Datasheet VL53L3CX (STMicroelectronics) - 5
| 制造商 | STMicroelectronics |
| 描述 | Time-of-Flight ranging sensor with multi target detection |
| 页数 / 页 | 35 / 5 — VL53L3CX. Application schematic. 1.4. Figure 3. VL53L3CX schematic |
| 文件格式/大小 | PDF / 1.3 Mb |
| 文件语言 | 英语 |
VL53L3CX. Application schematic. 1.4. Figure 3. VL53L3CX schematic
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文件文字版本
VL53L3CX Application schematic 1.4 Application schematic
The figure below shows the application schematic of the device.
Figure 3. VL53L3CX schematic
IOVDD AVDD 5 1 XSHUT AVDDVCSEL 7 11 GPIO1 AVDD HOST Caps as close as possible 9 2 SDA AVSSVCSEL to VL53L3CX 100nF 4.7µF Rserial 10 3 SCL GND Rserial 8 4 DNC GND2 6 GND3 Recommended for hardware interrupt 12
VL53L3CX
GND4 Note: Capacitors on the external supply AVDD should be placed as close as possible to the AVDDVCSEL and AVSSVCSEL module pins. Note: External pull-up resistor values can be found in I2C-bus specification. Pull-ups are typically fitted only once per bus, near the host. For suggested values see tables below. Note: XSHUT pin must always be driven to avoid leakage current. A pullup is needed if the host state is not known. XSHUT is needed to use HW standby mode (no I2C communication). Note: XSHUT and GPIO1 pull up recommended values are 10 kOhms. GPIO1 should be left unconnected if not used. The tables below show recommended values for pull-up and series resistors for an AVDD of 1.8 V to 2.8 V in I2C Fast mode (up to 400 kHz) and Fast mode plus (up to 1 MHz).
Table 3. Suggested pull-up and series resistors for I2C Fast mode I2C load capacitance (CL) Pull-up resistor (Ohms) Series resistor (Ohms)
CL ≤ 90 pF 3.6 k 0 90 pF < CL ≤ 140 pF 2.4 k 0 140 pF < CL ≤ 270 pF 1.2 k 0 270 pF < CL ≤ 400 pF 0.8 k 0
Table 4. Suggested pull-up and series resistors for I2C Fast mode plus I2C load capacitance (CL) Pull up resistor (Ohms) Series resistor (Ohms)
CL ≤ 90 pF 1.5 k 100 90 pF < CL ≤ 140 pF 1 k 50 140 pF < CL ≤ 270 pF 0.5 k 50 270 pF < CL ≤ 400 pF 0.3 k 50 Note: For each bus line, CL is measured in the application PCB by the customer.
DS13204
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Rev 2 page 5/35
Document Outline Cover image Features Application Description 1 Product overview 1.1 Technical specification 1.2 System block diagram 1.3 Device pinout 1.4 Application schematic 2 Functional description 2.1 System functional description 2.2 State machine description 2.3 Customer manufacturing calibration flow 2.4 Device programming and control 2.5 Ranging mode description 2.6 Digital processing 2.7 Reading the results 2.8 Power sequence 2.8.1 Power up and boot sequence 2.9 Ranging sequence 2.10 Handshake management 3 Control interface 3.1 I2C interface - timing characteristics 3.2 I2C interface - reference registers 4 Electrical characteristics 4.1 Absolute maximum ratings 4.2 Recommended operating conditions 4.3 Electrostatic discharge 4.4 Current consumption 4.5 Digital input and output 5 Ranging performances 5.1 Measurement conditions 5.2 Minimum ranging distance 5.3 Maximum ranging distance 5.4 Ranging accuracy 5.5 Ranging drift with temperature 6 Outline drawings 7 Laser safety considerations 8 Packaging and labeling 8.1 Product marking 8.2 Inner box labeling 8.3 Packing 8.4 Tape and outline drawing 8.5 Lead-free solder reflow process 8.6 Handling and storage precautions 8.6.1 Shock precaution 8.6.2 Part handling 8.6.3 Compression force 8.6.4 Moisture sensitivity level 8.7 Storage temperature conditions 9 Package information 10 Ordering information 11 Acronyms and abbreviations Revision history Contents
The figure below shows the application schematic of the device.
