Datasheet MPSA05, MPSA06, MPSA55, MPSA56 (ON Semiconductor)
| 制造商 | ON Semiconductor |
| 描述 | NPN Bipolar Small Signal Transistor |
| 页数 / 页 | 7 / 1 — *Preferred Devices. Voltage and Current are Negative for PNP Transistors. … |
| 修订版 | 3 |
| 文件格式/大小 | PDF / 92 Kb |
| 文件语言 | 英语 |
*Preferred Devices. Voltage and Current are Negative for PNP Transistors. http://onsemi.com. Features. NPN. PNP. MAXIMUM RATINGS
该数据表的模型线
文件文字版本
link to page 1 link to page 6 NPN − MPSA05, MPSA06*; PNP − MPSA55, MPSA56*
*Preferred Devices
Amplifier Transistors
Voltage and Current are Negative for PNP Transistors http://onsemi.com Features NPN PNP
• Pb−Free Packages are Available* COLLECTOR COLLECTOR 3 3
MAXIMUM RATINGS
2 2 BASE BASE
Rating Symbol Value Unit
Collector − Emitter Voltage VCEO Vdc MPSA05, MPSA55 60 1 1 MPSA06, MPSA56 80 EMITTER EMITTER Collector − Base Voltage VCBO Vdc MPSA05, MPSA55 60 MPSA06, MPSA56 80 Emitter − Base Voltage VEBO 4.0 Vdc
TO−92
Collector Current − Continuous IC 500 mAdc
CASE 29 STYLE 1
Total Device Dissipation @ TA = 25°C PD 625 W Derate above 25°C 5.0 mW/°C 1 1 Total Device Dissipation @ T 2 2 C = 25°C PD 1.5 W 3 3 Derate above 25°C 12 mW/°C STRAIGHT LEAD BENT LEAD Operating and Storage Junction TJ, Tstg −55 to +150 °C BULK PACK TAPE & REEL Temperature Range AMMO PACK
THERMAL CHARACTERISTICS Characteristic Symbol Max Unit MARKING DIAGRAM
Thermal Resistance, Junction−to−Ambient RqJA 200 °C/W (Note 1) Thermal Resistance, Junction−to−Case RqJC 83.3 °C/W MPS Stresses exceeding Maximum Ratings may damage the device. Maximum Axx Ratings are stress ratings only. Functional operation above the Recommended AYWW G Operating Conditions is not implied. Extended exposure to stresses above the G Recommended Operating Conditions may affect device reliability. 1. RqJA is measured with the device soldered into a typical printed circuit board. xx = 05, 06, 55, or 56 A = Assembly Location Y = Year WW = Work Week G = Pb−Free Package (Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package dimensions section on page 6 of this data sheet. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques
Preferred
devices are recommended choices for future use Reference Manual, SOLDERRM/D. and best overall value. © Semiconductor Components Industries, LLC, 2007
1
Publication Order Number:
April, 2007 − Rev. 3 MPSA05/D
*Preferred Devices
Amplifier Transistors
Voltage and Current are Negative for PNP Transistors http://onsemi.com Features NPN PNP
• Pb−Free Packages are Available* COLLECTOR COLLECTOR 3 3
MAXIMUM RATINGS
2 2 BASE BASE
Rating Symbol Value Unit
Collector − Emitter Voltage VCEO Vdc MPSA05, MPSA55 60 1 1 MPSA06, MPSA56 80 EMITTER EMITTER Collector − Base Voltage VCBO Vdc MPSA05, MPSA55 60 MPSA06, MPSA56 80 Emitter − Base Voltage VEBO 4.0 Vdc
TO−92
Collector Current − Continuous IC 500 mAdc
CASE 29 STYLE 1
Total Device Dissipation @ TA = 25°C PD 625 W Derate above 25°C 5.0 mW/°C 1 1 Total Device Dissipation @ T 2 2 C = 25°C PD 1.5 W 3 3 Derate above 25°C 12 mW/°C STRAIGHT LEAD BENT LEAD Operating and Storage Junction TJ, Tstg −55 to +150 °C BULK PACK TAPE & REEL Temperature Range AMMO PACK
THERMAL CHARACTERISTICS Characteristic Symbol Max Unit MARKING DIAGRAM
Thermal Resistance, Junction−to−Ambient RqJA 200 °C/W (Note 1) Thermal Resistance, Junction−to−Case RqJC 83.3 °C/W MPS Stresses exceeding Maximum Ratings may damage the device. Maximum Axx Ratings are stress ratings only. Functional operation above the Recommended AYWW G Operating Conditions is not implied. Extended exposure to stresses above the G Recommended Operating Conditions may affect device reliability. 1. RqJA is measured with the device soldered into a typical printed circuit board. xx = 05, 06, 55, or 56 A = Assembly Location Y = Year WW = Work Week G = Pb−Free Package (Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package dimensions section on page 6 of this data sheet. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques
Preferred
devices are recommended choices for future use Reference Manual, SOLDERRM/D. and best overall value. © Semiconductor Components Industries, LLC, 2007
1
Publication Order Number:
April, 2007 − Rev. 3 MPSA05/D