Datasheet HMC1040CHIPS (Analog Devices) - 7
| 制造商 | Analog Devices |
| 描述 | 20 GHz to 44 GHz, GaAs, pHEMT, MMIC, Low Noise Amplifier |
| 页数 / 页 | 14 / 7 — Data Sheet. HMC1040CHIPS. TYPICAL PERFORMANCE CHARACTERISTICS. B) d ( S … |
| 文件格式/大小 | PDF / 351 Kb |
| 文件语言 | 英语 |
Data Sheet. HMC1040CHIPS. TYPICAL PERFORMANCE CHARACTERISTICS. B) d ( S S. S11. URN L. S21. N (. S22. , RE. B) d. –10. +85°C +25°C. –55°C. AI G. –20
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Data Sheet HMC1040CHIPS TYPICAL PERFORMANCE CHARACTERISTICS 30 30 20 25 B) d ( S S 10 20 O B) S11 d URN L 0 T S21 15 N ( S22 AI , RE G B) d –10 10 +85°C +25°C N ( –55°C AI G –20 5 –30 0 18 20 22 24 26 28 30 32 34 36 38 40 42 44 46
007
20 22 24 26 28 30 32 34 36 38 40 42 44
010
FREQUENCY (GHz) FREQUENCY (GHz)
16709- 16709- Figure 7. Gain and Return Loss vs. Frequency Figure 10. Gain vs. Frequency for Various Temperatures
0 0 –2 –2 +85°C +85°C –4 +25°C –4 +25°C –55°C B) –55°C B) d d –6 ( –6 ( S S S S O O –8 –8 –10 URN L –10 URN L T T –12 RE –12 RE UT UT P –14 –14 INP UT O –16 –16 –18 –18 –20 –20
1 1
20 22 24 26 28 30 32 34 36 38 40 42 44
008
20 22 24 26 28 30 32 34 36 38 40 42 44
0
FREQUENCY (GHz) FREQUENCY (GHz)
16709- 16709- Figure 8. Input Return Loss vs. Frequency for Various Temperatures Figure 11. Output Return Loss vs. Frequency for Various Temperatures
30 0 –2 2.0V 25 –4 2.5V 3.0V B) d –6 ( 20 S S O –8 B) d 15 N ( –10 URN L AI T G –12 RE 10 2.0V UT –14 2.5V 3.0V INP –16 5 –18 0 –20 20 22 24 26 28 30 32 34 36 38 40 42 44
009
20 22 24 26 28 30 32 34 36 38 40 42 44
012
FREQUENCY (GHz)
16709-
FREQUENCY (GHz)
16709- Figure 9. Gain vs. Frequency for Various Supply Voltages Figure 12. Input Return Loss vs. Frequency for Various Supply Voltages Rev. 0 | Page 7 of 14 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS 20 GHz TO 24 GHz FREQUENCY RANGE 24 GHz TO 32 GHz FREQUENCY RANGE 32 GHz TO 40 GHz FREQUENCY RANGE 40 GHz TO 44 GHz FREQUENCY RANGE ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION RECOMMENDED BIAS SEQUENCING MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICS Handling Precautions TYPICAL APPLICATION CIRCUIT ASSEMBLY DIAGRAM OUTLINE DIMENSIONS ORDERING GUIDE
007
20 22 24 26 28 30 32 34 36 38 40 42 44
010
FREQUENCY (GHz) FREQUENCY (GHz)
16709- 16709- Figure 7. Gain and Return Loss vs. Frequency Figure 10. Gain vs. Frequency for Various Temperatures
0 0 –2 –2 +85°C +85°C –4 +25°C –4 +25°C –55°C B) –55°C B) d d –6 ( –6 ( S S S S O O –8 –8 –10 URN L –10 URN L T T –12 RE –12 RE UT UT P –14 –14 INP UT O –16 –16 –18 –18 –20 –20
1 1
20 22 24 26 28 30 32 34 36 38 40 42 44
008
20 22 24 26 28 30 32 34 36 38 40 42 44
0
FREQUENCY (GHz) FREQUENCY (GHz)
16709- 16709- Figure 8. Input Return Loss vs. Frequency for Various Temperatures Figure 11. Output Return Loss vs. Frequency for Various Temperatures
30 0 –2 2.0V 25 –4 2.5V 3.0V B) d –6 ( 20 S S O –8 B) d 15 N ( –10 URN L AI T G –12 RE 10 2.0V UT –14 2.5V 3.0V INP –16 5 –18 0 –20 20 22 24 26 28 30 32 34 36 38 40 42 44
009
20 22 24 26 28 30 32 34 36 38 40 42 44
012
FREQUENCY (GHz)
16709-
FREQUENCY (GHz)
16709- Figure 9. Gain vs. Frequency for Various Supply Voltages Figure 12. Input Return Loss vs. Frequency for Various Supply Voltages Rev. 0 | Page 7 of 14 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS 20 GHz TO 24 GHz FREQUENCY RANGE 24 GHz TO 32 GHz FREQUENCY RANGE 32 GHz TO 40 GHz FREQUENCY RANGE 40 GHz TO 44 GHz FREQUENCY RANGE ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION RECOMMENDED BIAS SEQUENCING MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICS Handling Precautions TYPICAL APPLICATION CIRCUIT ASSEMBLY DIAGRAM OUTLINE DIMENSIONS ORDERING GUIDE