Datasheet IX4351NE (IXYS) - 6
| 制造商 | IXYS |
| 描述 | 9A Low Side SiC MOSFET & IGBT Driver |
| 页数 / 页 | 12 / 6 — IX4351NE. Parameter. Conditions. Symbol. Minimum. Typical. Maximum. … |
| 文件格式/大小 | PDF / 334 Kb |
| 文件语言 | 英语 |
IX4351NE. Parameter. Conditions. Symbol. Minimum. Typical. Maximum. Units. 1.6 Thermal Characteristics. Rating. www.ixysic.com
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IX4351NE
NTEGRATED CIRCUITS DIVISION 1.5.8 Soft Shutdown Section
Parameter Conditions Symbol Minimum Typical Maximum Units
Soft Shutdown Threshold Voltage - VTH,INSOFT 2.3 2.6 3 V Soft Shutdown Hysteresis - VINSOFTHYS - 0.4 - V OUTSOFT Peak Sink Current - IOUTSOFT - 900 - mA OUTSOFT On-Resistance IOUTSOFT=100mA ROUTSOFT - 6 15 DESAT Detect to OUTSOFT Delay - tOUTSOFTDLY - 125 - ns 1.5.9 Gate Driver Section
Parameter Conditions Symbol Minimum Typical Maximum Units
High Level Output Voltage IOUTSRC=-100mA VOUTSRC VDD- 0.25 - - V Low Level Output Voltage IOUTSNK=100mA VOUTSNK - - 0.25 V OUTSRC ON-Resistance IOUTSRC=-100mA ROUTSRC - 1.16 2 OUTSNK ON-Resistance IOUTSNK=100mA ROUTSNK - 0.8 1.5 Turn-On Propagation Delay Time CLOAD=1nF tON - 75 125 ns Turn-Off Propagation Delay Time CLOAD=1nF tOFF - 65 125 ns Turn-On Rise Time CLOAD=1nF tR - 10 20 ns Turn-Off Fall Time CLOAD=1nF tF - 10 20 ns
1.6 Thermal Characteristics Parameter Symbol Rating Units
Thermal Impedance, Junction to Ambient JA 60 °C/W Thermal Impedance, Junction to Case JC 28 °C/W 6
www.ixysic.com
R02 Document Outline Features Applications Description Ordering Information 1 Specifications 1.1 Package Pinout 1.2 Pin Description 1.3 Absolute Maximum Ratings 1.4 Recommended Operating Conditions 1.5 Electrical Characteristics 1.6 Thermal Characteristics 2 Performance Data 3 Performance Data (Cont.) 4 Functional Description 4.1 Logic Input (IN) 4.2 Gate Drive Outputs (OUTSRC and OUTSNK) 4.3 Internal 4.6V Regulator (VREG) 4.4 Negative VSS Charge Pump Regulator 4.5 Desaturation Detection and Protection 4.6 Thermal Shutdown 4.7 FAULT Output 5 Manufacturing Information 5.1 Moisture Sensitivity 5.2 ESD Sensitivity 5.3 Soldering Profile 5.4 Board Wash 5.5 Mechanical Dimensions
IX4351NE
NTEGRATED CIRCUITS DIVISION 1.5.8 Soft Shutdown Section
Parameter Conditions Symbol Minimum Typical Maximum Units
Soft Shutdown Threshold Voltage - VTH,INSOFT 2.3 2.6 3 V Soft Shutdown Hysteresis - VINSOFTHYS - 0.4 - V OUTSOFT Peak Sink Current - IOUTSOFT - 900 - mA OUTSOFT On-Resistance IOUTSOFT=100mA ROUTSOFT - 6 15 DESAT Detect to OUTSOFT Delay - tOUTSOFTDLY - 125 - ns 1.5.9 Gate Driver Section
Parameter Conditions Symbol Minimum Typical Maximum Units
High Level Output Voltage IOUTSRC=-100mA VOUTSRC VDD- 0.25 - - V Low Level Output Voltage IOUTSNK=100mA VOUTSNK - - 0.25 V OUTSRC ON-Resistance IOUTSRC=-100mA ROUTSRC - 1.16 2 OUTSNK ON-Resistance IOUTSNK=100mA ROUTSNK - 0.8 1.5 Turn-On Propagation Delay Time CLOAD=1nF tON - 75 125 ns Turn-Off Propagation Delay Time CLOAD=1nF tOFF - 65 125 ns Turn-On Rise Time CLOAD=1nF tR - 10 20 ns Turn-Off Fall Time CLOAD=1nF tF - 10 20 ns
1.6 Thermal Characteristics Parameter Symbol Rating Units
Thermal Impedance, Junction to Ambient JA 60 °C/W Thermal Impedance, Junction to Case JC 28 °C/W 6
www.ixysic.com
R02 Document Outline Features Applications Description Ordering Information 1 Specifications 1.1 Package Pinout 1.2 Pin Description 1.3 Absolute Maximum Ratings 1.4 Recommended Operating Conditions 1.5 Electrical Characteristics 1.6 Thermal Characteristics 2 Performance Data 3 Performance Data (Cont.) 4 Functional Description 4.1 Logic Input (IN) 4.2 Gate Drive Outputs (OUTSRC and OUTSNK) 4.3 Internal 4.6V Regulator (VREG) 4.4 Negative VSS Charge Pump Regulator 4.5 Desaturation Detection and Protection 4.6 Thermal Shutdown 4.7 FAULT Output 5 Manufacturing Information 5.1 Moisture Sensitivity 5.2 ESD Sensitivity 5.3 Soldering Profile 5.4 Board Wash 5.5 Mechanical Dimensions