Datasheet HMC903 (Analog Devices) - 6
| 制造商 | Analog Devices |
| 描述 | 6 GHz to 18 GHz GaAs, pHEMT, MMIC, Low Noise Amplifier |
| 页数 / 页 | 13 / 6 — HMC903. Data Sheet. TYPICAL PERFORMANCE CHARACTERISTICS. +85°C. B) d. … |
| 修订版 | C |
| 文件格式/大小 | PDF / 212 Kb |
| 文件语言 | 英语 |
HMC903. Data Sheet. TYPICAL PERFORMANCE CHARACTERISTICS. +85°C. B) d. +25°C. ( S. –55°C. S11 S21. URN L. S22. B) d N ( AI. N AND RE. –15. ADBAND G
该数据表的模型线
文件文字版本
HMC903 Data Sheet TYPICAL PERFORMANCE CHARACTERISTICS 25 25 +85°C B) d +25°C ( S –55°C S 15 23 O S11 S21 URN L S22 T 5 21 B) d N ( AI N AND RE –5 G 19 AI –15 17 ADBAND G BRO –25 15
1 1
3 5 7 9 11 13 15 17 19 21
008
6 8 10 12 14 16 18
0
FREQUENCY (GHz) FREQUENCY (GHz)
14481- 14481- Figure 8. Broadband Gain and Return Loss vs. Frequency Figure 11. Gain vs. Frequency at Various Temperature
0 0 +85°C +85°C +25°C +25°C –55°C –40°C –5 –5 B) B) d d ( ( S –10 S –10 S S O O –15 URN L –15 URN L T T RE RE –20 UT –20 UT P INP UT O –25 –25 –30 –30 6 8 10 12 14 16 18
009
6 8 10 12 14 16 18
012
FREQUENCY (GHz) FREQUENCY (GHz)
14481- 14481- Figure 9. Input Return Loss vs. Frequency at Various Temperatures Figure 12. Output Return Loss vs. Frequency at Various Temperatures
6 35 +85°C +85°C +25°C +25°C –55°C 5 30 –40°C ) 4 dB 25 ( Bm) E d R 3 ( 3 P I 20 FIGU E UT P OIS UT 2 N 15 O 1 10 0 5 6 8 10 12 14 16 18
010
6 8 10 12 14 16 18
013
FREQUENCY (GHz)
14481-
FREQUENCY (GHz)
14481- Figure 10. Noise Figure vs. Frequency at Various Temperatures Figure 13. Output IP3 vs. Frequency as Various Temperatures Rev. C | Page 6 of 13 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ELECTRICAL SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICS HANDLING PRECAUTIONS Storage Cleanliness Static Sensitivity Transients General Handling Mounting Eutectic Die Attach Epoxy Die Attach Wire Bonding TYPICAL APPLICATION CIRCUITS ASSEMBLY DIAGRAMS OUTLINE DIMENSIONS ORDERING GUIDE
1 1
3 5 7 9 11 13 15 17 19 21
008
6 8 10 12 14 16 18
0
FREQUENCY (GHz) FREQUENCY (GHz)
14481- 14481- Figure 8. Broadband Gain and Return Loss vs. Frequency Figure 11. Gain vs. Frequency at Various Temperature
0 0 +85°C +85°C +25°C +25°C –55°C –40°C –5 –5 B) B) d d ( ( S –10 S –10 S S O O –15 URN L –15 URN L T T RE RE –20 UT –20 UT P INP UT O –25 –25 –30 –30 6 8 10 12 14 16 18
009
6 8 10 12 14 16 18
012
FREQUENCY (GHz) FREQUENCY (GHz)
14481- 14481- Figure 9. Input Return Loss vs. Frequency at Various Temperatures Figure 12. Output Return Loss vs. Frequency at Various Temperatures
6 35 +85°C +85°C +25°C +25°C –55°C 5 30 –40°C ) 4 dB 25 ( Bm) E d R 3 ( 3 P I 20 FIGU E UT P OIS UT 2 N 15 O 1 10 0 5 6 8 10 12 14 16 18
010
6 8 10 12 14 16 18
013
FREQUENCY (GHz)
14481-
FREQUENCY (GHz)
14481- Figure 10. Noise Figure vs. Frequency at Various Temperatures Figure 13. Output IP3 vs. Frequency as Various Temperatures Rev. C | Page 6 of 13 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ELECTRICAL SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICS HANDLING PRECAUTIONS Storage Cleanliness Static Sensitivity Transients General Handling Mounting Eutectic Die Attach Epoxy Die Attach Wire Bonding TYPICAL APPLICATION CIRCUITS ASSEMBLY DIAGRAMS OUTLINE DIMENSIONS ORDERING GUIDE