Datasheet HMC8400 (Analog Devices) - 9
| 制造商 | Analog Devices |
| 描述 | 2 GHz to 30 GHz, GaAs pHEMT MMIC Low Noise Amplifier |
| 页数 / 页 | 15 / 9 — Data Sheet. HMC8400. 0.40. 4GHz. 0.38. 10GHz. 16GHz. 22GHz. 28GHz. 0.36. … |
| 修订版 | B |
| 文件格式/大小 | PDF / 313 Kb |
| 文件语言 | 英语 |
Data Sheet. HMC8400. 0.40. 4GHz. 0.38. 10GHz. 16GHz. 22GHz. 28GHz. 0.36. N IO T. Bc). 0.34. D3 (. ISSI. 0.32. D ER W. 0.30. 0.28. 0.26. POUT/TONE (dBm)
该数据表的模型线
文件文字版本
Data Sheet HMC8400 60 0.40 4GHz 0.38 4GHz 10GHz 10GHz 16GHz 16GHz 50 ) 22GHz 22GHz 28GHz 0.36 (W 28GHz N IO T Bc) 0.34 d PA 40 D3 ( ISSI 0.32 IM D ER W 0.30 30 PO 0.28 20 0.26 0 1 2 3 4 5 6 7 8
018
–6 –4 –2 0 2 4 6 8
021
POUT/TONE (dBm) INPUT POWER (dBm)
13852- 13852- Figure 20. IMD3 vs. POUT/Tone for Various Frequencies at VDD = 5 V Figure 23. Power Dissipation vs. Input Power at Various Frequencies, TA = 85°C
60 20 4GHz 10GHz 10 16GHz 50 22GHz 28GHz 0 Bc) B) d d 40 –10 N ( D3 ( AI IM G –20 –2.0V 30 –1.6V 0V –1.4V +0.4V –30 –1.2V +1.0V –1.0V +1.6V –0.8V +2.2V –0.4V +2.6V 20 –40 0 1 2 3 4 5 6 7 8
019
0 5 10 15 20 25 30
032
POUT/TONE (dBm) FREQUENCY (GHz)
13852- 13852- Figure 21. IMD3 vs. POUT/Tone for Various Frequencies at VDD = 6 V Figure 24. Gain vs. Frequency at Various VGG2 Voltage Levels
0 0 –10 +85°C –5 +25°C –55°C –10 –20 ) B) d dB ( –15 ( –30 S S O TION –20 –40 OLA URN L T –25 IS RE –50 –2.0V –30 –1.6V 0V –1.4V +0.4V –60 –1.2V +1.0V –35 –1.0V +1.6V –0.8V +2.2V –0.4V +2.6V –70 –40 0 5 10 15 20 25 30
020
0 5 10 15 20 25 30
033
FREQUENCY (GHz) FREQUENCY (GHz)
13852- 13852- Figure 22. Reverse Isolation vs. Frequency at Various Temperatures Figure 25. Input Return Loss vs. Frequency at Various VGG2 Voltage Levels Rev. B | Page 9 of 15 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM REVISION HISTORY SPECIFICATIONS 2 GHz TO 6 GHz FREQUENCY RANGE 6 GHz TO 20 GHz FREQUENCY RANGE 20 GHz TO 30 GHz FREQUENCY RANGE ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION BIASING PROCEDURES MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICs Handling Precautions Mounting Eutectic Die Attach Epoxy Die Attach Wire Bonding TYPICAL APPLICATION CIRCUIT ASSEMBLY DIAGRAM OUTLINE DIMENSIONS ORDERING GUIDE
018
–6 –4 –2 0 2 4 6 8
021
POUT/TONE (dBm) INPUT POWER (dBm)
13852- 13852- Figure 20. IMD3 vs. POUT/Tone for Various Frequencies at VDD = 5 V Figure 23. Power Dissipation vs. Input Power at Various Frequencies, TA = 85°C
60 20 4GHz 10GHz 10 16GHz 50 22GHz 28GHz 0 Bc) B) d d 40 –10 N ( D3 ( AI IM G –20 –2.0V 30 –1.6V 0V –1.4V +0.4V –30 –1.2V +1.0V –1.0V +1.6V –0.8V +2.2V –0.4V +2.6V 20 –40 0 1 2 3 4 5 6 7 8
019
0 5 10 15 20 25 30
032
POUT/TONE (dBm) FREQUENCY (GHz)
13852- 13852- Figure 21. IMD3 vs. POUT/Tone for Various Frequencies at VDD = 6 V Figure 24. Gain vs. Frequency at Various VGG2 Voltage Levels
0 0 –10 +85°C –5 +25°C –55°C –10 –20 ) B) d dB ( –15 ( –30 S S O TION –20 –40 OLA URN L T –25 IS RE –50 –2.0V –30 –1.6V 0V –1.4V +0.4V –60 –1.2V +1.0V –35 –1.0V +1.6V –0.8V +2.2V –0.4V +2.6V –70 –40 0 5 10 15 20 25 30
020
0 5 10 15 20 25 30
033
FREQUENCY (GHz) FREQUENCY (GHz)
13852- 13852- Figure 22. Reverse Isolation vs. Frequency at Various Temperatures Figure 25. Input Return Loss vs. Frequency at Various VGG2 Voltage Levels Rev. B | Page 9 of 15 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM REVISION HISTORY SPECIFICATIONS 2 GHz TO 6 GHz FREQUENCY RANGE 6 GHz TO 20 GHz FREQUENCY RANGE 20 GHz TO 30 GHz FREQUENCY RANGE ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION BIASING PROCEDURES MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICs Handling Precautions Mounting Eutectic Die Attach Epoxy Die Attach Wire Bonding TYPICAL APPLICATION CIRCUIT ASSEMBLY DIAGRAM OUTLINE DIMENSIONS ORDERING GUIDE