Datasheet AD8206 (Analog Devices) - 6
| 制造商 | Analog Devices |
| 描述 | High Common-Mode Voltage, Bidirectional Current Shunt Amplifier |
| 页数 / 页 | 13 / 6 — AD8206. Data Sheet. PIN CONFIGURATION AND FUNCTION DESCRIPTIONS. –IN. … |
| 修订版 | C |
| 文件格式/大小 | PDF / 363 Kb |
| 文件语言 | 英语 |
AD8206. Data Sheet. PIN CONFIGURATION AND FUNCTION DESCRIPTIONS. –IN. +IN. GND. VREF1. TOP VIEW. VREF2 3. (Not to Scale). OUT
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文件文字版本
AD8206 Data Sheet PIN CONFIGURATION AND FUNCTION DESCRIPTIONS –IN 1 8 +IN GND 2 AD8206 7 VREF1 TOP VIEW VREF2 3 6 V+ (Not to Scale) NC 4 5 OUT NC = NO CONNECT
04953-003 Figure 3. Pin Configuration
Table 3. Pin Function Descriptions Pin No. Mnemonic X Y
1 −IN −209 +486 2 GND −447 +34 3 VREF2 −432 −480 4 NC N/A N/A 5 OUT +444 −495 04953-002 Figure 2. Metallization Diagram 6 V+ +444 −227 7 VREF1 +456 +342 8 +IN +207 +486 Die size is 1245 μm by 1400 μm. Die thickness is 13 mil. Minimum passivation opening (minimum bond pad size) is 92 μm × 92 μm. Passivation type is 8KA USG (Oxide) + 10KA Oxynitride. Bond pad metal composition is 99.5% Al and 0.5% Cu. Backside potential is V+. Rev. C | Page 6 of 13 Document Outline FEATURES EXCELLENT AC AND DC PERFORMANCE APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION OUTPUT OFFSET ADJUSTMENT UNIDIRECTIONAL OPERATION GROUND REFERENCED OUTPUT V+ REFERENCED OUTPUT BIDIRECTIONAL OPERATION EXTERNAL REFERENCED OUTPUT SPLITTING THE SUPPLY SPLITTING AN EXTERNAL REFERENCE APPLICATIONS INFORMATION HIGH-SIDE CURRENT SENSE WITH A LOW-SIDE SWITCH HIGH-SIDE CURRENT SENSE WITH A HIGH-SIDE SWITCH OUTLINE DIMENSIONS ORDERING GUIDE AUTOMOTIVE PRODUCTS
04953-003 Figure 3. Pin Configuration
Table 3. Pin Function Descriptions Pin No. Mnemonic X Y
1 −IN −209 +486 2 GND −447 +34 3 VREF2 −432 −480 4 NC N/A N/A 5 OUT +444 −495 04953-002 Figure 2. Metallization Diagram 6 V+ +444 −227 7 VREF1 +456 +342 8 +IN +207 +486 Die size is 1245 μm by 1400 μm. Die thickness is 13 mil. Minimum passivation opening (minimum bond pad size) is 92 μm × 92 μm. Passivation type is 8KA USG (Oxide) + 10KA Oxynitride. Bond pad metal composition is 99.5% Al and 0.5% Cu. Backside potential is V+. Rev. C | Page 6 of 13 Document Outline FEATURES EXCELLENT AC AND DC PERFORMANCE APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION OUTPUT OFFSET ADJUSTMENT UNIDIRECTIONAL OPERATION GROUND REFERENCED OUTPUT V+ REFERENCED OUTPUT BIDIRECTIONAL OPERATION EXTERNAL REFERENCED OUTPUT SPLITTING THE SUPPLY SPLITTING AN EXTERNAL REFERENCE APPLICATIONS INFORMATION HIGH-SIDE CURRENT SENSE WITH A LOW-SIDE SWITCH HIGH-SIDE CURRENT SENSE WITH A HIGH-SIDE SWITCH OUTLINE DIMENSIONS ORDERING GUIDE AUTOMOTIVE PRODUCTS