Datasheet VL53L3CX (STMicroelectronics) - 4
| 制造商 | STMicroelectronics |
| 描述 | Time-of-Flight ranging sensor with multi target detection |
| 页数 / 页 | 35 / 4 — VL53L3CX. Device pinout. 1.3. Figure 2. Device pinout (bottom view). … |
| 文件格式/大小 | PDF / 1.3 Mb |
| 文件语言 | 英语 |
VL53L3CX. Device pinout. 1.3. Figure 2. Device pinout (bottom view). Table 2. Device pin description. Pin number. Signal name
该数据表的模型线
文件文字版本
VL53L3CX Device pinout 1.3 Device pinout
The figure below shows the pinout of the device.
Figure 2. Device pinout (bottom view)
GND3 GPIO1
7 6 5
XSHUT DNC
8 4
GND2 SDA
9 3
GND SCL
10 2
AVSSVCSEL AVDD
11 12 1
AVDDVCSEL GND4
Table 2. Device pin description Pin number Signal name Signal type Signal description
1 AVDDVCSEL Supply VCSEL supply, to be connected to main supply 2 AVSSVCSEL VCSEL ground, to be connected to main ground 3 GND Ground To be connected to main ground 4 GND2 To be connected to main ground 5 XSHUT Digital input Xshutdown pin, active low 6 GND3 Ground To be connected to main ground 7 GPIO1 Digital output Interrupt output. Open drain output 8 DNC Digital input Do not connect, must be left floating 9 SDA Digital input/output I2C serial data 10 SCL Digital input I2C serial clock input 11 AVDD Supply Supply, to be connected to main supply 12 GND4 Ground To be connected to main ground Note: AVSSVCSEL and GND are ground pins and can be connected together in the application schematics. Note: GND2, GND3, and GND4 are standard pins that we force to the ground domain in the application schematics to avoid possible instabilities if set to other states.
DS13204
-
Rev 2 page 4/35
Document Outline Cover image Features Application Description 1 Product overview 1.1 Technical specification 1.2 System block diagram 1.3 Device pinout 1.4 Application schematic 2 Functional description 2.1 System functional description 2.2 State machine description 2.3 Customer manufacturing calibration flow 2.4 Device programming and control 2.5 Ranging mode description 2.6 Digital processing 2.7 Reading the results 2.8 Power sequence 2.8.1 Power up and boot sequence 2.9 Ranging sequence 2.10 Handshake management 3 Control interface 3.1 I2C interface - timing characteristics 3.2 I2C interface - reference registers 4 Electrical characteristics 4.1 Absolute maximum ratings 4.2 Recommended operating conditions 4.3 Electrostatic discharge 4.4 Current consumption 4.5 Digital input and output 5 Ranging performances 5.1 Measurement conditions 5.2 Minimum ranging distance 5.3 Maximum ranging distance 5.4 Ranging accuracy 5.5 Ranging drift with temperature 6 Outline drawings 7 Laser safety considerations 8 Packaging and labeling 8.1 Product marking 8.2 Inner box labeling 8.3 Packing 8.4 Tape and outline drawing 8.5 Lead-free solder reflow process 8.6 Handling and storage precautions 8.6.1 Shock precaution 8.6.2 Part handling 8.6.3 Compression force 8.6.4 Moisture sensitivity level 8.7 Storage temperature conditions 9 Package information 10 Ordering information 11 Acronyms and abbreviations Revision history Contents
The figure below shows the pinout of the device.
Figure 2. Device pinout (bottom view)
GND3 GPIO1
7 6 5
XSHUT DNC
8 4
GND2 SDA
9 3
GND SCL
10 2
AVSSVCSEL AVDD
11 12 1
AVDDVCSEL GND4
Table 2. Device pin description Pin number Signal name Signal type Signal description
1 AVDDVCSEL Supply VCSEL supply, to be connected to main supply 2 AVSSVCSEL VCSEL ground, to be connected to main ground 3 GND Ground To be connected to main ground 4 GND2 To be connected to main ground 5 XSHUT Digital input Xshutdown pin, active low 6 GND3 Ground To be connected to main ground 7 GPIO1 Digital output Interrupt output. Open drain output 8 DNC Digital input Do not connect, must be left floating 9 SDA Digital input/output I2C serial data 10 SCL Digital input I2C serial clock input 11 AVDD Supply Supply, to be connected to main supply 12 GND4 Ground To be connected to main ground Note: AVSSVCSEL and GND are ground pins and can be connected together in the application schematics. Note: GND2, GND3, and GND4 are standard pins that we force to the ground domain in the application schematics to avoid possible instabilities if set to other states.
DS13204
-
Rev 2 page 4/35
Document Outline Cover image Features Application Description 1 Product overview 1.1 Technical specification 1.2 System block diagram 1.3 Device pinout 1.4 Application schematic 2 Functional description 2.1 System functional description 2.2 State machine description 2.3 Customer manufacturing calibration flow 2.4 Device programming and control 2.5 Ranging mode description 2.6 Digital processing 2.7 Reading the results 2.8 Power sequence 2.8.1 Power up and boot sequence 2.9 Ranging sequence 2.10 Handshake management 3 Control interface 3.1 I2C interface - timing characteristics 3.2 I2C interface - reference registers 4 Electrical characteristics 4.1 Absolute maximum ratings 4.2 Recommended operating conditions 4.3 Electrostatic discharge 4.4 Current consumption 4.5 Digital input and output 5 Ranging performances 5.1 Measurement conditions 5.2 Minimum ranging distance 5.3 Maximum ranging distance 5.4 Ranging accuracy 5.5 Ranging drift with temperature 6 Outline drawings 7 Laser safety considerations 8 Packaging and labeling 8.1 Product marking 8.2 Inner box labeling 8.3 Packing 8.4 Tape and outline drawing 8.5 Lead-free solder reflow process 8.6 Handling and storage precautions 8.6.1 Shock precaution 8.6.2 Part handling 8.6.3 Compression force 8.6.4 Moisture sensitivity level 8.7 Storage temperature conditions 9 Package information 10 Ordering information 11 Acronyms and abbreviations Revision history Contents