Datasheet HMC8400 (Analog Devices) - 10
| 制造商 | Analog Devices |
| 描述 | 2 GHz to 30 GHz, GaAs pHEMT MMIC Low Noise Amplifier |
| 页数 / 页 | 15 / 10 — HMC8400. Data Sheet. –10. B) d (. –15. S O. Bm). –20. 3 (. URN L. –25. … |
| 修订版 | B |
| 文件格式/大小 | PDF / 313 Kb |
| 文件语言 | 英语 |
HMC8400. Data Sheet. –10. B) d (. –15. S O. Bm). –20. 3 (. URN L. –25. –2.0V. –30. –1.6V. –1.4V. +0.4V. –1.2V. +1.0V. –35. –1.0V. +1.6V. –0.4V. –0.8V. +2.2V. –0.2V
该数据表的模型线
文件文字版本
HMC8400 Data Sheet 0 30 28 –5 26 –10 24 B) d ( –15 S 22 S O Bm) –20 d 20 3 ( URN L IP 18 T –25 RE 16 –2.0V –30 –1.6V 0V –1.4V +0.4V 14 –1.2V +1.0V –35 –1.0V +1.6V 12 –1.2V –0.4V +0.4V +1.6V –0.8V +2.2V –0.8V –0.2V +0.8V +2.0V –0.4V +2.6V –0.6V 0V +1.2V +2.4V –40 10 0 5 10 15 20 25 30
034
2 6 10 14 18 22 26 30
037
FREQUENCY (GHz)
13852-
FREQUENCY (GHz)
13852- Figure 26. Output Return Loss vs. Frequency at Various VGG2 Voltage Levels Figure 29. Output IP3 vs. Frequency at Various VGG2 Voltage Levels
22 16 –1.2V +0.4V 20 –0.8V +0.8V –0.6V +1.2V 12 –0.4V +1.6V 18 –0.2V +2.0V 8 0V +2.4V 16 4 14 0 Bm) B) 12 d d –4 B ( N ( 10 AI 1d G P –8 8 –12 6 4 –16 2 –20 0 –24 2 6 10 14 18 22 26 30
035
2.4 2.0 1.6 1.2 0.8 0.4 0 –0.4 –0.8 –1.2 –1.6 2.0
040
FREQUENCY (GHz)
13852-
VGG2 (V)
13852- Figure 27. P1dB vs. Frequency at Various VGG2 Voltage Levels Figure 30. Gain vs. VGG2 at 10 GHz
22 30 20 18 26 16 14 22 Bm) 12 d Bm) ( d AT 10 3 ( SP IP 18 8 6 –1.2V +0.4V 4 –0.8V +0.8V 14 –0.6V +1.2V –0.4V +1.6V 2 –0.2V +2.0V 0V +2.4V 0 10 2 6 10 14 18 22 26 30
036
2.4 2.0 1.6 1.2 0.8 0.4 0 –0.4 –0.8 –1.2
041
FREQUENCY (GHz)
13852-
VGG2 (V)
13852- Figure 28. PSAT vs. Frequency at Various VGG2 Voltage Levels Figure 31. Output IP3 vs. VGG2 at 10 GHz Rev. B | Page 10 of 15 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM REVISION HISTORY SPECIFICATIONS 2 GHz TO 6 GHz FREQUENCY RANGE 6 GHz TO 20 GHz FREQUENCY RANGE 20 GHz TO 30 GHz FREQUENCY RANGE ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION BIASING PROCEDURES MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICs Handling Precautions Mounting Eutectic Die Attach Epoxy Die Attach Wire Bonding TYPICAL APPLICATION CIRCUIT ASSEMBLY DIAGRAM OUTLINE DIMENSIONS ORDERING GUIDE
034
2 6 10 14 18 22 26 30
037
FREQUENCY (GHz)
13852-
FREQUENCY (GHz)
13852- Figure 26. Output Return Loss vs. Frequency at Various VGG2 Voltage Levels Figure 29. Output IP3 vs. Frequency at Various VGG2 Voltage Levels
22 16 –1.2V +0.4V 20 –0.8V +0.8V –0.6V +1.2V 12 –0.4V +1.6V 18 –0.2V +2.0V 8 0V +2.4V 16 4 14 0 Bm) B) 12 d d –4 B ( N ( 10 AI 1d G P –8 8 –12 6 4 –16 2 –20 0 –24 2 6 10 14 18 22 26 30
035
2.4 2.0 1.6 1.2 0.8 0.4 0 –0.4 –0.8 –1.2 –1.6 2.0
040
FREQUENCY (GHz)
13852-
VGG2 (V)
13852- Figure 27. P1dB vs. Frequency at Various VGG2 Voltage Levels Figure 30. Gain vs. VGG2 at 10 GHz
22 30 20 18 26 16 14 22 Bm) 12 d Bm) ( d AT 10 3 ( SP IP 18 8 6 –1.2V +0.4V 4 –0.8V +0.8V 14 –0.6V +1.2V –0.4V +1.6V 2 –0.2V +2.0V 0V +2.4V 0 10 2 6 10 14 18 22 26 30
036
2.4 2.0 1.6 1.2 0.8 0.4 0 –0.4 –0.8 –1.2
041
FREQUENCY (GHz)
13852-
VGG2 (V)
13852- Figure 28. PSAT vs. Frequency at Various VGG2 Voltage Levels Figure 31. Output IP3 vs. VGG2 at 10 GHz Rev. B | Page 10 of 15 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM REVISION HISTORY SPECIFICATIONS 2 GHz TO 6 GHz FREQUENCY RANGE 6 GHz TO 20 GHz FREQUENCY RANGE 20 GHz TO 30 GHz FREQUENCY RANGE ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION BIASING PROCEDURES MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICs Handling Precautions Mounting Eutectic Die Attach Epoxy Die Attach Wire Bonding TYPICAL APPLICATION CIRCUIT ASSEMBLY DIAGRAM OUTLINE DIMENSIONS ORDERING GUIDE