Datasheet ADA4098-1 (Analog Devices) - 8
| 制造商 | Analog Devices |
| 描述 | 50 V, 1 MHz, 165 µA, Robust Over-The-Top Precision Op Amp |
| 页数 / 页 | 27 / 8 — ADA4098-1. Preliminary Technical Data. PIN CONFIGURATION AND FUNCTION … |
| 修订版 | PrA |
| 文件格式/大小 | PDF / 1.6 Mb |
| 文件语言 | 英语 |
ADA4098-1. Preliminary Technical Data. PIN CONFIGURATION AND FUNCTION DESCRIPTIONS. OUT 1. SHDN. +IN. –IN. TOP VIEW. (Not to Scale)
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ADA4098-1 Preliminary Technical Data PIN CONFIGURATION AND FUNCTION DESCRIPTIONS ADA4098-1 V OUT 1 6 +V S –V 2 S 5 SHDN +IN 3 4 –IN TOP VIEW (Not to Scale)
22172-005 Figure 4. Pin Configuration
Table 5. Pin Function Descriptions Pin No. Mnemonic Description
1 VOUT Amplifier Output. 2 −VS Negative Power Supply. In single-supply applications, this pin is normally soldered to a low impedance ground plane. In split supply applications, bypass this pin with a capacitance of at least 0.1 μF to a low impedance ground plane, as close to the pin as possible. 3 +IN Noninverting Input of the Amplifier. 4 −IN Inverting Input of the Amplifier. 5 SHDN Op Amp Shutdown. The threshold for shutdown is approximately 1 V above the negative supply. If this pin is not connected or hard tied to −VS, the amplifier is active. If asserted high (VSHDN > −VS + 1.5 V), the amplifier is placed in a shutdown state, and the output of the amplifier goes to a high impedance state. If this pin is left unconnected, it is recommended to connect a small capacitor of 1 nF between SHDN and −VS to prevent signals from −IN from capacitively coupling to the SHDN pin. 6 +VS Positive Power Supply. Bypass this pin with a capacitance of at least 0.1 μF to a low impedance ground plane, as close to the pin as possible. Rev. PrA | Page 8 of 27 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION TYPICAL APPLICATION CIRCUIT TABLE OF CONTENTS SPECIFICATIONS 5 V SUPPLY ±15 V SUPPLY ABSOLUTE MAXIMUM RATINGS MAXIMUM POWER DISSIPATION THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION INPUT PROTECTION OVER-THE-TOP OPERATION CONSIDERATIONS OUTPUT SHUTDOWN PIN (SHDN) APPLICATIONS INFORMATION LARGE RESISTOR GAIN OPERATION RECOMMENDED VALUES FOR VARIOUS GAINS NOISE DISTORTION POWER DISSIPATION AND THERMAL SHUTDOWN CIRCUIT LAYOUT CONSIDERATIONS POWER SUPPLY BYPASSING GROUNDING ESD PROTECTION WHEN POWERED RELATED PRODUCTS TYPICAL APPLICATIONS OUTLINE DIMENSIONS
22172-005 Figure 4. Pin Configuration
Table 5. Pin Function Descriptions Pin No. Mnemonic Description
1 VOUT Amplifier Output. 2 −VS Negative Power Supply. In single-supply applications, this pin is normally soldered to a low impedance ground plane. In split supply applications, bypass this pin with a capacitance of at least 0.1 μF to a low impedance ground plane, as close to the pin as possible. 3 +IN Noninverting Input of the Amplifier. 4 −IN Inverting Input of the Amplifier. 5 SHDN Op Amp Shutdown. The threshold for shutdown is approximately 1 V above the negative supply. If this pin is not connected or hard tied to −VS, the amplifier is active. If asserted high (VSHDN > −VS + 1.5 V), the amplifier is placed in a shutdown state, and the output of the amplifier goes to a high impedance state. If this pin is left unconnected, it is recommended to connect a small capacitor of 1 nF between SHDN and −VS to prevent signals from −IN from capacitively coupling to the SHDN pin. 6 +VS Positive Power Supply. Bypass this pin with a capacitance of at least 0.1 μF to a low impedance ground plane, as close to the pin as possible. Rev. PrA | Page 8 of 27 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION TYPICAL APPLICATION CIRCUIT TABLE OF CONTENTS SPECIFICATIONS 5 V SUPPLY ±15 V SUPPLY ABSOLUTE MAXIMUM RATINGS MAXIMUM POWER DISSIPATION THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION INPUT PROTECTION OVER-THE-TOP OPERATION CONSIDERATIONS OUTPUT SHUTDOWN PIN (SHDN) APPLICATIONS INFORMATION LARGE RESISTOR GAIN OPERATION RECOMMENDED VALUES FOR VARIOUS GAINS NOISE DISTORTION POWER DISSIPATION AND THERMAL SHUTDOWN CIRCUIT LAYOUT CONSIDERATIONS POWER SUPPLY BYPASSING GROUNDING ESD PROTECTION WHEN POWERED RELATED PRODUCTS TYPICAL APPLICATIONS OUTLINE DIMENSIONS