Figure 3. VL53L3CX schematic
IOVDD AVDD 5 1 XSHUT AVDDVCSEL 7 11 GPIO1 AVDD HOST Caps as close as possible 9 2 SDA AVSSVCSEL to VL53L3CX 100nF 4.7µF Rserial 10 3 SCL GND Rserial 8 4 DNC GND2 6 GND3 Recommended for hardware interrupt 12
VL53L3CX
GND4 Note: Capacitors on the external supply AVDD should be placed as close as possible to the AVDDVCSEL and AVSSVCSEL module pins. Note: External pull-up resistor values can be found in I2C-bus specification. Pull-ups are typically fitted only once per bus, near the host. For suggested values see tables below. Note: XSHUT pin must always be driven to avoid leakage current. A pullup is needed if the host state is not known. XSHUT is needed to use HW standby mode (no I2C communication). Note: XSHUT and GPIO1 pull up recommended values are 10 kOhms. GPIO1 should be left unconnected if not used. The tables below show recommended values for pull-up and series resistors for an AVDD of 1.8 V to 2.8 V in I2C Fast mode (up to 400 kHz) and Fast mode plus (up to 1 MHz).
Table 3. Suggested pull-up and series resistors for I2C Fast mode I2C load capacitance (CL) Pull-up resistor (Ohms) Series resistor (Ohms)
CL ≤ 90 pF 3.6 k 0 90 pF < CL ≤ 140 pF 2.4 k 0 140 pF < CL ≤ 270 pF 1.2 k 0 270 pF < CL ≤ 400 pF 0.8 k 0
Table 4. Suggested pull-up and series resistors for I2C Fast mode plus I2C load capacitance (CL) Pull up resistor (Ohms) Series resistor (Ohms)
CL ≤ 90 pF 1.5 k 100 90 pF < CL ≤ 140 pF 1 k 50 140 pF < CL ≤ 270 pF 0.5 k 50 270 pF < CL ≤ 400 pF 0.3 k 50 Note: For each bus line, CL is measured in the application PCB by the customer.
DS13204
-
Rev 2 page 5/35
Document Outline Cover image Features Application Description 1 Product overview 1.1 Technical specification 1.2 System block diagram 1.3 Device pinout 1.4 Application schematic 2 Functional description 2.1 System functional description 2.2 State machine description 2.3 Customer manufacturing calibration flow 2.4 Device programming and control 2.5 Ranging mode description 2.6 Digital processing 2.7 Reading the results 2.8 Power sequence 2.8.1 Power up and boot sequence 2.9 Ranging sequence 2.10 Handshake management 3 Control interface 3.1 I2C interface - timing characteristics 3.2 I2C interface - reference registers 4 Electrical characteristics 4.1 Absolute maximum ratings 4.2 Recommended operating conditions 4.3 Electrostatic discharge 4.4 Current consumption 4.5 Digital input and output 5 Ranging performances 5.1 Measurement conditions 5.2 Minimum ranging distance 5.3 Maximum ranging distance 5.4 Ranging accuracy 5.5 Ranging drift with temperature 6 Outline drawings 7 Laser safety considerations 8 Packaging and labeling 8.1 Product marking 8.2 Inner box labeling 8.3 Packing 8.4 Tape and outline drawing 8.5 Lead-free solder reflow process 8.6 Handling and storage precautions 8.6.1 Shock precaution 8.6.2 Part handling 8.6.3 Compression force 8.6.4 Moisture sensitivity level 8.7 Storage temperature conditions 9 Package information 10 Ordering information 11 Acronyms and abbreviations Revision history Contents