Datasheet ADL5320 (Analog Devices) - 8
| 制造商 | Analog Devices |
| 描述 | 400 MHz TO 2700 MHz ¼ Watt RF Driver Amplifier |
| 页数 / 页 | 20 / 8 — ADL5320. Data Sheet. 29.0. OIP3 (10dBm). OIP3 (–40°C). 28.5. ) m. 28.0. ( … |
| 修订版 | B |
| 文件格式/大小 | PDF / 919 Kb |
| 文件语言 | 英语 |
ADL5320. Data Sheet. 29.0. OIP3 (10dBm). OIP3 (–40°C). 28.5. ) m. 28.0. ( 3. OIP3 (+85°C). OIP3 (+25°C). 27.5. P1dB. , OIP. 27.0. Bm). B (. ); P
该数据表的模型线
文件文字版本
ADL5320 Data Sheet 45 45 29.0 40 OIP3 (10dBm) 43 OIP3 (–40°C) 28.5 ) m 35 28.0 dB 41 ( 3 OIP3 (+85°C) 30 OIP3 (+25°C) 27.5 P1dB 39 , OIP M) 25 dB B 27.0 Bm) 1 d (d 37 B ( ); P 20 P1dB (–40°C) IP3 26.5 1d dB O P 35 F ( 15 26.0 , N GAIN IN 33 10 25.5 GA 5 31 P1dB (+25°C) 25.0
012
NF
009
P1dB (+85°C) 0 29 24.5
05840-
2060 2080 2100 2120 2140 2160 2180 2200 2220
05840-
2060 2080 2100 2120 2140 2160 2180 2200 2220 FREQUENCY (MHz) FREQUENCY (MHz)
Figure 10. Gain, P1dB, OIP3, and Noise Figure vs. Frequency, Figure 13. OIP3 and P1dB vs. Frequency and Temperature, 2060 MHz to 2200 MHz 2060 MHz to 2200 MHz
16 43 2190MHz 15 41 2060MHz 2140MHz 2090MHz –40°C 14 39 B) d +25°C Bm) 2220MHz d 13 N ( 37 3 ( AI G +85°C IP O 12 35 11 33
013 010
10 31
05840-
2060 2080 2100 2120 2140 2160 2180 2200 2220
05840-
–2 0 2 4 6 8 10 12 14 16 18 20 22 FREQUENCY (MHz) POUT (dBm)
Figure 11. Gain vs. Frequency and Temperature, 2060 MHz to 2200 MHz Figure 14. OIP3 vs. POUT and Frequency, 2060 MHz to 2200 MHz
–23 0 8.0 7.5 –5 –24 7.0 S22 –10 6.5 B) –25 d 6.0 –15 22 ( S11 +85°C B) 5.5 d B) –26 –20 d ( 5.0 12 ( AND S S S12 +25°C B) NF 4.5 –25 d –27 11 ( 4.0 S –30 3.5 –40°C –28 3.0 –35 2.5
014 011
–29 –40 2.0 1900 1950 2000 2050 2100 2150 2200 2250 2300
05840- 05840-
1900 1950 2000 2050 2100 2150 2200 2250 2300 FREQUENCY (MHz) FREQUENCY (MHz)
Figure 12. Input Return Loss (S11), Output Return Loss (S22), and Reverse Figure 15. Noise Figure vs. Frequency and Temperature, Isolation (S12) vs. Frequency, 2060 MHz to 2200 MHz 2060 MHz to 2200 MHz Rev. B | Page 8 of 20 Document Outline Features Applications Functional Block Diagram General Description Table of Contents Revision History Specifications Typical Scattering Parameters Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics High Temperature and 3.3 V Operation Applications Information Basic Layout Connections Soldering Information and Recommended PCB Land Pattern Matching Procedure Optimizing OP1dB W-CDMA ACPR Performance Evaluation Board Outline Dimensions Ordering Guide
012
NF
009
P1dB (+85°C) 0 29 24.5
05840-
2060 2080 2100 2120 2140 2160 2180 2200 2220
05840-
2060 2080 2100 2120 2140 2160 2180 2200 2220 FREQUENCY (MHz) FREQUENCY (MHz)
Figure 10. Gain, P1dB, OIP3, and Noise Figure vs. Frequency, Figure 13. OIP3 and P1dB vs. Frequency and Temperature, 2060 MHz to 2200 MHz 2060 MHz to 2200 MHz
16 43 2190MHz 15 41 2060MHz 2140MHz 2090MHz –40°C 14 39 B) d +25°C Bm) 2220MHz d 13 N ( 37 3 ( AI G +85°C IP O 12 35 11 33
013 010
10 31
05840-
2060 2080 2100 2120 2140 2160 2180 2200 2220
05840-
–2 0 2 4 6 8 10 12 14 16 18 20 22 FREQUENCY (MHz) POUT (dBm)
Figure 11. Gain vs. Frequency and Temperature, 2060 MHz to 2200 MHz Figure 14. OIP3 vs. POUT and Frequency, 2060 MHz to 2200 MHz
–23 0 8.0 7.5 –5 –24 7.0 S22 –10 6.5 B) –25 d 6.0 –15 22 ( S11 +85°C B) 5.5 d B) –26 –20 d ( 5.0 12 ( AND S S S12 +25°C B) NF 4.5 –25 d –27 11 ( 4.0 S –30 3.5 –40°C –28 3.0 –35 2.5
014 011
–29 –40 2.0 1900 1950 2000 2050 2100 2150 2200 2250 2300
05840- 05840-
1900 1950 2000 2050 2100 2150 2200 2250 2300 FREQUENCY (MHz) FREQUENCY (MHz)
Figure 12. Input Return Loss (S11), Output Return Loss (S22), and Reverse Figure 15. Noise Figure vs. Frequency and Temperature, Isolation (S12) vs. Frequency, 2060 MHz to 2200 MHz 2060 MHz to 2200 MHz Rev. B | Page 8 of 20 Document Outline Features Applications Functional Block Diagram General Description Table of Contents Revision History Specifications Typical Scattering Parameters Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics High Temperature and 3.3 V Operation Applications Information Basic Layout Connections Soldering Information and Recommended PCB Land Pattern Matching Procedure Optimizing OP1dB W-CDMA ACPR Performance Evaluation Board Outline Dimensions Ordering Guide