Datasheet AD8421-KGD (Analog Devices) - 8
| 制造商 | Analog Devices |
| 描述 | 3 nV /√Hz, Low Power Instrumentation Amplifier |
| 页数 / 页 | 8 / 8 — AD8421-KGD. Known Good Die. OUTLINE DIMENSIONS. 1.555. 0.5482. 0.6358. … |
| 文件格式/大小 | PDF / 248 Kb |
| 文件语言 | 英语 |
AD8421-KGD. Known Good Die. OUTLINE DIMENSIONS. 1.555. 0.5482. 0.6358. 0.3048. 0.512. 0.929. 0.376. 2.125. 0.066. 0.241. 0.287. 0.1916. 0.112. 0.3595
该数据表的模型线
文件文字版本
AD8421-KGD Known Good Die OUTLINE DIMENSIONS 1.555 0.5482 0.6358 0.3048 0.512 8 0.929 1 2A 0.376 2.125 0.066 0.241 2B 3A 0.287 0.1916 0.112 7B 0.3595 0.422 3B 7A 4 0.5658 0.070 × 0.150 6 (Pads 2A-3B, Pad 6 0.841 and 7B) 5 TOP VIEW SIDE VIEW 0.070 × 0.070 (CIRCUIT SIDE) (Pad 1, 4-5, Pad 7A A 0.502 and Pad 8) 2018- 0.5664 11- 03-
Figure 3. 8-Pad Bare Die [CHIP] (C-8-15) Dimensions shown in millimeters
DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS Table 4. Die Specifications Parameter Value Unit
Scribe Line Width 90 × 90 μm Die Size 1555 × 2125 μm Thickness 304.8 μm Backside None1 Not applicable Passivation Doped oxide/silicon (Si)/Nitrogen (N) Not applicable Bond Pads (Minimum) 70 × 70 μm Bond Pad Composition 1.0 Aluminum (Al)/Si, 0.5 Copper (Cu) % 1 If connecting the backside to a voltage potential, tie the backside to −VS. Otherwise, leave the backside floating.
Table 5. Assembly Recommendations Assembly Component Recommendation
Die Attach No special requirements Bonding Method Gold ball or aluminum wedge Bonding Sequence Any
ORDERING GUIDE Model1 Temperature Range Package Description Package Option
AD8421-KGD-WP −40°C to +85°C 8-Pad Bare Die [CHIP], Waffle Pack C-8-15 1 The AD8421-KGD-WP is a RoHS compliant part.
©2019 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D20316-0-9/19(0)
Rev. 0 | Page 8 of 8 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS OUTLINE DIMENSIONS DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS ORDERING GUIDE
Figure 3. 8-Pad Bare Die [CHIP] (C-8-15) Dimensions shown in millimeters
DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS Table 4. Die Specifications Parameter Value Unit
Scribe Line Width 90 × 90 μm Die Size 1555 × 2125 μm Thickness 304.8 μm Backside None1 Not applicable Passivation Doped oxide/silicon (Si)/Nitrogen (N) Not applicable Bond Pads (Minimum) 70 × 70 μm Bond Pad Composition 1.0 Aluminum (Al)/Si, 0.5 Copper (Cu) % 1 If connecting the backside to a voltage potential, tie the backside to −VS. Otherwise, leave the backside floating.
Table 5. Assembly Recommendations Assembly Component Recommendation
Die Attach No special requirements Bonding Method Gold ball or aluminum wedge Bonding Sequence Any
ORDERING GUIDE Model1 Temperature Range Package Description Package Option
AD8421-KGD-WP −40°C to +85°C 8-Pad Bare Die [CHIP], Waffle Pack C-8-15 1 The AD8421-KGD-WP is a RoHS compliant part.
©2019 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D20316-0-9/19(0)
Rev. 0 | Page 8 of 8 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS OUTLINE DIMENSIONS DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS ORDERING GUIDE