Datasheet ADA4098-1 (Analog Devices) - 7

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Preliminary Technical Data ADA4098-1 ABSOLUTE MAXIMUM RATINGS Table 3.
The PD due to the load drive depends on the application. The
Parameter Rating
PD due to load drive is calculated by multiplying the load Supply Voltage1 current by the associated voltage drop across the device. RMS Transient 60 V voltages and currents must be used in these calculations. Continuous 50 V Airflow increases heat dissipation, effectively reducing θJA. Power Dissipation (PDISS) See Figure 3 Additional metal that is directly in contact with the package Differential Input Voltage ±80 V leads from metal traces through vias, ground, and power planes ±IN Pin Voltage reduces θJA. Continuous −10 V to+ 80 V Figure 3 shows the maximum P Survival −20 V to +80 V D vs. TA for the single and dual ±IN Pin Current 20 mA 6-lead TSOT packages on a JEDEC standard, 4-layer board, with SHDN Pin Voltage −0.3 V to +60 V −VS connected to a pad that is thermally connected to a PCB Electrostatic Discharge (ESD) plane. θJA values are approximations. Human Body Model (HBM) ±4 kV
1.4
Field Induced Charge Device Model (FICDM) ±2 kV
)
Storage Temperature Range −65°C to +150°C
1.2 (W
Operating Temperature Range −55°C to +150°C
N IO 1.0 T
Lead Temperature (Soldering, 10 sec) 300°C
PA
Junction Temperature (TJ) 175°C
ISSI 0.8 D
1 Maximum supply voltage is limited by the TDDB of on-chip capacitor oxides.
ER W 0.6
The amplifier tolerates temporary transient overshoot up to the specified transient maximum rating. The continuous operating supply voltage must
M PO
be limited to no more than 50 V.
0.4 MU
Stresses at or above those listed under Absolute Maximum
XI MA 0.2
Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the product at these
0
004 or any other conditions above those indicated in the
–60 –30 0 30 60 90 120 150 AMBIENT TEMPERATURE (°C)
operational section of this specification is not implied. 22172- Figure 3. Maximum Power Dissipation vs. Ambient Temperature Operation beyond the maximum operating conditions for extended periods may affect product reliability.
THERMAL RESISTANCE
Junction temperatures (T Thermal performance is directly linked to printed circuit board J) exceeding 125°C promote accelerated aging. The ADA4098-1 demonstrates ±25 V supply (PCB) design and operating environment. Careful attention to operation beyond 1000 hours at T PCB thermal design is required. A = 150°C.
MAXIMUM POWER DISSIPATION
θJA is the junction to ambient thermal resistance. The maximum safe power dissipation (PDISS) on the device is
Table 4. Thermal Resistance
limited by the associated rise in either case temperature (TC) or
Package Type θJA Unit
TJ on the die. At approximately TC = 150°C, which is the glass UJ-6 192 °C/W transition temperature, the properties of the plastic changes. Exceeding this temperature limit, even temporarily, may change
ESD CAUTION
the stresses that the package exerts on the die, which permanently shifts the parametric performance of the ADA4098-1. Exceeding TJ = 175°C for an extended period may result in changes in the silicon devices and may potential y cause failure of the device. The PDISS on the package is the sum of the quiescent power dissipation and the power dissipated in the package due to the output load drive. The quiescent power is expressed in the fol owing equation: VSY × ISY where ISY is the quiescent current. Rev. PrA | Page 7 of 27 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION TYPICAL APPLICATION CIRCUIT TABLE OF CONTENTS SPECIFICATIONS 5 V SUPPLY ±15 V SUPPLY ABSOLUTE MAXIMUM RATINGS MAXIMUM POWER DISSIPATION THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION INPUT PROTECTION OVER-THE-TOP OPERATION CONSIDERATIONS OUTPUT SHUTDOWN PIN (SHDN) APPLICATIONS INFORMATION LARGE RESISTOR GAIN OPERATION RECOMMENDED VALUES FOR VARIOUS GAINS NOISE DISTORTION POWER DISSIPATION AND THERMAL SHUTDOWN CIRCUIT LAYOUT CONSIDERATIONS POWER SUPPLY BYPASSING GROUNDING ESD PROTECTION WHEN POWERED RELATED PRODUCTS TYPICAL APPLICATIONS OUTLINE DIMENSIONS