Datasheet HCPL-181 (Broadcom) - 3
| 制造商 | Broadcom |
| 描述 | Phototransistor Optocoupler SMD Mini-Flat Type |
| 页数 / 页 | 8 / 3 — HCPL-181. Package Outline Drawings. HCPL-181-000E. 2.54. ± 0.25. 3.70 ± … |
| 文件格式/大小 | PDF / 828 Kb |
| 文件语言 | 英语 |
HCPL-181. Package Outline Drawings. HCPL-181-000E. 2.54. ± 0.25. 3.70 ± 0.45. 5.30 ± 0.3. A 181. DATE CODE. Y W W. 2.00 ± 0.2. 0.2 ± 0.05
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HCPL-181
Data Sheet Phototransistor Optocoupler SMD Mini-Flat Type
Package Outline Drawings HCPL-181-000E 2.54 ± 0.25 3.70 ± 0.45 5.30 ± 0.3 A 181 DATE CODE Y W W 2.00 ± 0.2 0.2 ± 0.05 4.40 ± 0.2 LEAD FREE + 0.2 0.40 ± 0.1 0.10 ± 0.1 7.00 – 0.7 RANK DIMENSIONS IN MILLIMETERS. HCPL-181-060E 2.54 ± 0.25 3.70 ± 0.45 5.30 ± 0.3 A 181 V DATE CODE Y W W 2.00 ± 0.2 0.2 ± 0.05 4.40 ± 0.2 LEAD FREE + 0.2 0.40 ± 0.1 0.10 ± 0.1 7.00 – 0.7 RANK DIMENSIONS IN MILLIMETERS. Solder Reflow Temperature Profile 30 seconds 260° C (Peak Temperature)
1. One-time soldering reflow is recommended within the
250° C
condition of temperature and time profile shown at right.
217° C 200° C
2. When using another soldering method such as infrared ray lamp, the temperature may rise partially in the mold
150° C
of the device. Keep the temperature on the package of
Temperature (°C) 60 sec
the device within the condition of Step 1.
NOTE:
Non-halide flux should be used.
25° C 60 ~ 150 sec 90 sec 60 sec Time (sec)
Broadcom AV02-0774EN 3 Document Outline Description Schematic Functional Diagram Features Applications Ordering Information Package Outline Drawings HCPL-181-000E HCPL-181-060E Solder Reflow Temperature Profile Absolute Maximum Ratings (TA = 25°C) Electrical Specifications (TA = 25°C) Test Circuit for Response Time Test Circuit for Frequency Response
HCPL-181
Data Sheet Phototransistor Optocoupler SMD Mini-Flat Type
Package Outline Drawings HCPL-181-000E 2.54 ± 0.25 3.70 ± 0.45 5.30 ± 0.3 A 181 DATE CODE Y W W 2.00 ± 0.2 0.2 ± 0.05 4.40 ± 0.2 LEAD FREE + 0.2 0.40 ± 0.1 0.10 ± 0.1 7.00 – 0.7 RANK DIMENSIONS IN MILLIMETERS. HCPL-181-060E 2.54 ± 0.25 3.70 ± 0.45 5.30 ± 0.3 A 181 V DATE CODE Y W W 2.00 ± 0.2 0.2 ± 0.05 4.40 ± 0.2 LEAD FREE + 0.2 0.40 ± 0.1 0.10 ± 0.1 7.00 – 0.7 RANK DIMENSIONS IN MILLIMETERS. Solder Reflow Temperature Profile 30 seconds 260° C (Peak Temperature)
1. One-time soldering reflow is recommended within the
250° C
condition of temperature and time profile shown at right.
217° C 200° C
2. When using another soldering method such as infrared ray lamp, the temperature may rise partially in the mold
150° C
of the device. Keep the temperature on the package of
Temperature (°C) 60 sec
the device within the condition of Step 1.
NOTE:
Non-halide flux should be used.
25° C 60 ~ 150 sec 90 sec 60 sec Time (sec)
Broadcom AV02-0774EN 3 Document Outline Description Schematic Functional Diagram Features Applications Ordering Information Package Outline Drawings HCPL-181-000E HCPL-181-060E Solder Reflow Temperature Profile Absolute Maximum Ratings (TA = 25°C) Electrical Specifications (TA = 25°C) Test Circuit for Response Time Test Circuit for Frequency Response