Datasheet AD8216 (Analog Devices) - 5
| 制造商 | Analog Devices |
| 描述 | High Bandwidth, Bidirectional 65 V Difference Amplifier |
| 页数 / 页 | 16 / 5 — Data Sheet. AD8216. PIN CONFIGURATION AND FUNCTION DESCRIPTIONS. –IN. … |
| 修订版 | C |
| 文件格式/大小 | PDF / 351 Kb |
| 文件语言 | 英语 |
Data Sheet. AD8216. PIN CONFIGURATION AND FUNCTION DESCRIPTIONS. –IN. +IN. GND. VREF1. VREF2 3. TOP VIEW. (Not to Scale). OUT
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Data Sheet AD8216 PIN CONFIGURATION AND FUNCTION DESCRIPTIONS 1 8 –IN 1 8 +IN 7 2 GND 2 AD8216 7 VREF1 6 VREF2 3 6 TOP VIEW V+ (Not to Scale) NC 4 5 OUT 3 5
002 003
NC = NO CONNECT
07062- 07062- Figure 2. Metallization Diagram Figure 3. Pin Configuration
Table 3. Pin Function Descriptions Pin No. Mnemonic X Y
1 −IN −320 +390 2 GND −357 +14 3 VREF2 −349 −201 4 NC NC NC 5 OUT +348 −325 6 V+ +349 −194 7 VREF1 +349 −26 8 +IN +318 +390 Die size is 1100 µm by 1035 µm. Die thickness is 13 mil. Minimum passivation opening (minimum bond pad size) is 92 µm × 92 µm. Passivation type is 8 kA USG (Oxide) + 10 kA Oxynitride. Bond pad metal composition is 98.5% Al, 1% Si, and 0.5% Cu. Backside potential is V+. Rev. C | Page 5 of 16 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION OUTPUT OFFSET ADJUSTMENT UNIDIRECTIONAL OPERATION GROUND REFERENCED OUTPUT V+ REFERENCED OUTPUT BIDIRECTIONAL OPERATION EXTERNAL REFERENCED OUTPUT SPLITTING THE SUPPLY SPLITTING AN EXTERNAL REFERENCE APPLICATIONS INFORMATION HIGH-SIDE CURRENT SENSE WITH A LOW-SIDE SWITCH HIGH-SIDE CURRENT SENSE WITH A HIGH-SIDE SWITCH OUTLINE DIMENSIONS ORDERING GUIDE AUTOMOTIVE PRODUCTS
002 003
NC = NO CONNECT
07062- 07062- Figure 2. Metallization Diagram Figure 3. Pin Configuration
Table 3. Pin Function Descriptions Pin No. Mnemonic X Y
1 −IN −320 +390 2 GND −357 +14 3 VREF2 −349 −201 4 NC NC NC 5 OUT +348 −325 6 V+ +349 −194 7 VREF1 +349 −26 8 +IN +318 +390 Die size is 1100 µm by 1035 µm. Die thickness is 13 mil. Minimum passivation opening (minimum bond pad size) is 92 µm × 92 µm. Passivation type is 8 kA USG (Oxide) + 10 kA Oxynitride. Bond pad metal composition is 98.5% Al, 1% Si, and 0.5% Cu. Backside potential is V+. Rev. C | Page 5 of 16 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION OUTPUT OFFSET ADJUSTMENT UNIDIRECTIONAL OPERATION GROUND REFERENCED OUTPUT V+ REFERENCED OUTPUT BIDIRECTIONAL OPERATION EXTERNAL REFERENCED OUTPUT SPLITTING THE SUPPLY SPLITTING AN EXTERNAL REFERENCE APPLICATIONS INFORMATION HIGH-SIDE CURRENT SENSE WITH A LOW-SIDE SWITCH HIGH-SIDE CURRENT SENSE WITH A HIGH-SIDE SWITCH OUTLINE DIMENSIONS ORDERING GUIDE AUTOMOTIVE PRODUCTS