Datasheet SAM9X60 SIP (Microchip) - 7
| 制造商 | Microchip |
| 描述 | SAM9X60 System-In-Package (SIP) MPU with up to 1 Gbit DDR2 SDRAM and up to 64 Mbits SDR-SDRAM |
| 页数 / 页 | 40 / 7 — SAM9X60 SIP. SDR-SDRAM Features. Datasheet |
| 文件格式/大小 | PDF / 770 Kb |
| 文件语言 | 英语 |
SAM9X60 SIP. SDR-SDRAM Features. Datasheet
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文件文字版本
SAM9X60 SIP SDR-SDRAM Features 2. SDR-SDRAM Features
• Part Number: – 64-Mbit SDR-SDRAM device (SAM9X60D6K-I): Winbond W986416KG-5I • Power Supply: DDRM_VDD = 3.3V ±0.3V • 1,048,576 Words x 4 Banks x 16 Bits Organization • Self-Refresh Current: Standard and Low-Power • CAS Latency: 2 and 3 • Burst Length: 1 • Sequential Burst • Byte Data Controlled by LDQM, UDQM • Controlled Precharge • Burst Read Operation • 4K Refresh Cycles/16 ms © 2020 Microchip Technology Inc.
Datasheet
DS60001580B-page 7 Document Outline Scope Introduction Reference Documents Features Table of Contents 1. DDR2-SDRAM Features 2. SDR-SDRAM Features 3. Configuration Summary 4. Block Diagram 5. Chip Identifier 6. Package and Ballout 6.1. Packages 6.2. Ballout 7. Memories 8. Electrical Characteristics 8.1. Decoupling 8.2. Power Sequences 9. Mechanical Characteristics 9.1. 233-Ball TFBGA 9.2. 196-Ball TFBGA 10. Ordering Information 11. Revision History 11.1. DS60001580B - 02/2020 11.2. DS60001580A - 10/2019 The Microchip Website Product Change Notification Service Customer Support Product Identification System Microchip Devices Code Protection Feature Legal Notice Trademarks Quality Management System Worldwide Sales and Service
• Part Number: – 64-Mbit SDR-SDRAM device (SAM9X60D6K-I): Winbond W986416KG-5I • Power Supply: DDRM_VDD = 3.3V ±0.3V • 1,048,576 Words x 4 Banks x 16 Bits Organization • Self-Refresh Current: Standard and Low-Power • CAS Latency: 2 and 3 • Burst Length: 1 • Sequential Burst • Byte Data Controlled by LDQM, UDQM • Controlled Precharge • Burst Read Operation • 4K Refresh Cycles/16 ms © 2020 Microchip Technology Inc.
Datasheet
DS60001580B-page 7 Document Outline Scope Introduction Reference Documents Features Table of Contents 1. DDR2-SDRAM Features 2. SDR-SDRAM Features 3. Configuration Summary 4. Block Diagram 5. Chip Identifier 6. Package and Ballout 6.1. Packages 6.2. Ballout 7. Memories 8. Electrical Characteristics 8.1. Decoupling 8.2. Power Sequences 9. Mechanical Characteristics 9.1. 233-Ball TFBGA 9.2. 196-Ball TFBGA 10. Ordering Information 11. Revision History 11.1. DS60001580B - 02/2020 11.2. DS60001580A - 10/2019 The Microchip Website Product Change Notification Service Customer Support Product Identification System Microchip Devices Code Protection Feature Legal Notice Trademarks Quality Management System Worldwide Sales and Service