Data SheetADN2892TYPICAL PERFORMANCE CHARACTERISTICS0.06+95C0.05+25C) (V E 0.04AS LE0.03150mV/DIV–40CAND RE0.02TRIP–40CDEASSERTION0.01+25C+95CASSERTION 04986-012 50ps/DIV0 04986-026 1k10k100kRTH () Figure 3. Eye of ADN2892 at 25°C, 4.25 Gbps, and 10 mV Input Figure 6. LOS Trip and Release vs. RTH at 4.25 Gbps 871GBPS(dB)6IS S E R54.25GBPSE T S4150mV/DIV3TRICAL HY C E2L E1 04986-023 50ps/DIV0 04986-027 1k10k100kRTH () Figure 4. Eye of ADN2892 at 95°C, 4.25 Gbps, and 10 mV Input Figure 7. LOS Electrical Hysteresis vs. RTH at 25°C 16141210LES P8M150mV/DIVSA642 04986-010 0 04986-024 200ps/DIV5.8 6.0 6.2 6.4 6.6 6.8 7.0 7.2 7.4 7.6 7.8 8.0 8.2 8.4 8.6ELECTRICAL HYSTERESIS (dB) Figure 5. Eye of ADN2892 at 25°C, 1.063 Gbps, and 10 mV Input (BW_SEL = 0) Figure 8. Sample Lot Distribution—Worst-Case Condition: Conditions = 4.25 Gbps, 100 kΩ at −40°C, 3.6 V Rev. C | Page 7 of 16 Document Outline Features Applications General Description Functional Block Diagram Specifications Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics Theory of Operation Limiting Amplifier Input Buffer CML Output Buffer Loss-of-Signal (LOS) Detector Received Signal Strength Indicator (RSSI) Squelch Mode BW_SEL (Bandwidth Selection) Mode LOS_INV (Lose of Signal_Invert) Mode Applications Information PCB Design Guidelines Output Buffer Power Supply and Ground Planes PCB Layout Soldering Guidelines for the LFCSP Pad Coating and Pb-Free Soldering Outline Dimensions Ordering Guide