Datasheet ADPA7001CHIPS (Analog Devices) - 8
| 制造商 | Analog Devices |
| 描述 | 50 GHz to 95 GHz, GaAs, pHEMT, MMIC, Wideband Power Amplifier |
| 页数 / 页 | 18 / 8 — ADPA7001CHIPS. Data Sheet. TYPICAL PERFORMANCE CHARACTERISTICS. (d S S. O … |
| 修订版 | B |
| 文件格式/大小 | PDF / 1.0 Mb |
| 文件语言 | 英语 |
ADPA7001CHIPS. Data Sheet. TYPICAL PERFORMANCE CHARACTERISTICS. (d S S. O L N. S11. S21. S22. RE D. (dB. –10. AI G. –15. 1.5V. 2.0V. 2.5V. –20. 3.0V. A O
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文件文字版本
ADPA7001CHIPS Data Sheet TYPICAL PERFORMANCE CHARACTERISTICS 20 22 B) 15 20 (d S S 10 18 O L N 16 5 S11 UR S21 T 14 0 S22 ) RE D 12 –5 (dB AN IN 10 N –10 GA AI G 8 D –15 1.5V 6 AN 2.0V 2.5V –20 DB 4 3.0V A O 3.5V –25 2 4.0V BR –30 0 40 50 60 70 80 90 100
011
45 55 66 77 85 95
5- -014
FREQUENCY (GHz)
895 1689
FREQUENCY (GHz)
16 Figure 11. Broadband Gain and Return Loss vs. Frequency Figure 14. Gain vs. Frequency for Various VDD Values
20 0 18 +85°C –5 +25°C 16 –55°C B) 14 (d S –10 S ) 12 O B L d ( 10 RN –15 IN U T GA 8 RE +85°C T –20 6 +25°C U P –55°C IN 4 –25 2 0
2
–30
5
45 55 66 77 85 95
01 01 5-
45 55 66 77 85 95
5-
FREQUENCY (GHz)
1689
FREQUENCY (GHz)
1689 Figure 12. Gain vs. Frequency for Various Temperatures Figure 15. Input Return Loss vs. Frequency at Various Temperatures
20 0 18 200mA –5 16 250mA 300mA B) 350mA 14 (d 400mA S –10 450mA S ) 12 O L dB ( 10 RN –15 IN A U T G 8 RE 200mA T –20 6 U 250mA P 300mA IN 4 350mA 400mA –25 2 450mA 0
3
–30
6
45 55 66 77 85 95
01 01 5-
45 55 66 77 85 95
5-
FREQUENCY (GHz)
1689
FREQUENCY (GHz)
1689 Figure 13. Gain vs. Frequency for Various IDQ Values Figure 16. Input Return Loss vs. Frequency for Various IDQ Values Rev. B | Page 8 of 18 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION REVISION HISTORY SPECIFICATIONS 50 GHz TO 70 GHz FREQUENCY RANGE 70 GHz TO 90 GHz FREQUENCY RANGE 90 GHz TO 95 GHz FREQUENCY RANGE ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICS Handling Precautions Mounting Wire Bonding TYPICAL APPLICATION CIRCUIT ASSEMBLY DIAGRAM OUTLINE DIMENSIONS ORDERING GUIDE
011
45 55 66 77 85 95
5- -014
FREQUENCY (GHz)
895 1689
FREQUENCY (GHz)
16 Figure 11. Broadband Gain and Return Loss vs. Frequency Figure 14. Gain vs. Frequency for Various VDD Values
20 0 18 +85°C –5 +25°C 16 –55°C B) 14 (d S –10 S ) 12 O B L d ( 10 RN –15 IN U T GA 8 RE +85°C T –20 6 +25°C U P –55°C IN 4 –25 2 0
2
–30
5
45 55 66 77 85 95
01 01 5-
45 55 66 77 85 95
5-
FREQUENCY (GHz)
1689
FREQUENCY (GHz)
1689 Figure 12. Gain vs. Frequency for Various Temperatures Figure 15. Input Return Loss vs. Frequency at Various Temperatures
20 0 18 200mA –5 16 250mA 300mA B) 350mA 14 (d 400mA S –10 450mA S ) 12 O L dB ( 10 RN –15 IN A U T G 8 RE 200mA T –20 6 U 250mA P 300mA IN 4 350mA 400mA –25 2 450mA 0
3
–30
6
45 55 66 77 85 95
01 01 5-
45 55 66 77 85 95
5-
FREQUENCY (GHz)
1689
FREQUENCY (GHz)
1689 Figure 13. Gain vs. Frequency for Various IDQ Values Figure 16. Input Return Loss vs. Frequency for Various IDQ Values Rev. B | Page 8 of 18 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION REVISION HISTORY SPECIFICATIONS 50 GHz TO 70 GHz FREQUENCY RANGE 70 GHz TO 90 GHz FREQUENCY RANGE 90 GHz TO 95 GHz FREQUENCY RANGE ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICS Handling Precautions Mounting Wire Bonding TYPICAL APPLICATION CIRCUIT ASSEMBLY DIAGRAM OUTLINE DIMENSIONS ORDERING GUIDE