Datasheet HMC8401 (Analog Devices) - 8
| 制造商 | Analog Devices |
| 描述 | DC to 28 GHz, GaAs pHEMT MMIC Low Noise Amplifier |
| 页数 / 页 | 17 / 8 — HMC8401. Data Sheet. TYPICAL PERFORMANCE CHARACTERISTICS. B) d ( S. B) d. … |
| 修订版 | B |
| 文件格式/大小 | PDF / 363 Kb |
| 文件语言 | 英语 |
HMC8401. Data Sheet. TYPICAL PERFORMANCE CHARACTERISTICS. B) d ( S. B) d. URN L. –10. –20. N AND RE. AI G. –30. S11. +85°C. S21. +25°C. S22. –55°C. –40
该数据表的模型线
文件文字版本
HMC8401 Data Sheet TYPICAL PERFORMANCE CHARACTERISTICS 20 17 16 10 15 B) d ( S 14 S 0 O 13 B) d URN L ( T –10 12 IN GA 11 –20 N AND RE 10 AI G 9 –30 S11 +85°C S21 8 +25°C S22 –55°C –40 7 0 5 10 15 20 25 30
010
0 5 10 15 20 25 30
013
FREQUENCY (GHz)
13850-
FREQUENCY (GHz)
13850- Figure 10. Response Gain and Return Loss vs. Frequency Figure 13. Gain vs. Frequency at Various Temperatures
0 0 +85°C +85°C –2 +25°C –2 +25°C –55°C –55°C –4 –4 –6 –6 B) B) d d ( ( S –8 S –8 S S O O –10 –10 URN L –12 URN L –12 T T RE –14 RE –14 –16 –16 –18 –18 –20
1
–20
1
0 5 10 15 20 25 30
0
0 5 10 15 20 25 30
014
FREQUENCY (GHz)
13850-
FREQUENCY (GHz)
13850- Figure 11. Input Return Loss vs. Frequency at Various Temperatures Figure 14. Output Return Loss vs. Frequency at Various Temperatures
6 6 +85°C 6.5V +25°C 7.5V 8.5V 5 –55°C 5 B) 4 B) 4 d d ( ( E E R R 3 3 FIGU FIGU E E OIS OIS N 2 N 2 1 1 0 0 0 5 10 15 20 25 30
012
0 5 10 15 20 25 30
015
FREQUENCY (GHz)
13850-
FREQUENCY (GHz)
13850- Figure 12. Noise Figure vs. Frequency at Various Temperatures Figure 15. Noise Figure vs. Frequency at Various Supply Voltages Rev. B | Page 8 of 17 Document Outline Features Applications General Description Functional Block Diagram Table of Contents Revision History Specifications 0.01 GHz to 3 GHz Frequency Range 3 GHz to 26 GHz Frequency Range 26 GHz to 28 GHz Frequency Range Absolute Maximum Ratings ESD Caution Pin Configuration and Function Descriptions Interface Schematics Typical Performance Characteristics Theory of Operation Applications Information Biasing Procedures Mounting and Bonding Techniques for Millimeterwave GaAs MMICs Handling Precautions Mounting Eutectic Die Attach Epoxy Die Attach Wire Bonding Typical Application Circuit Assembly Diagram Outline Dimensions Ordering Guide
010
0 5 10 15 20 25 30
013
FREQUENCY (GHz)
13850-
FREQUENCY (GHz)
13850- Figure 10. Response Gain and Return Loss vs. Frequency Figure 13. Gain vs. Frequency at Various Temperatures
0 0 +85°C +85°C –2 +25°C –2 +25°C –55°C –55°C –4 –4 –6 –6 B) B) d d ( ( S –8 S –8 S S O O –10 –10 URN L –12 URN L –12 T T RE –14 RE –14 –16 –16 –18 –18 –20
1
–20
1
0 5 10 15 20 25 30
0
0 5 10 15 20 25 30
014
FREQUENCY (GHz)
13850-
FREQUENCY (GHz)
13850- Figure 11. Input Return Loss vs. Frequency at Various Temperatures Figure 14. Output Return Loss vs. Frequency at Various Temperatures
6 6 +85°C 6.5V +25°C 7.5V 8.5V 5 –55°C 5 B) 4 B) 4 d d ( ( E E R R 3 3 FIGU FIGU E E OIS OIS N 2 N 2 1 1 0 0 0 5 10 15 20 25 30
012
0 5 10 15 20 25 30
015
FREQUENCY (GHz)
13850-
FREQUENCY (GHz)
13850- Figure 12. Noise Figure vs. Frequency at Various Temperatures Figure 15. Noise Figure vs. Frequency at Various Supply Voltages Rev. B | Page 8 of 17 Document Outline Features Applications General Description Functional Block Diagram Table of Contents Revision History Specifications 0.01 GHz to 3 GHz Frequency Range 3 GHz to 26 GHz Frequency Range 26 GHz to 28 GHz Frequency Range Absolute Maximum Ratings ESD Caution Pin Configuration and Function Descriptions Interface Schematics Typical Performance Characteristics Theory of Operation Applications Information Biasing Procedures Mounting and Bonding Techniques for Millimeterwave GaAs MMICs Handling Precautions Mounting Eutectic Die Attach Epoxy Die Attach Wire Bonding Typical Application Circuit Assembly Diagram Outline Dimensions Ordering Guide