Datasheet HMC606LC5 (Analog Devices) - 9
制造商 | Analog Devices |
描述 | GaAs, InGaP, HBT, MMIC, Ultralow Phase Noise, Distributed Amplifier, 2 GHz to 18 GHz |
页数 / 页 | 9 / 9 — Data Sheet. HMC606LC5. OUTLINE DIMENSIONS. 5.05. 0.36. 4.90 SQ. 0.30. PIN … |
修订版 | J |
文件格式/大小 | PDF / 204 Kb |
文件语言 | 英语 |
Data Sheet. HMC606LC5. OUTLINE DIMENSIONS. 5.05. 0.36. 4.90 SQ. 0.30. PIN 1. 4.75. 0.08. INDICATOR. 0.24. REF. 0.50. BSC. 3.60. EXPOSED. PAD. 3.50 SQ 3.40
该数据表的模型线
文件文字版本
link to page 4
Data Sheet HMC606LC5 OUTLINE DIMENSIONS 5.05 0.36 4.90 SQ 0.30 PIN 1 4.75 0.08 INDICATOR 0.24 REF PIN 1 25 32 24 1 0.50 BSC 3.60 EXPOSED PAD 3.50 SQ 3.40 17 8 16 9 0.38 0.20 MIN BOTTOM VIEW TOP VIEW 0.32 3.50 REF 0.26 1.10 4.10 REF SIDE VIEW 1.00 0.90 FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND SEATING FUNCTION DESCRIPTIONS PLANE SECTION OF THIS DATA SHEET. D 2017- -004843 24- G K P 04-
Figure 18. 32-Terminal Ceramic Leadless Chip Carrier [LCC] (E-32-1) Dimensions shown in millimeters
ORDERING GUIDE Model1 Temperature Range MSL Rating2 Package Description Package Option
HMC606LC5 −40°C to +85°C MSL3 32-Terminal Ceramic Leadless Chip Carrier [LCC] E-32-1 HMC606LC5TR −40°C to +85°C MSL3 32-Terminal Ceramic Leadless Chip Carrier [LCC] E-32-1 HMC606LC5TR-R5 −40°C to +85°C MSL3 32-Terminal Ceramic Leadless Chip Carrier [LCC] E-32-1 117156-HMC606LC5 Evaluation Board 1 All models are RoHS Compliant. 2 See the Absolute Maximum Ratings section.
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Rev. J | Page 9 of 9 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ELECTRICAL SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS APPLICATIONS INFORMATION EVALUATION PRINTED CIRCUIT BOARD (PCB) OUTLINE DIMENSIONS ORDERING GUIDE