Datasheet HMC8401 (Analog Devices) - 6
| 制造商 | Analog Devices |
| 描述 | DC to 28 GHz, GaAs pHEMT MMIC Low Noise Amplifier |
| 页数 / 页 | 17 / 6 — HMC8401. Data Sheet. PIN CONFIGURATION AND FUNCTION DESCRIPTIONS. … |
| 修订版 | B |
| 文件格式/大小 | PDF / 363 Kb |
| 文件语言 | 英语 |
HMC8401. Data Sheet. PIN CONFIGURATION AND FUNCTION DESCRIPTIONS. ADI2014. Table 5. Pad Function Descriptions Pad No. Mnemonic
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HMC8401 Data Sheet PIN CONFIGURATION AND FUNCTION DESCRIPTIONS HMC8401 3 4 5 2 1 ADI2014 8 7 6
002 13850- Figure 2. Pad Configuration
Table 5. Pad Function Descriptions Pad No. Mnemonic Description
1 RFIN Radio Frequency (RF) Input. This pad is dc coupled and matched to 50 Ω. See Figure 3 for the interface schematic. 2 VGG2 Gain Control. This pad is dc-coupled and accomplishes gain control by bringing this voltage lower and becoming more negative. Attach bypass capacitors to this pad as shown in Figure 44. See Figure 4 for the interface schematic. 3 VDD Power Supply Voltage for the Amplifier. Connect a dc bias to provide drain current (IDD). Attach bypass capacitors to this pad as shown in Figure 44. See Figure 5 for the interface schematic. 4, 6, 7 ACG Low Frequency Termination. Attach bypass capacitors to this pad as shown in Figure 44. See Figure 6 for the interface schematic. 5 RFOUT Radio Frequency (RF) Output. This pad is dc coupled and matched to 50 Ω. See Figure 3 for the interface schematic. 8 VGG1 Gate Control for the Amplifier. Adjust VGG1 to achieve the recommended bias current. Attach bypass capacitors to this pad as shown in Figure 44. See Figure 8 for the interface schematic. Die Bottom GND Die Bottom. The die bottom must be connected to RF/dc ground. See Figure 9 for the interface schematic. Rev. B | Page 6 of 17 Document Outline Features Applications General Description Functional Block Diagram Table of Contents Revision History Specifications 0.01 GHz to 3 GHz Frequency Range 3 GHz to 26 GHz Frequency Range 26 GHz to 28 GHz Frequency Range Absolute Maximum Ratings ESD Caution Pin Configuration and Function Descriptions Interface Schematics Typical Performance Characteristics Theory of Operation Applications Information Biasing Procedures Mounting and Bonding Techniques for Millimeterwave GaAs MMICs Handling Precautions Mounting Eutectic Die Attach Epoxy Die Attach Wire Bonding Typical Application Circuit Assembly Diagram Outline Dimensions Ordering Guide
HMC8401 Data Sheet PIN CONFIGURATION AND FUNCTION DESCRIPTIONS HMC8401 3 4 5 2 1 ADI2014 8 7 6
002 13850- Figure 2. Pad Configuration
Table 5. Pad Function Descriptions Pad No. Mnemonic Description
1 RFIN Radio Frequency (RF) Input. This pad is dc coupled and matched to 50 Ω. See Figure 3 for the interface schematic. 2 VGG2 Gain Control. This pad is dc-coupled and accomplishes gain control by bringing this voltage lower and becoming more negative. Attach bypass capacitors to this pad as shown in Figure 44. See Figure 4 for the interface schematic. 3 VDD Power Supply Voltage for the Amplifier. Connect a dc bias to provide drain current (IDD). Attach bypass capacitors to this pad as shown in Figure 44. See Figure 5 for the interface schematic. 4, 6, 7 ACG Low Frequency Termination. Attach bypass capacitors to this pad as shown in Figure 44. See Figure 6 for the interface schematic. 5 RFOUT Radio Frequency (RF) Output. This pad is dc coupled and matched to 50 Ω. See Figure 3 for the interface schematic. 8 VGG1 Gate Control for the Amplifier. Adjust VGG1 to achieve the recommended bias current. Attach bypass capacitors to this pad as shown in Figure 44. See Figure 8 for the interface schematic. Die Bottom GND Die Bottom. The die bottom must be connected to RF/dc ground. See Figure 9 for the interface schematic. Rev. B | Page 6 of 17 Document Outline Features Applications General Description Functional Block Diagram Table of Contents Revision History Specifications 0.01 GHz to 3 GHz Frequency Range 3 GHz to 26 GHz Frequency Range 26 GHz to 28 GHz Frequency Range Absolute Maximum Ratings ESD Caution Pin Configuration and Function Descriptions Interface Schematics Typical Performance Characteristics Theory of Operation Applications Information Biasing Procedures Mounting and Bonding Techniques for Millimeterwave GaAs MMICs Handling Precautions Mounting Eutectic Die Attach Epoxy Die Attach Wire Bonding Typical Application Circuit Assembly Diagram Outline Dimensions Ordering Guide