Datasheet ADL5321 (Analog Devices) - 8
| 制造商 | Analog Devices |
| 描述 | 2.3 GHz TO 4.0 GHz ¼ Watt RF Driver Amplifier |
| 页数 / 页 | 16 / 8 — ADL5321. Data Sheet. ) m. OIP3 (5dBm). , dB. OIP3 (–40°C). ( E R. P1dB. … |
| 修订版 | D |
| 文件格式/大小 | PDF / 464 Kb |
| 文件语言 | 英语 |
ADL5321. Data Sheet. ) m. OIP3 (5dBm). , dB. OIP3 (–40°C). ( E R. P1dB. FIGU. OIP3 (+85°C). Bm) d. OIP3 (+25°C). OIS. B (. , N. IP3. P1dB (–40°C). , OIP
该数据表的模型线
文件文字版本
ADL5321 Data Sheet 45 42 30 ) m 40 OIP3 (5dBm) 41 , dB 29 40 dB 35 OIP3 (–40°C) ( E R 39 30 28 P1dB FIGU 38 M) OIP3 (+85°C) E 25 B Bm) d OIP3 (+25°C) (d 37 OIS 27 B ( 20 , N IP3 1d 3 O 36 P P1dB (–40°C) 15 26 , OIP GAIN 35 dB 1 10 34 , P P1dB (+25°C) 25 IN NOISE FIGURE P1dB (+85°C) 5 33
012
GA
009
0 32 24
07307-
3.400 3.425 3.450 3.475 3.500 3.525 3.550 3.575 3.600
07307-
3.400 3.425 3.450 3.475 3.500 3.525 3.550 3.575 3.600 FREQUENCY (GHz) FREQUENCY (MHz)
Figure 10. Gain, P1dB, OIP3, and Noise Figure vs. Frequency, Figure 13. OIP3 and P1dB vs. Frequency and Temperature, 3.4 GHz to 3.6 GHz 3.4 GHz to 3.6 GHz
14.0 42 13.5 3.4GHz 40 13.0 –40°C 38 12.5 B) 3.5GHz d Bm) +25°C d N ( 12.0 36 3 ( AI G IP O 3.6GHz 11.5 +85°C 34 11.0 32 10.5
013 010
10.0 30
07307-
3.400 3.425 3.450 3.475 3.500 3.525 3.550 3.575 3.600
07307-
–4 –2 0 2 4 6 8 10 12 14 16 18 20 22 FREQUENCY (GHz) POUT (dBm)
Figure 11. Gain vs. Frequency and Temperature, 3.4 GHz to 3.6 GHz Figure 14. OIP3 vs. POUT and Frequency, 3.4 GHz to 3.6 GHz
–25 0 8.5 –26 8.0 S12 S22 –5 7.5 –27 7.0 –28 B) ) –10 d S11 6.5 dB ( +85°C –29 22 ( E 6.0 B) R d –30 –15 5.5 +25°C 12 ( AND S S FIGU E –31 B) 5.0 d –20 OIS 4.5 –40°C –32 11 ( N S 4.0 –33 –25 3.5 –34 3.0
014 011
–35 –30 2.5 3.2 3.3 3.4 3.5 3.6 3.7 3.8 3.9 4.0
07307-
3.2 3.3 3.4 3.5 3.6 3.7 3.8 3.9 4.0
07307-
FREQUENCY (MHz) FREQUENCY (GHz)
Figure 12. Reverse Isolation (S12), Input Return Loss (S11), and Figure 15. Noise Figure vs. Frequency and Temperature, Output Return Loss (S22) vs. Frequency, 3.2 GHz to 4.0 GHz 3.2 GHz to 4.0 GHz Rev. D | Page 8 of 16 Document Outline Features Applications Functional Block Diagram General Description Table of Contents Revision History Specifications Typical Scattering Parameters Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics High Temperature and 3.3 V Operation Basic Layout Connections Soldering Information and Recommended PCB Land Pattern Matching Procedure WiMax Operation Evaluation Board Outline Dimensions Ordering Guide
012
GA
009
0 32 24
07307-
3.400 3.425 3.450 3.475 3.500 3.525 3.550 3.575 3.600
07307-
3.400 3.425 3.450 3.475 3.500 3.525 3.550 3.575 3.600 FREQUENCY (GHz) FREQUENCY (MHz)
Figure 10. Gain, P1dB, OIP3, and Noise Figure vs. Frequency, Figure 13. OIP3 and P1dB vs. Frequency and Temperature, 3.4 GHz to 3.6 GHz 3.4 GHz to 3.6 GHz
14.0 42 13.5 3.4GHz 40 13.0 –40°C 38 12.5 B) 3.5GHz d Bm) +25°C d N ( 12.0 36 3 ( AI G IP O 3.6GHz 11.5 +85°C 34 11.0 32 10.5
013 010
10.0 30
07307-
3.400 3.425 3.450 3.475 3.500 3.525 3.550 3.575 3.600
07307-
–4 –2 0 2 4 6 8 10 12 14 16 18 20 22 FREQUENCY (GHz) POUT (dBm)
Figure 11. Gain vs. Frequency and Temperature, 3.4 GHz to 3.6 GHz Figure 14. OIP3 vs. POUT and Frequency, 3.4 GHz to 3.6 GHz
–25 0 8.5 –26 8.0 S12 S22 –5 7.5 –27 7.0 –28 B) ) –10 d S11 6.5 dB ( +85°C –29 22 ( E 6.0 B) R d –30 –15 5.5 +25°C 12 ( AND S S FIGU E –31 B) 5.0 d –20 OIS 4.5 –40°C –32 11 ( N S 4.0 –33 –25 3.5 –34 3.0
014 011
–35 –30 2.5 3.2 3.3 3.4 3.5 3.6 3.7 3.8 3.9 4.0
07307-
3.2 3.3 3.4 3.5 3.6 3.7 3.8 3.9 4.0
07307-
FREQUENCY (MHz) FREQUENCY (GHz)
Figure 12. Reverse Isolation (S12), Input Return Loss (S11), and Figure 15. Noise Figure vs. Frequency and Temperature, Output Return Loss (S22) vs. Frequency, 3.2 GHz to 4.0 GHz 3.2 GHz to 4.0 GHz Rev. D | Page 8 of 16 Document Outline Features Applications Functional Block Diagram General Description Table of Contents Revision History Specifications Typical Scattering Parameters Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics High Temperature and 3.3 V Operation Basic Layout Connections Soldering Information and Recommended PCB Land Pattern Matching Procedure WiMax Operation Evaluation Board Outline Dimensions Ordering Guide