Datasheet HMC-AUH312 (Analog Devices) - 3
| 制造商 | Analog Devices |
| 描述 | 0.5 GHz to 80 GHz, GaAs, HEMT, MMIC, Low Noise Wideband Amplifier |
| 页数 / 页 | 17 / 3 — Data Sheet. HMC-AUH312. SPECIFICATIONS. 0.5 GHz to 60 GHz FREQUENCY … |
| 修订版 | F |
| 文件格式/大小 | PDF / 473 Kb |
| 文件语言 | 英语 |
Data Sheet. HMC-AUH312. SPECIFICATIONS. 0.5 GHz to 60 GHz FREQUENCY RANGE. Table 1. Parameter
该数据表的模型线
文件文字版本
Data Sheet HMC-AUH312 SPECIFICATIONS
TA = 25°C, VDD = 8 V, VGG2 = 1.8 V, IDD = 60 mA, unless otherwise noted.
0.5 GHz to 60 GHz FREQUENCY RANGE Table 1. Parameter Symbol Min Typ Max Unit Test Conditions/Comments
FREQUENCY RANGE 0.5 60 GHz GAIN 8 10 dB RETURN LOSS Input 15 dB Output 17 dB OUTPUT Output Power for 1 dB P1dB 13.5 dBm Compression Saturated Output Power PSAT 16 dBm Output Third-Order Intercept IP3 23 dBm NOISE FIGURE 5 dB SUPPLY CURRENT IDD 60 mA VDD = 8 V, adjust VGG1 between −2 V and 0 V to achieve IDD = 60 mA typical
60 GHz TO 80 GHz FREQUENCY RANGE Table 2. Parameter Symbol Min Typ Max Unit Test Conditions/Comments
FREQUENCY RANGE 60 80 GHz GAIN 9 dB RETURN LOSS Input 10 dB Output 15 dB OUTPUT Output Power for 1 dB P1dB 13 dBm Compression Saturated Output Power PSAT 15 dBm Output Third-Order Intercept IP3 22 dBm NOISE FIGURE dB SUPPLY CURRENT IDD 60 mA VDD = 8 V, adjust VGG1 between −2 V and 0 V to achieve IDD = 60 mA typical
RECOMMENDED OPERATING CONDITIONS Table 3. Recommended Operating Conditions with Bias Tee Parameter Symbol Min Typ Max Unit
POSITIVE SUPPLY Voltage 3 5 6 V Current 60 80 mA GATE VOLTAGE Gate Voltage 1 VGG1 −1 +0.3 V Gate Voltage 2 VGG2 1.8 V POWER DISSIPATION 300 mW RF INPUT POWER 4 dBm OPERATING TEMPERATURE −55 +25 +85 °C Rev. F | Page 3 of 4 Document Outline Features Applications Functional Block Diagram General Description Table of Contents Revision History Specifications 0.5 GHz to 60 GHz Frequency Range 60 GHz to 80 GHz Frequency Range Recommended Operating Conditions Absolute Maximum Ratings ESD Caution Pin Configuration and Function Descriptions Interface Schematics Typical Performance Characteristics Theory of Operation Applications Information Applications Overview Device Mounting Device Operation Device Power-Up Instructions Device Power-Down Instructions Mounting and Bonding Techniques for Millimeterwave GaAs MMICs Handling Guidelines for ESD Protection of GaAs MMICs Handling Precautions Opening the Protective Packaging Storage Cleanliness Static Sensitivity Transients General Handling Mounting Techniques Eutectic Die Attach Epoxy Die Attach Wire Bonding Outline Dimensions Ordering Guide
TA = 25°C, VDD = 8 V, VGG2 = 1.8 V, IDD = 60 mA, unless otherwise noted.
0.5 GHz to 60 GHz FREQUENCY RANGE Table 1. Parameter Symbol Min Typ Max Unit Test Conditions/Comments
FREQUENCY RANGE 0.5 60 GHz GAIN 8 10 dB RETURN LOSS Input 15 dB Output 17 dB OUTPUT Output Power for 1 dB P1dB 13.5 dBm Compression Saturated Output Power PSAT 16 dBm Output Third-Order Intercept IP3 23 dBm NOISE FIGURE 5 dB SUPPLY CURRENT IDD 60 mA VDD = 8 V, adjust VGG1 between −2 V and 0 V to achieve IDD = 60 mA typical
60 GHz TO 80 GHz FREQUENCY RANGE Table 2. Parameter Symbol Min Typ Max Unit Test Conditions/Comments
FREQUENCY RANGE 60 80 GHz GAIN 9 dB RETURN LOSS Input 10 dB Output 15 dB OUTPUT Output Power for 1 dB P1dB 13 dBm Compression Saturated Output Power PSAT 15 dBm Output Third-Order Intercept IP3 22 dBm NOISE FIGURE dB SUPPLY CURRENT IDD 60 mA VDD = 8 V, adjust VGG1 between −2 V and 0 V to achieve IDD = 60 mA typical
RECOMMENDED OPERATING CONDITIONS Table 3. Recommended Operating Conditions with Bias Tee Parameter Symbol Min Typ Max Unit
POSITIVE SUPPLY Voltage 3 5 6 V Current 60 80 mA GATE VOLTAGE Gate Voltage 1 VGG1 −1 +0.3 V Gate Voltage 2 VGG2 1.8 V POWER DISSIPATION 300 mW RF INPUT POWER 4 dBm OPERATING TEMPERATURE −55 +25 +85 °C Rev. F | Page 3 of 4 Document Outline Features Applications Functional Block Diagram General Description Table of Contents Revision History Specifications 0.5 GHz to 60 GHz Frequency Range 60 GHz to 80 GHz Frequency Range Recommended Operating Conditions Absolute Maximum Ratings ESD Caution Pin Configuration and Function Descriptions Interface Schematics Typical Performance Characteristics Theory of Operation Applications Information Applications Overview Device Mounting Device Operation Device Power-Up Instructions Device Power-Down Instructions Mounting and Bonding Techniques for Millimeterwave GaAs MMICs Handling Guidelines for ESD Protection of GaAs MMICs Handling Precautions Opening the Protective Packaging Storage Cleanliness Static Sensitivity Transients General Handling Mounting Techniques Eutectic Die Attach Epoxy Die Attach Wire Bonding Outline Dimensions Ordering Guide