Datasheet ADL5321 (Analog Devices) - 7
| 制造商 | Analog Devices |
| 描述 | 2.3 GHz TO 4.0 GHz ¼ Watt RF Driver Amplifier |
| 页数 / 页 | 16 / 7 — Data Sheet. ADL5321. TYPICAL PERFORMANCE CHARACTERISTICS. OIP3 (5dBm). … |
| 修订版 | D |
| 文件格式/大小 | PDF / 464 Kb |
| 文件语言 | 英语 |
Data Sheet. ADL5321. TYPICAL PERFORMANCE CHARACTERISTICS. OIP3 (5dBm). OIP3 (–40°C). , dB. OIP3 (+25°C). E R. OIP3 (+85°C). P1dB. FIGU. Bm)
该数据表的模型线
文件文字版本
Data Sheet ADL5321 TYPICAL PERFORMANCE CHARACTERISTICS 45 42 30 ) OIP3 (5dBm) OIP3 (–40°C) m 40 41 , dB 29 OIP3 (+25°C) dB 35 ( 40 E R OIP3 (+85°C) 30 28 39 P1dB FIGU Bm) E 25 Bm) d d 38 27 OIS 3 ( B ( 20 P1dB (–40°C) , N IP 1d 3 O P 37 15 GAIN 26 , OIP dB 36 1 10 , P 25 P1dB (+85°C) IN 35 P1dB (+25°C) 5 NOISE FIGURE
003 006
GA 0
07307-
34 24
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2.500 2.525 2.550 2.575 2.600 2.625 2.650 2.675 2.700 2.500 2.525 2.550 2.575 2.600 2.625 2.650 2.675 2.700 FREQUENCY (GHz) FREQUENCY (GHz)
Figure 4. Gain, P1dB, OIP3, and Noise Figure vs. Frequency, Figure 7. OIP3 and P1dB vs. Frequency and Temperature, 2.5 GHz to 2.7 GHz 2.5 GHz to 2.7 GHz
16.0 46 15.5 44 15.0 42 –40°C 14.5 2.6GHz 40 B) 14.0 d +25°C Bm) d N ( 38 3 ( AI 13.5 IP 2.5GHz G +85°C O 36 13.0 2.7GHz 34 12.5 12.0 32
004 007
11.5
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30
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2.500 2.525 2.550 2.575 2.600 2.625 2.650 2.675 2.700 –4 –2 0 2 4 6 8 10 12 14 16 18 20 22 FREQUENCY (GHz) POUT (dBm)
Figure 5. Gain vs. Frequency and Temperature, 2.5 GHz to 2.7 GHz Figure 8. OIP3 vs. POUT and Frequency, 2.5 GHz to 2.7 GHz
–24.0 0 6.0 –24.2 –2 5.5 S12 –24.4 –4 5.0 –24.6 B) ) +85°C d dB –6 ( 4.5 –24.8 22 ( E B) R d +25°C –25.0 –8 4.0 12 ( AND S S S11 FIGU E –25.2 B) –10 d 3.5 OIS –25.4 11 ( N S S22 –40°C –12 3.0 –25.6 –14 2.5 –25.8
005 008
–26.0 –16 2.0
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2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9
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2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 FREQUENCY (GHz) FREQUENCY (GHz)
Figure 6. Reverse Isolation (S12), Input Return Loss (S11), and Figure 9. Noise Figure vs. Frequency and Temperature, 2.2 GHz to 2.9 GHz Output Return Loss (S22) vs. Frequency, 2.2 GHz to 2.9 GHz Rev. D | Page 7 of 16 Document Outline Features Applications Functional Block Diagram General Description Table of Contents Revision History Specifications Typical Scattering Parameters Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics High Temperature and 3.3 V Operation Basic Layout Connections Soldering Information and Recommended PCB Land Pattern Matching Procedure WiMax Operation Evaluation Board Outline Dimensions Ordering Guide
003 006
GA 0
07307-
34 24
07307-
2.500 2.525 2.550 2.575 2.600 2.625 2.650 2.675 2.700 2.500 2.525 2.550 2.575 2.600 2.625 2.650 2.675 2.700 FREQUENCY (GHz) FREQUENCY (GHz)
Figure 4. Gain, P1dB, OIP3, and Noise Figure vs. Frequency, Figure 7. OIP3 and P1dB vs. Frequency and Temperature, 2.5 GHz to 2.7 GHz 2.5 GHz to 2.7 GHz
16.0 46 15.5 44 15.0 42 –40°C 14.5 2.6GHz 40 B) 14.0 d +25°C Bm) d N ( 38 3 ( AI 13.5 IP 2.5GHz G +85°C O 36 13.0 2.7GHz 34 12.5 12.0 32
004 007
11.5
07307-
30
07307-
2.500 2.525 2.550 2.575 2.600 2.625 2.650 2.675 2.700 –4 –2 0 2 4 6 8 10 12 14 16 18 20 22 FREQUENCY (GHz) POUT (dBm)
Figure 5. Gain vs. Frequency and Temperature, 2.5 GHz to 2.7 GHz Figure 8. OIP3 vs. POUT and Frequency, 2.5 GHz to 2.7 GHz
–24.0 0 6.0 –24.2 –2 5.5 S12 –24.4 –4 5.0 –24.6 B) ) +85°C d dB –6 ( 4.5 –24.8 22 ( E B) R d +25°C –25.0 –8 4.0 12 ( AND S S S11 FIGU E –25.2 B) –10 d 3.5 OIS –25.4 11 ( N S S22 –40°C –12 3.0 –25.6 –14 2.5 –25.8
005 008
–26.0 –16 2.0
07307-
2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9
07307-
2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 FREQUENCY (GHz) FREQUENCY (GHz)
Figure 6. Reverse Isolation (S12), Input Return Loss (S11), and Figure 9. Noise Figure vs. Frequency and Temperature, 2.2 GHz to 2.9 GHz Output Return Loss (S22) vs. Frequency, 2.2 GHz to 2.9 GHz Rev. D | Page 7 of 16 Document Outline Features Applications Functional Block Diagram General Description Table of Contents Revision History Specifications Typical Scattering Parameters Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics High Temperature and 3.3 V Operation Basic Layout Connections Soldering Information and Recommended PCB Land Pattern Matching Procedure WiMax Operation Evaluation Board Outline Dimensions Ordering Guide