HMC752LC4 v02.0618 GaAs HEMT MMIC LOW NOISEAMPLIFIER, 24 - 28 GHzOutline Drawing24-Terminal Ceramic Leadless Chip Carrier [LCC](E-24-1)Dimensions shown in millimeters. T M 4.050.363.90 SQ E - S 0.30PIN 13.750.080.24INDICATOR IS BSCPIN 11924181 O 0.50BSC2.60EXPOSEDPAD2.50 SQ W N 2.40 O 136127TOP VIEW0.32BOTTOM VIEWBSC S - L 2.50 REF1.00 R 3.10 BSC0.90SIDE VIEW IE 0.80FOR PROPER CONNECTION OFTHE EXPOSED PAD, REFER TOTHE PIN CONFIGURATION ANDSEATING LIF FUNCTION DESCRIPTIONSPLANESECTION OF THIS DATA SHEET. P M A PKG-00484002-27-2017-B 24-Terminal Ceramic Leadless Chip Carrier [LCC] (E-24-1) Dimensions shown in millimeters. Package Information Part Number Package Body Material Lead Finish MSL Rating Package Marking [2] HMC752LC4 Alumina, White Gold over Nickel MSL3 [1] H752 XXXX [1] Max peak reflow temperature of 260 °C [2] 4-Digit lot number XXXX For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com 5 Application Support: Phone: 1-800-ANALOG-D Document Outline Typical Applications Features Functional Diagram General Description Electrical Specifications Gain, Noise Figure & P1dB vs. Supply Voltage @ 28 GHz Power Compression @ 28 GHz Reverse Isolation vs. Temperature Psat vs. Temperature P1dB vs. Temperature Output IP3 vs. Idd Output IP3 vs. Temperature Noise Figure vs. Idd Noise Figure vs. Temperature Output Return Loss vs. Temperature Input Return Loss vs. Temperature Gain vs. Idd Gain vs. Temperature P1dB vs. Idd Absolute Maximum Ratings