Datasheet LND150, LND250 (Microchip) - 7

制造商Microchip
描述N-Channel Depletion-Mode DMOS FETs
页数 / 页16 / 7 — LND150/LND250. 4.0. FUNCTIONAL DESCRIPTION. VDD. INPUT. Pulse. Generator. …
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LND150/LND250. 4.0. FUNCTIONAL DESCRIPTION. VDD. INPUT. Pulse. Generator. -10V. OUTPUT. D.U.T. FIGURE 4-1:. TABLE 4-1:. PRODUCT SUMMARY. DS(ON)

LND150/LND250 4.0 FUNCTIONAL DESCRIPTION VDD INPUT Pulse Generator -10V OUTPUT D.U.T FIGURE 4-1: TABLE 4-1: PRODUCT SUMMARY DS(ON)

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LND150/LND250 4.0 FUNCTIONAL DESCRIPTION
Figure 4-1 illustrates the switching waveforms and test circuit for LND150/LND250.
0V
90%
VDD INPUT Pulse
R 10%
Generator
L
-10V OUTPUT
t t (ON) (OFF) RGEN t t t t d(ON) r d(OFF) f
VDD INPUT D.U.T.
10% 10%
OUTPUT 0V
90% 90%
FIGURE 4-1:
Switching Waveforms and Test Circuit.
TABLE 4-1: PRODUCT SUMMARY R I BV DS(ON) DSS(ON) DSX/BVDGX (Maximum) (Minimum) (V) (Ω) (mA)
500 1000 1  2018 Microchip Technology Inc. DS20005454A-page 7 Document Outline N-Channel Depletion-Mode DMOS FETs Features Applications General Description Package Types 1.0 Electrical Characteristics Absolute Maximum Ratings† DC Electrical Characteristics AC Electrical Characteristics Temperature Specifications Thermal Characteristics 2.0 Typical Performance Curves FIGURE 2-1: Output Characteristics. FIGURE 2-2: Transconductance vs. Drain Current. FIGURE 2-3: Maximum Rated Safe Operating Area. FIGURE 2-4: Saturation Characteristics. FIGURE 2-5: Power Dissipation vs. Ambient Temperature. FIGURE 2-6: Thermal Response Characteristics. FIGURE 2-7: BVDSS Variation with Temperature. FIGURE 2-8: Transfer Characteristics. FIGURE 2-9: Capacitance vs. Drain-to- Source Voltage. FIGURE 2-10: Drain Current vs. RSOURCE. FIGURE 2-11: VGS(OFF) and RDS Variation with Temperature. FIGURE 2-12: Gate Drive Dynamic Characteristics. 3.0 Pin Description TABLE 3-1: TO-92 Pin Function Table TABLE 3-2: SOT-23 Pin Function Table TABLE 3-3: SOT-89 Pin Function Table 4.0 Functional Description FIGURE 4-1: Switching Waveforms and Test Circuit. TABLE 4-1: Product Summary 5.0 Packaging Information 5.1 Package Marking Information Appendix A: Revision History Revision A (August 2018) Product Identification System Worldwide Sales and Service