQS2 ...–0.3V to INTVCCS1, –0.3 to INTVCCS2 3
DUAL 25A PSM SECTION
2 VINS3_Cn, IN+, IN– .. –0.3V to 18V 1 (VINS3_Cn – IN+), (IN+ – IN–).. –0.3V to 0.3V A B C D E F G H J K L M N P R T SWC0, SWC1 .. –1V to 18V, –5V to 18V Transient BGA PACKAGE 240-PIN (16mm × 16mm × 7.72mm) EXTVCC .. –0.3V to 6V TJMAX = 125°C, θJCTOP = 5.47 C/W, θJCBOTTOM = 2.15 C/W, θJA = 5.3 C/W V θJC VALUES ARE DETERMINED BY SIMULATION PER JESD51 CONDITIONS. OUTCn .. –0.3V to 3.6V θJA VALUE IS OBTAINED FROM MEASUREMENTS WITH DEMO BOARD. V + OSNS _Cn ... –0.3V to 6V WEIGHT = 7.26 GRAMS. REFER TO PAGE 78 FOR LAB MEASUREMENT AND DERATING INFORMATION. V – OSNS _Cn .. –0.3V to 0.3V NOTE: NOT RECOMMENDED FOR BACK-SIDE REFLOW SOLDERING. RUN_Cn, SDA, SCL, ALERT... –0.3V to 5.5V SEE WEBSITE FOR MORE INFORMATION FSWPH_CFG, VOUTCn_CFG, VTRIMCn_CFG, ASEL, COMP_1a, COMP_1b, COMP_0a, COMP_0b ..–0.3V to 2.75V FAULT_Cn, SYNC, SHARE_CLK, WP, PGOOD_Cn, PWM_Cn, PHFLT_Cn ... –0.3V to 3.6V TSNS_Cna, ... –0.3V to 2.2V TSNS_Cnb .. –0.3V to 0.8V, < 5mA OVP-SET IMAX Sink .. ………. 5mA INTVCC VDD33, VDD25 and GL_Cn are Outputs. Internal Operating Temperature Range (Notes 2, 14, 15) ..–40°C to 125°C Storage Temperature Range .. –55°C to 125°C Peak Solder Reflow (Package Body) Temperature 245°C
ORDER INFORMATION PART MARKING PACKAGE MSL TEMPERATURE RANGE PART NUMBER PAD OR BALL FINISH DEVICE FINISH CODE TYPE RATING (SEE NOTE 2)
LTM4664EY#PBF LTM4664Y SAC305 (RoHS) e1 BGA 3 –40°C to 125°C LTM4664IY#PBF LTM4664Y • Contact the factory for parts specified with wider operating temperature • Recommended LGA and BGA PCB Assembly and Manufacturing ranges. *Pad or ball finish code is per IPC/JEDEC J-STD-609. Procedures • LGA and BGA Package and Tray Drawings Rev. 0 4 For more information www.analog.com Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Order Information Pin Configuration Electrical Characteristics Typical Performance Characteristics 4:1 Divider Block Diagram Dual 25A Power System Management (PSM) Block Diagram 4:1 Divider Operation 4:1 Divider Description Main Control INTVCCS1,2/EXTVCCS1,2 Power Start-Up and Shutdown Fault Protection and Thermal Shutdown High Side Current Sensing Frequency Selection Power Good and UV (PGOODSn and UVSn pins) Additional Overvoltage Protection 4:1 Divider Application Information Voltage Divider Pre-Balance Before Switching Overcurrent Protection Window Comparator Programming Effective Open Loop Output Resistance and Load Regulation Undervoltage Lockout Fault Response and Timer Programming Design Example Dual 25A PSM Operation PSM Section Overview, Major Features EEPROM with ECC Power-Up and Initialization Soft-Start Time-Based Sequencing Voltage-Based Sequencing Shutdown Light-Load Current Operation Switching Frequency and Phase PWM Loop Compensation Output Voltage Sensing INTVCC/EXTVCC Power Output Current Sensing and Sub Milliohm DCR Current Sensing Input Current Sensing PolyPhase Load Sharing External/Internal Temperature Sense RCONFIG (Resistor Configuration) Pins Fault Detection and Handling Status Registers and ALERT Masking Mapping Faults to FAULT Pins Power Good Pins CRC Protection Serial Interface Communication Protection Device Addressing Responses to VOUT and IIN/IOUT Faults Output Overvoltage Fault Response Output Undervoltage Response Peak Output Overcurrent Fault Response Responses to Timing Faults Responses to VIN OV Faults Responses to OT/UT Faults Internal Overtemperature Fault Response External Overtemperature and Undertemperature Fault Response Responses to Input Overcurrent and Output Undercurrent Faults Responses to External Faults Fault Logging Bus Timeout Protection Similarity Between PMBus, SMBus and I2C 2-Wire Interface PMBus Serial Digital Interface Figure 11 thru Figure 28 PMBus Protocols PMBus Command Summary PMBus Commands Dual 25A PSM Applications Information VIN to VOUT Step-Down Ratios Input Capacitors Output Capacitors Light Load Current Operation Switching Frequency and Phase Output Current Limit Programming Minimum On-Time Considerations Variable Delay Time, Soft-Start and Output Voltage Ramping Digital Servo Mode Soft Off (Sequenced Off) Undervoltage Lockout Fault Detection and Handling Open-Drain Pins Phase-Locked Loop and Frequency Synchronization Input Current Sense Amplifier Programmable Loop Compensation Checking Transient Response PolyPhase® Configuration Connecting the USB to I2C/SMBus/PMBus Controller to the LTM4664 In-System LTpowerPlay: An Interactive GUI for Digital Power PMBus Communication and Command Processing Thermal Considerations and Output Current Derating Table 10 and Table 11: Output Current Derating (Based on Demo Board) Dual 25A PSM Applications Information–Derating Curves EMI Performance Safety Considerations Layout Checklist/Example Typical Applications PMBus Command Details Addressing and Write Protect General Configuration Commands On/Off/Margin PWM Configuration Voltage Input Voltage and Limits Output Voltage and Limits Output Current and Limits Input Current and Limits Temperature External Temperature Calibration Timing Timing—On Sequence/Ramp Timing—Off Sequence/Ramp Precondition for Restart Fault Response Fault Responses All Faults Fault Responses Input Voltage Fault Responses Output Voltage Fault Responses Output Current Fault Responses IC Temperature Fault Responses External Temperature Fault Sharing Fault Sharing Propagation Fault Sharing Response Scratchpad Identification Fault Warning and Status Telemetry NVM Memory Commands Store/Restore Fault Logging Block Memory Write/Read Package Description Typical Applications Related Parts