Datasheet DA9121 (Dialog Semiconductor) - 12
| 制造商 | Dialog Semiconductor |
| 描述 | High-Performance, 10 A, Dual-Phase DC-DC Converter |
| 页数 / 页 | 47 / 12 — DA9121. High-Performance, 10 A, Dual-Phase DC-DC Converter. Parameter. … |
| 文件格式/大小 | PDF / 1.4 Mb |
| 文件语言 | 英语 |
DA9121. High-Performance, 10 A, Dual-Phase DC-DC Converter. Parameter. Description. Conditions. Min. Typ. Max. Unit. 3.7
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文件文字版本
DA9121 High-Performance, 10 A, Dual-Phase DC-DC Converter Parameter Description Conditions Min Typ Max Unit
ON state TA = 27 °C IIN_ON Supply current 5 10 20 μA IC_EN = 1 Buck off
3.7 Digital IO Characteristics Table 10: Digital I/O Electrical Characteristics Parameter Description Conditions Min Typ Max Unit Electrical Performance
VIH_EN Input high voltage, IC enable 1.2 AVDD V VIL_EN Input low voltage, IC enable 0.4 V tIC_EN IC enable time 1000 μs V Input high voltage IH_GPIO_SCL 1.2 AVDD V _SDA GPIO, SCL, SDA V Input low voltage IL_GPIO_SCL_ 0.4 V SDA GPIO, SCL, SDA Output high voltage Push-pull mode 0.8*AV VOH_GPIO AVDD V GPIO I DD OUT = 1 mA Output low voltage Push-pull mode 0.2*AV VOL_GPIO V GPIO I DD OUT = 1 mA Output low voltage VOL_SDA IOUT = 3 mA 0.24 V SDA RPD GPIO pull-down resistor 2 10 120 kΩ RPU GPIO pull-up resistor 2 10 120 kΩ
Datasheet Revision 2.0 18-Jul-2019
CFR0011-120-00 12 of 47 © 2019 Dialog Semiconductor Document Outline General Description Key Features Applications System Diagrams Contents 1 Terms and Definitions 2 Pinout 3 Characteristics 3.1 Absolute Maximum Ratings 3.2 Recommended Operating Conditions 3.3 Thermal Characteristics 3.3.1 Thermal Ratings 3.3.2 Power Dissipation 3.4 ESD Characteristics 3.5 Buck Characteristics 3.6 Performance and Supervision Characteristics 3.7 Digital IO Characteristics 3.8 Timing Characteristics 3.9 Typical Performance 4 Functional Description 4.1 DC-DC Buck Converter 4.1.1 Switching Frequency 4.1.2 Operation Modes and Phase Selection 4.1.3 Output Voltage Selection 4.1.4 Soft Start-Up and Shutdown 4.1.5 Current Limit 4.1.6 Thermal Protection 4.2 Internal Circuits 4.2.1 IC_EN/Chip Enable/Disable 4.2.2 nIRQ/Interrupt 4.2.3 GPIO 4.2.3.1 GPIO Pin Assignment 4.2.3.2 GPIO Function 4.2.3.3 Chip Configuration Select (CONF) 4.3 Operating Modes 4.3.1 ON 4.3.2 OFF 4.4 I2C Communication 4.4.1 I2C Protocol 5 Register Definitions 5.1 Register Map 5.1.1 System 5.1.2 Buck1 5.1.3 Serialization 6 Package Information 6.1 Package Outlines 6.2 Moisture Sensitivity Level 6.3 WLCSP Handling 6.4 Soldering Information 7 Ordering Information 8 Application Information 8.1 Capacitor Selection 8.2 Inductor Selection
ON state TA = 27 °C IIN_ON Supply current 5 10 20 μA IC_EN = 1 Buck off
3.7 Digital IO Characteristics Table 10: Digital I/O Electrical Characteristics Parameter Description Conditions Min Typ Max Unit Electrical Performance
VIH_EN Input high voltage, IC enable 1.2 AVDD V VIL_EN Input low voltage, IC enable 0.4 V tIC_EN IC enable time 1000 μs V Input high voltage IH_GPIO_SCL 1.2 AVDD V _SDA GPIO, SCL, SDA V Input low voltage IL_GPIO_SCL_ 0.4 V SDA GPIO, SCL, SDA Output high voltage Push-pull mode 0.8*AV VOH_GPIO AVDD V GPIO I DD OUT = 1 mA Output low voltage Push-pull mode 0.2*AV VOL_GPIO V GPIO I DD OUT = 1 mA Output low voltage VOL_SDA IOUT = 3 mA 0.24 V SDA RPD GPIO pull-down resistor 2 10 120 kΩ RPU GPIO pull-up resistor 2 10 120 kΩ
Datasheet Revision 2.0 18-Jul-2019
CFR0011-120-00 12 of 47 © 2019 Dialog Semiconductor Document Outline General Description Key Features Applications System Diagrams Contents 1 Terms and Definitions 2 Pinout 3 Characteristics 3.1 Absolute Maximum Ratings 3.2 Recommended Operating Conditions 3.3 Thermal Characteristics 3.3.1 Thermal Ratings 3.3.2 Power Dissipation 3.4 ESD Characteristics 3.5 Buck Characteristics 3.6 Performance and Supervision Characteristics 3.7 Digital IO Characteristics 3.8 Timing Characteristics 3.9 Typical Performance 4 Functional Description 4.1 DC-DC Buck Converter 4.1.1 Switching Frequency 4.1.2 Operation Modes and Phase Selection 4.1.3 Output Voltage Selection 4.1.4 Soft Start-Up and Shutdown 4.1.5 Current Limit 4.1.6 Thermal Protection 4.2 Internal Circuits 4.2.1 IC_EN/Chip Enable/Disable 4.2.2 nIRQ/Interrupt 4.2.3 GPIO 4.2.3.1 GPIO Pin Assignment 4.2.3.2 GPIO Function 4.2.3.3 Chip Configuration Select (CONF) 4.3 Operating Modes 4.3.1 ON 4.3.2 OFF 4.4 I2C Communication 4.4.1 I2C Protocol 5 Register Definitions 5.1 Register Map 5.1.1 System 5.1.2 Buck1 5.1.3 Serialization 6 Package Information 6.1 Package Outlines 6.2 Moisture Sensitivity Level 6.3 WLCSP Handling 6.4 Soldering Information 7 Ordering Information 8 Application Information 8.1 Capacitor Selection 8.2 Inductor Selection