Datasheet ATBTLC1000-MR (Microchip) - 10

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ATBTLC1000-MR110CA Pinout Information ...continued ATBTLC1000- Pin Name Pin Type Description/Default Function MR110CA Pin No.
SPI MISO/SPI Flash RXD Default function (6-wire mode): UART2_RXD 14 LP_GPIO_13 Digital I/O Alternate (4-wire mode): GPIO with Programmable Pull Up/Down GPIO with Programmable Pull Up/ Down. 15 GPIO_MS1 Mixed Signal I/O Default function in BluSDK: Host wake up2 16 GPIO_MS2 Mixed Signal I/O GPIO with Programmable Pull Up/Down Can be used to control the state of PMU. High-level enables the module; low-level places module in Power-Down mode. 17 Chip_EN Digital Input Connect to a host output that defaults low at power-up. If the host output is tri-stated, add a 1 MOhm pull-down resistor to ensure a low level at power-up Crystal pin or External clock supply, see 7.2 18 RTC_CLKP Analog 32.768 kHz RTC Crystal Oscillator (RTC XO) Crystal pin, see 7.2 32.768 kHz RTC Crystal 19 RTC_CLKN Analog Oscillator (RTC XO) Always On Digital I/O, Can be used to wake up the device from 20 AO_GPIO_0 Programmable Ultra_Low_Power mode by the host MCU Pull Up/Down 21 LP_GPIO_16 Digital I/O GPIO with Programmable Pull Up/Down Power supply pin for the I/O pins. Can be 22 VDDIO Power supply less than or equal to voltage supplied at VBAT 23 LP_GPIO_18 Digital I/O GPIO with Programmable Pull Up/Down 24 GND Ground - Exposed paddle must be soldered to system 25 Paddle Ground ground
Note: 
1. These GPIO pads are high-drive pads. 2. For more details, see section 6. Host Microcontroller Interface. © 2019 Microchip Technology Inc.
Datasheet
DS70005393A-page 10 Document Outline Introduction Features Table of Contents 1. Ordering Information 2. Package Information 3. Block Diagram 4. Pinout Information 4.1. Pin Description 5. Device States 5.1. Description of Device States 5.2. Controlling the Device States 6. Host Microcontroller Interface 7. Clocking 7.1. 26 MHz Crystal Oscillator (XO) 7.2. 32.768 kHz RTC Crystal Oscillator (RTC XO) 7.2.1. General Information 7.2.2. RTC XO Design and Interface Specification 7.2.3. RTC Characterization with Gm Code Variation 7.2.4. RTC Characterization with Supply Variation and Temperature 7.3. 2 MHz and 26 MHz Integrated RC Oscillators 8. Electrical Characteristics 8.1. Absolute Maximum Ratings 8.2. Recommended Operating Conditions 8.3. Current Consumption in Device States 8.4. Receiver Performance 8.5. Transmitter Performance 9. ATBTLC1000-MR110CA Module Outline Drawing 10. ATBTLC1000-MR110CA Reference Schematic 10.1. Reference Schematics 11. Placement and Routing Guidelines 11.1. Power and Ground 11.2. Interferers 12. Reflow Profile Information 12.1. Storage Condition 12.1.1. Moisture Barrier Bag Before Opening 12.1.2. Moisture Barrier Bag Open 12.2. Stencil Design 12.3. Soldering and Reflow Condition 12.3.1. Reflow Oven 12.4. Baking Conditions 12.5. Module Assembly Considerations 13. Regulatory Approval 13.1. United States (FCC) 13.1.1. Labeling And User Information Requirements 13.1.2. RF Exposure 13.1.3. Helpful Websites 13.2. Canada (ISED) 13.2.1. Labeling and User Information Requirements 13.2.2. RF Exposure 13.2.3. Helpful Websites 13.3. Japan 13.3.1. Labeling and User Information Requirements 13.3.2. Helpful Websites 13.4. Other Regulatory Information 14. Reference Documentation 15. Document Revision History The Microchip Web Site Customer Change Notification Service Customer Support Microchip Devices Code Protection Feature Legal Notice Trademarks Quality Management System Certified by DNV Worldwide Sales and Service