Datasheet ADL5320 (Analog Devices) - 9
| 制造商 | Analog Devices |
| 描述 | 400 MHz TO 2700 MHz ¼ Watt RF Driver Amplifier |
| 页数 / 页 | 20 / 9 — Data Sheet. ADL5320. OIP3 (10dBm). OIP3 (–40°C). OIP3 (+25°C). ( 3. OIP3 … |
| 修订版 | B |
| 文件格式/大小 | PDF / 919 Kb |
| 文件语言 | 英语 |
Data Sheet. ADL5320. OIP3 (10dBm). OIP3 (–40°C). OIP3 (+25°C). ( 3. OIP3 (+85°C). P1dB. , OIP. Bm). 3 (. P1dB (–40°C). B (. ); P. P1dB (+25°C)
该数据表的模型线
文件文字版本
Data Sheet ADL5320 40 39 32 38 35 OIP3 (10dBm) OIP3 (–40°C) ) 31 m 37 OIP3 (+25°C) dB 30 ( 3 36 OIP3 (+85°C) 30 25 P1dB , OIP 35 29 dB Bm) Bm) 1 d d 20 34 3 ( P1dB (–40°C) B ( ); P IP 28 1d dB O 33 P 15 P1dB (+25°C) F ( , N 32 27 IN 10 GAIN GA 31 P1dB (+85°C) 5 26 NF 30
015
0 29
018
25
05840-
2500 2520 2540 2560 2580 2600 2620 2640 2660 2680 2700 2500 2550 2600 2650 2700
05840-
FREQUENCY (MHz) FREQUENCY (MHz)
Figure 16. Gain, P1dB, OIP3, and Noise Figure vs. Frequency, Figure 19. OIP3 and P1dB vs. Frequency and Temperature, 2500 MHz to 2700 MHz 2500 MHz to 2700 MHz
15 46 44 14 –40°C 42 13 +25°C 40 B) d Bm) d 12 N ( 38 2700MHz 2600MHz 3 ( AI +85°C G IP O 36 11 34 2500MHz 10 32
016 019
9 30 2500 2550 2600 2650 2700
05840- 05840-
–3 –1 1 3 5 7 9 11 13 15 17 19 21 23 FREQUENCY (MHz) POUT (dBm)
Figure 17. Gain vs. Frequency and Temperature, 2500 MHz to 2700 MHz Figure 20. OIP3 vs. POUT and Frequency, 2500 MHz to 2700 MHz
–25.0 0 8.0 –25.5 7.5 –5 7.0 –26.0 –10 6.5 –26.5 S22 B) +85°C d 6.0 –15 –27.0 22 ( 5.5 B) d B) +25°C S11 d –27.5 –20 ( 5.0 12 ( AND S S NF –28.0 B) S12 4.5 –25 d –40°C 4.0 –28.5 11 ( S –30 3.5 –29.0 3.0 –35 –29.5 2.5
020 017
–30.0 –40 2.0 2400 2450 2500 2550 2600 2650 2700 2750 2800
05840-
2400 2450 2500 2550 2600 2650 2700 2750 2800
05840-
FREQUENCY (MHz) FREQUENCY (MHz)
Figure 18. Input Return Loss (S11), Output Return Loss (S22), and Reverse Figure 21. Noise Figure vs. Frequency and Temperature, Isolation (S12) vs. Frequency, 2500 MHz to 2700 MHz 2500 MHz to 2700 MHz Rev. B | Page 9 of 20 Document Outline Features Applications Functional Block Diagram General Description Table of Contents Revision History Specifications Typical Scattering Parameters Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics High Temperature and 3.3 V Operation Applications Information Basic Layout Connections Soldering Information and Recommended PCB Land Pattern Matching Procedure Optimizing OP1dB W-CDMA ACPR Performance Evaluation Board Outline Dimensions Ordering Guide
015
0 29
018
25
05840-
2500 2520 2540 2560 2580 2600 2620 2640 2660 2680 2700 2500 2550 2600 2650 2700
05840-
FREQUENCY (MHz) FREQUENCY (MHz)
Figure 16. Gain, P1dB, OIP3, and Noise Figure vs. Frequency, Figure 19. OIP3 and P1dB vs. Frequency and Temperature, 2500 MHz to 2700 MHz 2500 MHz to 2700 MHz
15 46 44 14 –40°C 42 13 +25°C 40 B) d Bm) d 12 N ( 38 2700MHz 2600MHz 3 ( AI +85°C G IP O 36 11 34 2500MHz 10 32
016 019
9 30 2500 2550 2600 2650 2700
05840- 05840-
–3 –1 1 3 5 7 9 11 13 15 17 19 21 23 FREQUENCY (MHz) POUT (dBm)
Figure 17. Gain vs. Frequency and Temperature, 2500 MHz to 2700 MHz Figure 20. OIP3 vs. POUT and Frequency, 2500 MHz to 2700 MHz
–25.0 0 8.0 –25.5 7.5 –5 7.0 –26.0 –10 6.5 –26.5 S22 B) +85°C d 6.0 –15 –27.0 22 ( 5.5 B) d B) +25°C S11 d –27.5 –20 ( 5.0 12 ( AND S S NF –28.0 B) S12 4.5 –25 d –40°C 4.0 –28.5 11 ( S –30 3.5 –29.0 3.0 –35 –29.5 2.5
020 017
–30.0 –40 2.0 2400 2450 2500 2550 2600 2650 2700 2750 2800
05840-
2400 2450 2500 2550 2600 2650 2700 2750 2800
05840-
FREQUENCY (MHz) FREQUENCY (MHz)
Figure 18. Input Return Loss (S11), Output Return Loss (S22), and Reverse Figure 21. Noise Figure vs. Frequency and Temperature, Isolation (S12) vs. Frequency, 2500 MHz to 2700 MHz 2500 MHz to 2700 MHz Rev. B | Page 9 of 20 Document Outline Features Applications Functional Block Diagram General Description Table of Contents Revision History Specifications Typical Scattering Parameters Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics High Temperature and 3.3 V Operation Applications Information Basic Layout Connections Soldering Information and Recommended PCB Land Pattern Matching Procedure Optimizing OP1dB W-CDMA ACPR Performance Evaluation Board Outline Dimensions Ordering Guide