Datasheet TMD2635 (AustriaMicroSystems) - 4
| 制造商 | AustriaMicroSystems |
| 描述 | Miniature Proximity Sensor Module |
| 页数 / 页 | 47 / 4 — TMD2635 −. Absolute Maximum Ratings. Figure 5: Absolute Maximum Ratings. … |
| 文件格式/大小 | PDF / 707 Kb |
| 文件语言 | 英语 |
TMD2635 −. Absolute Maximum Ratings. Figure 5: Absolute Maximum Ratings. Symbol. Parameter. Min. Max. Units. Comments. Note(s):. Page 4
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TMD2635 −
Absolute Maximum R atings Stresses beyond those listed under Absolute Maximum Ratings
Absolute Maximum Ratings
may cause permanent damage to the device. These are stress ratings only. Functional operation of the device at these or any other conditions beyond those indicated under Electrical Characteristics is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Figure 5: Absolute Maximum Ratings Symbol Parameter Min Max Units Comments
VDD Supply voltage to GND -0.3 2.0 V VDD3 IR emitter voltage to GND -0.3 3.6 V VIO Digital I/O terminal voltage -0.3 3.6 V IIO Digital output terminal voltage -1 20 mA ISCR Input current (latch up immunity) ±100 mA Class II JEDEC JESD78E ESDHBM HBM Electrostatic discharge ±2000 V JEDEC/ ESDA JS-001-2017 ESDCDM CDM Electrostatic discharge ±500 V JEDEC JS-002-2014 TSTRG Storage temperature range -40 85 °C TBODY Package body temperature 260 °C IPC/JEDEC J-STD-020 (1) RHNC Relative humidity 5 85 % (non- condensing) Average power dissipation PDISS Power dissipation 50 mW over a 1 second period
Note(s):
1. The reflow peak soldering temperature (body temperature) is specified according to IPC/JEDEC J-STD-020 “Moisture/Reflow Sensitivity Classification for Non-hermetic Solid State Surface Mount Devices.”
Page 4 ams Datasheet
Document Feedback [v1-00] 2019-Jul-17 Document Outline General Description Key Benefits & Features Applications Block Diagram Pin Assignment Absolute Maximum Ratings Electrical Characteristics Timing Characteristics Detailed Description Proximity Operation Proximity I²C Characteristics Alternate I²C Address Option I²C Write Transaction I²C Read Transaction Simplified State Diagram Register Description ENABLE Register (0x80) PRATE Register (0x82) PILTL Register (0x88) PILTH Register (0x89) PIHTL Register (0x8A) PIHTH Register (0x8B) PERS Register (0x8C) CFG0 Register (0x8D) PCFG0 Register (0x8E) PCFG1 Register (0x8F) REVID Register (0x91) ID Register (0x92) STATUS Register (0x9B) PDATAL Register (0x9C) PDATAH Register (0x9D) REVID2 Register (0xA6) SOFTRST Register (0xA8) PWTIME Register (0xA9) CFG8 Register (0xAA) CFG3 Register (0xAB) CFG6 Register (0xAE) PFILTER Register (0xB3) POFFSETL Register (0xC0) POFFSETH Register (0xC1) CALIB Register (0xD7) CALIBCFG Register (0xD9) CALIBSTAT Register (0xDC) INTENAB Register (0xDD) FAC_L Register (0xE5) FAC_H Register (0xE6) TEST9 Register (0xF9) Application Information PCB Pad Layout Packaging Drawings Tape & Reel Information Soldering & Storage Information Storage Information Moisture Sensitivity Shelf Life Floor Life Rebaking Instructions Laser Eye Safety Ordering & Contact Information RoHS Compliant & ams Green Statement Copyrights & Disclaimer Document Status Revision Information Content Guide
TMD2635 −
Absolute Maximum R atings Stresses beyond those listed under Absolute Maximum Ratings
Absolute Maximum Ratings
may cause permanent damage to the device. These are stress ratings only. Functional operation of the device at these or any other conditions beyond those indicated under Electrical Characteristics is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Figure 5: Absolute Maximum Ratings Symbol Parameter Min Max Units Comments
VDD Supply voltage to GND -0.3 2.0 V VDD3 IR emitter voltage to GND -0.3 3.6 V VIO Digital I/O terminal voltage -0.3 3.6 V IIO Digital output terminal voltage -1 20 mA ISCR Input current (latch up immunity) ±100 mA Class II JEDEC JESD78E ESDHBM HBM Electrostatic discharge ±2000 V JEDEC/ ESDA JS-001-2017 ESDCDM CDM Electrostatic discharge ±500 V JEDEC JS-002-2014 TSTRG Storage temperature range -40 85 °C TBODY Package body temperature 260 °C IPC/JEDEC J-STD-020 (1) RHNC Relative humidity 5 85 % (non- condensing) Average power dissipation PDISS Power dissipation 50 mW over a 1 second period
Note(s):
1. The reflow peak soldering temperature (body temperature) is specified according to IPC/JEDEC J-STD-020 “Moisture/Reflow Sensitivity Classification for Non-hermetic Solid State Surface Mount Devices.”
Page 4 ams Datasheet
Document Feedback [v1-00] 2019-Jul-17 Document Outline General Description Key Benefits & Features Applications Block Diagram Pin Assignment Absolute Maximum Ratings Electrical Characteristics Timing Characteristics Detailed Description Proximity Operation Proximity I²C Characteristics Alternate I²C Address Option I²C Write Transaction I²C Read Transaction Simplified State Diagram Register Description ENABLE Register (0x80) PRATE Register (0x82) PILTL Register (0x88) PILTH Register (0x89) PIHTL Register (0x8A) PIHTH Register (0x8B) PERS Register (0x8C) CFG0 Register (0x8D) PCFG0 Register (0x8E) PCFG1 Register (0x8F) REVID Register (0x91) ID Register (0x92) STATUS Register (0x9B) PDATAL Register (0x9C) PDATAH Register (0x9D) REVID2 Register (0xA6) SOFTRST Register (0xA8) PWTIME Register (0xA9) CFG8 Register (0xAA) CFG3 Register (0xAB) CFG6 Register (0xAE) PFILTER Register (0xB3) POFFSETL Register (0xC0) POFFSETH Register (0xC1) CALIB Register (0xD7) CALIBCFG Register (0xD9) CALIBSTAT Register (0xDC) INTENAB Register (0xDD) FAC_L Register (0xE5) FAC_H Register (0xE6) TEST9 Register (0xF9) Application Information PCB Pad Layout Packaging Drawings Tape & Reel Information Soldering & Storage Information Storage Information Moisture Sensitivity Shelf Life Floor Life Rebaking Instructions Laser Eye Safety Ordering & Contact Information RoHS Compliant & ams Green Statement Copyrights & Disclaimer Document Status Revision Information Content Guide