Datasheet HMC559 (Analog Devices) - 5
| 制造商 | Analog Devices |
| 描述 | GaAs PHEMT MMIC POWER AMPLIFIER, DC - 20 GHz |
| 页数 / 页 | 8 / 5 — HMC559. GaAs PHEMT MMIC. POWER AMPLIFIER, DC - 20 GHz. Outline Drawing. … |
| 文件格式/大小 | PDF / 434 Kb |
| 文件语言 | 英语 |
HMC559. GaAs PHEMT MMIC. POWER AMPLIFIER, DC - 20 GHz. Outline Drawing. Die Packaging Information. 3 - 66
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HMC559
v03.0208
GaAs PHEMT MMIC POWER AMPLIFIER, DC - 20 GHz Outline Drawing
3 IP H S - C R IE IF L P M R A E W O
Die Packaging Information
[1] NOTES: 1. ALL DIMENSIONS IN INCHES [MILLIMETERS] Standard Alternate 2. DIE THICKNESS IS 0.004 (0.100) 3. TYPICAL BOND PAD IS 0.004 (0.100) SQUARE GP-1 (Gel Pack) [2] 4. BOND PAD METALIZATION: GOLD [1] Refer to the “Packaging Information” section for die R & P 5. BACKSIDE METALLIZATION: GOLD packaging dimensions. 6. BACKSIDE METAL IS GROUND A 7. NO CONNECTION REQUIRED FOR UNLABELED BOND PADS [2] For alternate packaging information contact Hittite E 8. OVERALL DIE SIZE IS ±.002 Microwave Corporation. IN L Information furnish F ed obr pri y Anal ce, de og Device li s vie s r beyli, a eve nd to pla d to be accura ce o te and rder reliabl s e , pl . Ho ease co wever, no For price, delivery, and to place orders: Analog Devices, Inc., responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other ntact Hittite Microwave Corporation: One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 rights of third parties that may result from its use. Specifications subject to change without notice. No
3 - 66
20 Alpha Road, Chelmsford, MA 01824 Phone: 978 Phon - e 25 : 7 0 81--3 32 3 9 4 - 3 F 70 ax 0 • O : 978 rder on -li25 n 0 e a - t 33 ww 73 license is granted by implication or otherwise under any patent or patent rights of Analog Devices. w.analog.com Order On Trademarks and registered trademarks are the property of their respective owners. -line at www.h A it p tpite.co licatio m n Support: Phone: 1-800-ANALOG-D
v03.0208
GaAs PHEMT MMIC POWER AMPLIFIER, DC - 20 GHz Outline Drawing
3 IP H S - C R IE IF L P M R A E W O
Die Packaging Information
[1] NOTES: 1. ALL DIMENSIONS IN INCHES [MILLIMETERS] Standard Alternate 2. DIE THICKNESS IS 0.004 (0.100) 3. TYPICAL BOND PAD IS 0.004 (0.100) SQUARE GP-1 (Gel Pack) [2] 4. BOND PAD METALIZATION: GOLD [1] Refer to the “Packaging Information” section for die R & P 5. BACKSIDE METALLIZATION: GOLD packaging dimensions. 6. BACKSIDE METAL IS GROUND A 7. NO CONNECTION REQUIRED FOR UNLABELED BOND PADS [2] For alternate packaging information contact Hittite E 8. OVERALL DIE SIZE IS ±.002 Microwave Corporation. IN L Information furnish F ed obr pri y Anal ce, de og Device li s vie s r beyli, a eve nd to pla d to be accura ce o te and rder reliabl s e , pl . Ho ease co wever, no For price, delivery, and to place orders: Analog Devices, Inc., responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other ntact Hittite Microwave Corporation: One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 rights of third parties that may result from its use. Specifications subject to change without notice. No
3 - 66
20 Alpha Road, Chelmsford, MA 01824 Phone: 978 Phon - e 25 : 7 0 81--3 32 3 9 4 - 3 F 70 ax 0 • O : 978 rder on -li25 n 0 e a - t 33 ww 73 license is granted by implication or otherwise under any patent or patent rights of Analog Devices. w.analog.com Order On Trademarks and registered trademarks are the property of their respective owners. -line at www.h A it p tpite.co licatio m n Support: Phone: 1-800-ANALOG-D