Datasheet BCV61 (Nexperia) - 10
| 制造商 | Nexperia |
| 描述 | NPN general-purpose double transistors |
| 页数 / 页 | 14 / 10 — NXP Semiconductors. BCV61. NPN general-purpose double transistors. … |
| 修订版 | 21012010 |
| 文件格式/大小 | PDF / 262 Kb |
| 文件语言 | 英语 |
NXP Semiconductors. BCV61. NPN general-purpose double transistors. Package outline. Fig 16. Package outline SOT143B
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NXP Semiconductors BCV61 NPN general-purpose double transistors 9. Package outline
3.0 2.8 1.1 1.9 0.9
4 3
0.45 0.15 2.5 1.4 2.1 1.2
1 2
0.88 0.48 0.15 0.78 0.38 0.09 1.7 Dimensions in mm 04-11-16
Fig 16. Package outline SOT143B 10. Packing information Table 8. Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number Package Description Packing quantity 3000 10000
BCV61 SOT143B 4 mm pitch, 8 mm tape and reel -215 -235 BCV61A BCV61B BCV61C [1] For further information and the availability of packing methods, see Section 14. BCV61_4 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 04 — 18 December 2009 9 of 13
Document Outline 1. Product profile 1.1 General description 1.2 Features 1.3 Applications 2. Pinning information 3. Ordering information 4. Marking 5. Limiting values 6. Thermal characteristics 7. Characteristics 8. Test information 9. Package outline 10. Packing information 11. Soldering 12. Revision history 13. Legal information 13.1 Data sheet status 13.2 Definitions 13.3 Disclaimers 13.4 Trademarks 14. Contact information 15. Contents
NXP Semiconductors BCV61 NPN general-purpose double transistors 9. Package outline
3.0 2.8 1.1 1.9 0.9
4 3
0.45 0.15 2.5 1.4 2.1 1.2
1 2
0.88 0.48 0.15 0.78 0.38 0.09 1.7 Dimensions in mm 04-11-16
Fig 16. Package outline SOT143B 10. Packing information Table 8. Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number Package Description Packing quantity 3000 10000
BCV61 SOT143B 4 mm pitch, 8 mm tape and reel -215 -235 BCV61A BCV61B BCV61C [1] For further information and the availability of packing methods, see Section 14. BCV61_4 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 04 — 18 December 2009 9 of 13
Document Outline 1. Product profile 1.1 General description 1.2 Features 1.3 Applications 2. Pinning information 3. Ordering information 4. Marking 5. Limiting values 6. Thermal characteristics 7. Characteristics 8. Test information 9. Package outline 10. Packing information 11. Soldering 12. Revision history 13. Legal information 13.1 Data sheet status 13.2 Definitions 13.3 Disclaimers 13.4 Trademarks 14. Contact information 15. Contents