Data Brief Bora (Teledyne e2v) - 2
| 制造商 | Teledyne e2v |
| 描述 | 1.3MP BORA CMOS Sensor. High Resolution Time of Flight CMOS Image Sensor |
| 页数 / 页 | 2 / 2 — Teledyne e2v's. SENSOR CHARACTERISTICS AND PERFORMANCES. PARAMETER. … |
| 文件格式/大小 | PDF / 189 Kb |
| 文件语言 | 英语 |
Teledyne e2v's. SENSOR CHARACTERISTICS AND PERFORMANCES. PARAMETER. SPECIFICATION. CONDITIONS. teledyne-e2v.com/imaging
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The 3D BORA sensor is a 1.3 million pixel CMOS image sensor, designed with
Teledyne e2v's
proprietary CMOS imaging technology. It is ideal for systems operating at short or mid distances and ranges. In an industry first, it features an optimized multi integration mode (providing excellent performance in low light conditions), together with an electronic global shutter, while still maintaining the accuracy and frame rate performance of existing Time of Flight (ToF) systems. This new sensor provides customers with a number of unique advantages:
»
One single sensor enabling a 1.3MP
»
HDR for lower noise and better accuracy at long distance 2D high definition image and several Long distance range: 3D depth resolutions (0.5m to 5m) or (5m to 50m) Binning allows VGA and QVGA 3D
»
3D detection from fast moving objects depth map Up to 170fps (2D) State-of-the-art accuracy and 2D vision temporal noise ROI on chip for higher frame rate
»
Captures a large field of view
»
Combination of several 3D features 1.3MP 2D and 3D image ROI and HDR ROI on chip and binning off chip ROI and binning HDR and binning
SENSOR CHARACTERISTICS AND PERFORMANCES PARAMETER SPECIFICATION CONDITIONS
Sensor resolution – pixels 1,280 (H) x 1,024 (V) Pixel size – μm 10 Global shutter 5T Max frame rate – fps > 170 Full resolution, 10 bits Bit depth – bit 8/10/12 Full well capacity – ke- > 30 Dark current PHD – e-/s < 45 @25°C Dark current SN – e-/s < 1,250 @25°C Noise – e- rms 35 typical Global shutter Quantum efficiency – e-/photon > 40% @850 nm, multi integration mode MTF – lp/mm > 50 @Nyquist, @850 nm Image lag – e- < 1 @10% FWC, multi integration mode DSNU – % < 1 Multi integration mode Non linearity – % +/- 1.5 5–90 FWC Dynamic range – dB > 60 Linear, multi integration mode Teledyne e2v All Rights Reserved 01.2019 V4
teledyne-e2v.com/imaging
Copyright © 2019
Teledyne e2v's
proprietary CMOS imaging technology. It is ideal for systems operating at short or mid distances and ranges. In an industry first, it features an optimized multi integration mode (providing excellent performance in low light conditions), together with an electronic global shutter, while still maintaining the accuracy and frame rate performance of existing Time of Flight (ToF) systems. This new sensor provides customers with a number of unique advantages:
»
One single sensor enabling a 1.3MP
»
HDR for lower noise and better accuracy at long distance 2D high definition image and several Long distance range: 3D depth resolutions (0.5m to 5m) or (5m to 50m) Binning allows VGA and QVGA 3D
»
3D detection from fast moving objects depth map Up to 170fps (2D) State-of-the-art accuracy and 2D vision temporal noise ROI on chip for higher frame rate
»
Captures a large field of view
»
Combination of several 3D features 1.3MP 2D and 3D image ROI and HDR ROI on chip and binning off chip ROI and binning HDR and binning
SENSOR CHARACTERISTICS AND PERFORMANCES PARAMETER SPECIFICATION CONDITIONS
Sensor resolution – pixels 1,280 (H) x 1,024 (V) Pixel size – μm 10 Global shutter 5T Max frame rate – fps > 170 Full resolution, 10 bits Bit depth – bit 8/10/12 Full well capacity – ke- > 30 Dark current PHD – e-/s < 45 @25°C Dark current SN – e-/s < 1,250 @25°C Noise – e- rms 35 typical Global shutter Quantum efficiency – e-/photon > 40% @850 nm, multi integration mode MTF – lp/mm > 50 @Nyquist, @850 nm Image lag – e- < 1 @10% FWC, multi integration mode DSNU – % < 1 Multi integration mode Non linearity – % +/- 1.5 5–90 FWC Dynamic range – dB > 60 Linear, multi integration mode Teledyne e2v All Rights Reserved 01.2019 V4
teledyne-e2v.com/imaging
Copyright © 2019