Datasheet VEMD8081 (Vishay) - 5
| 制造商 | Vishay |
| 描述 | Silicon PIN Photodiode |
| 页数 / 页 | 6 / 5 — VEMD8081. SOLDER PROFILE. DRYPACK. FLOOR LIFE. DRYING |
| 文件格式/大小 | PDF / 156 Kb |
| 文件语言 | 英语 |
VEMD8081. SOLDER PROFILE. DRYPACK. FLOOR LIFE. DRYING
该数据表的模型线
文件文字版本
VEMD8081
www.vishay.com Vishay Semiconductors
SOLDER PROFILE DRYPACK
Axis Title Devices are packed in moisture barrier bags (MBB) to 300 10000 prevent the products from moisture absorption during Max. 260 °C transportation and storage. Each bag contains a desiccant. 255 °C 250 245 °C 240 °C 217 °C
FLOOR LIFE
200 1000 Time between soldering and removing from MBB must not Max. 30 s ine ne ne exceed the time indicated in J-STD-020: 150 1st li Moisture sensitivity: level 3 2nd l 2nd li Max. 120 s Max. 100 s 100 100 Floor life: 168 h Temperature (°C) Max. ramp down 6 °C/s Conditions: Tamb < 30 °C, RH < 60 % 50 Max. ramp up 3 °C/s
DRYING
0 10 In case of moisture absorption devices should be 0 50 100 150 200 250 300 baked before soldering. Conditions see J-STD-033D or 19841 Time (s) recommended conditions: Fig. 7 - Lead (Pb)-free Reflow Solder Profile According to J-STD-020D 192 h at 40 °C (+ 5 °C), RH < 5 % or 96 h at 60 °C (+ 5 °C), RH < 5 % Rev. 1.0, 07-Oct-2020
5
Document Number: 80218 For technical questions, contact: detectortechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
www.vishay.com Vishay Semiconductors
SOLDER PROFILE DRYPACK
Axis Title Devices are packed in moisture barrier bags (MBB) to 300 10000 prevent the products from moisture absorption during Max. 260 °C transportation and storage. Each bag contains a desiccant. 255 °C 250 245 °C 240 °C 217 °C
FLOOR LIFE
200 1000 Time between soldering and removing from MBB must not Max. 30 s ine ne ne exceed the time indicated in J-STD-020: 150 1st li Moisture sensitivity: level 3 2nd l 2nd li Max. 120 s Max. 100 s 100 100 Floor life: 168 h Temperature (°C) Max. ramp down 6 °C/s Conditions: Tamb < 30 °C, RH < 60 % 50 Max. ramp up 3 °C/s
DRYING
0 10 In case of moisture absorption devices should be 0 50 100 150 200 250 300 baked before soldering. Conditions see J-STD-033D or 19841 Time (s) recommended conditions: Fig. 7 - Lead (Pb)-free Reflow Solder Profile According to J-STD-020D 192 h at 40 °C (+ 5 °C), RH < 5 % or 96 h at 60 °C (+ 5 °C), RH < 5 % Rev. 1.0, 07-Oct-2020
5
Document Number: 80218 For technical questions, contact: detectortechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000