link to page 6 link to page 6 link to page 6 link to page 6 link to page 6 link to page 13 link to page 6 link to page 13 link to page 6 link to page 13 link to page 6 Data SheetHMC7543PIN CONFIGURATION AND FUNCTION DESCRIPTIONS4567891011VGNDDD1GNDVDD2GNDVDD3GNDVDD4GND123GNDHMC75432RFOUT13RFINTOP VIEW(Not to Scale)1GNDGND14GNDVGG1GNDVGG2GNDVGG3GNDVGG4GNDVREFVDET2524232221201918171615 002 13423- Figure 2. Pad Configuration Table 4. Pad Function Descriptions Pad No.MnemonicDescription 1, 3, 4, 6, 8, 10, 12, GND Ground Connection (See Figure 3). 14, 17, 19, 21, 23, 25 2 RFIN RF Input. DC couple RFIN and match it to 50 Ω (See Figure 4). 5, 7, 9, 11 V to V Drain Bias Voltage for the Power Amplifier (See Figure 5). DD1 DD4 13 RFOUT RF Output. AC couple RFOUT and match it to 50 Ω (see Figure 6). 15 V Detector Voltage for the Power Detector (See Figure 7). V is the dc voltage representing the RF DET DET output power rectified by the diode, which is biased through an external resistor. Refer to the typical application circuit for the required external components (see Figure 40). 16 V Reference Voltage for the Power Detector (See Figure 7). V is the dc bias of the diode biased through REF REF an external resistor used for temperature compensation of V . Refer to the typical application circuit DET for the required external components (see Figure 40). 18, 20, 22, 24 V to V Gate Bias Voltage for the Power Amplifier (See Figure 8). For the required external components, see GG4 GG1 Figure 40. Die Bottom GND Ground. The die bottom must be connected to the RF/dc ground (see Figure 3). Rev. A | Page 5 of 16 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION TYPICAL APPLICATION CIRCUIT ASSEMBLY DIAGRAM MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICS HANDLING PRECAUTIONS Storage Cleanliness Static Sensitivity Transients General Handling MOUNTING Eutectic Die Attach Epoxy Die Attach WIRE BONDING OUTLINE DIMENSIONS ORDERING GUIDE