Datasheet ATBTLC1000-MR (Microchip) - 6
| 制造商 | Microchip |
| 描述 | Ultra-Low Power BLE Module |
| 页数 / 页 | 44 / 6 — ATBTLC1000-MR110CA. Package Information. Table 2-1. ATBTLC1000-MR110CA … |
| 文件格式/大小 | PDF / 994 Kb |
| 文件语言 | 英语 |
ATBTLC1000-MR110CA. Package Information. Table 2-1. ATBTLC1000-MR110CA Package Information. Parameter. Value. Units. Tolerance
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ATBTLC1000-MR110CA Package Information 2. Package Information
The following table provides the ATBTLC1000-MR110CA package information.
Table 2-1. ATBTLC1000-MR110CA Package Information Parameter Value Units Tolerance
Package size 12.700 x 20.152 mm - Pad count 25 - - Total thickness 2.0874 ±0.078 Tolerance (maximum pad pitch) 0.9002 - mm Pad width 0.600 - Exposed paddle pad size 2.7 x 2.7 -
Note:
For details on Package drawing, refer to 9. ATBTLC1000-MR110CA Module Outline Drawing. © 2019 Microchip Technology Inc.
Datasheet
DS70005393A-page 6 Document Outline Introduction Features Table of Contents 1. Ordering Information 2. Package Information 3. Block Diagram 4. Pinout Information 4.1. Pin Description 5. Device States 5.1. Description of Device States 5.2. Controlling the Device States 6. Host Microcontroller Interface 7. Clocking 7.1. 26 MHz Crystal Oscillator (XO) 7.2. 32.768 kHz RTC Crystal Oscillator (RTC XO) 7.2.1. General Information 7.2.2. RTC XO Design and Interface Specification 7.2.3. RTC Characterization with Gm Code Variation 7.2.4. RTC Characterization with Supply Variation and Temperature 7.3. 2 MHz and 26 MHz Integrated RC Oscillators 8. Electrical Characteristics 8.1. Absolute Maximum Ratings 8.2. Recommended Operating Conditions 8.3. Current Consumption in Device States 8.4. Receiver Performance 8.5. Transmitter Performance 9. ATBTLC1000-MR110CA Module Outline Drawing 10. ATBTLC1000-MR110CA Reference Schematic 10.1. Reference Schematics 11. Placement and Routing Guidelines 11.1. Power and Ground 11.2. Interferers 12. Reflow Profile Information 12.1. Storage Condition 12.1.1. Moisture Barrier Bag Before Opening 12.1.2. Moisture Barrier Bag Open 12.2. Stencil Design 12.3. Soldering and Reflow Condition 12.3.1. Reflow Oven 12.4. Baking Conditions 12.5. Module Assembly Considerations 13. Regulatory Approval 13.1. United States (FCC) 13.1.1. Labeling And User Information Requirements 13.1.2. RF Exposure 13.1.3. Helpful Websites 13.2. Canada (ISED) 13.2.1. Labeling and User Information Requirements 13.2.2. RF Exposure 13.2.3. Helpful Websites 13.3. Japan 13.3.1. Labeling and User Information Requirements 13.3.2. Helpful Websites 13.4. Other Regulatory Information 14. Reference Documentation 15. Document Revision History The Microchip Web Site Customer Change Notification Service Customer Support Microchip Devices Code Protection Feature Legal Notice Trademarks Quality Management System Certified by DNV Worldwide Sales and Service
ATBTLC1000-MR110CA Package Information 2. Package Information
The following table provides the ATBTLC1000-MR110CA package information.
Table 2-1. ATBTLC1000-MR110CA Package Information Parameter Value Units Tolerance
Package size 12.700 x 20.152 mm - Pad count 25 - - Total thickness 2.0874 ±0.078 Tolerance (maximum pad pitch) 0.9002 - mm Pad width 0.600 - Exposed paddle pad size 2.7 x 2.7 -
Note:
For details on Package drawing, refer to 9. ATBTLC1000-MR110CA Module Outline Drawing. © 2019 Microchip Technology Inc.
Datasheet
DS70005393A-page 6 Document Outline Introduction Features Table of Contents 1. Ordering Information 2. Package Information 3. Block Diagram 4. Pinout Information 4.1. Pin Description 5. Device States 5.1. Description of Device States 5.2. Controlling the Device States 6. Host Microcontroller Interface 7. Clocking 7.1. 26 MHz Crystal Oscillator (XO) 7.2. 32.768 kHz RTC Crystal Oscillator (RTC XO) 7.2.1. General Information 7.2.2. RTC XO Design and Interface Specification 7.2.3. RTC Characterization with Gm Code Variation 7.2.4. RTC Characterization with Supply Variation and Temperature 7.3. 2 MHz and 26 MHz Integrated RC Oscillators 8. Electrical Characteristics 8.1. Absolute Maximum Ratings 8.2. Recommended Operating Conditions 8.3. Current Consumption in Device States 8.4. Receiver Performance 8.5. Transmitter Performance 9. ATBTLC1000-MR110CA Module Outline Drawing 10. ATBTLC1000-MR110CA Reference Schematic 10.1. Reference Schematics 11. Placement and Routing Guidelines 11.1. Power and Ground 11.2. Interferers 12. Reflow Profile Information 12.1. Storage Condition 12.1.1. Moisture Barrier Bag Before Opening 12.1.2. Moisture Barrier Bag Open 12.2. Stencil Design 12.3. Soldering and Reflow Condition 12.3.1. Reflow Oven 12.4. Baking Conditions 12.5. Module Assembly Considerations 13. Regulatory Approval 13.1. United States (FCC) 13.1.1. Labeling And User Information Requirements 13.1.2. RF Exposure 13.1.3. Helpful Websites 13.2. Canada (ISED) 13.2.1. Labeling and User Information Requirements 13.2.2. RF Exposure 13.2.3. Helpful Websites 13.3. Japan 13.3.1. Labeling and User Information Requirements 13.3.2. Helpful Websites 13.4. Other Regulatory Information 14. Reference Documentation 15. Document Revision History The Microchip Web Site Customer Change Notification Service Customer Support Microchip Devices Code Protection Feature Legal Notice Trademarks Quality Management System Certified by DNV Worldwide Sales and Service