Datasheet ESDCAN03-2BM3Y (STMicroelectronics) - 7
| 制造商 | STMicroelectronics |
| 描述 | Automotive dual-line TVS in DFN for CAN bus |
| 页数 / 页 | 15 / 7 — ESDCAN03-2BM3Y. Package information. 2.1. QFN-3L 1.1 x 1.0 x 0.55 package … |
| 文件格式/大小 | PDF / 1.4 Mb |
| 文件语言 | 英语 |
ESDCAN03-2BM3Y. Package information. 2.1. QFN-3L 1.1 x 1.0 x 0.55 package information
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ESDCAN03-2BM3Y Package information 2 Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark.
2.1 QFN-3L 1.1 x 1.0 x 0.55 package information Figure 15. QFN-3L 1.1 x 1.0 x 0.55 package outline
Note: The marking codes can be rotated to differentiate assembly location. In no case should this product marking be used to orient the component for its placement on a PCB. Only pin 1 mark is to be used for this purpose.
DS13559
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Rev 2 page 7/15
Document Outline 1 Characteristics 1.1 Characteristics (curves) 2 Package information 2.1 QFN-3L 1.1 x 1.0 x 0.55 package information 2.2 Packing information 3 Recommendation on PCB assembly 3.1 Footprint 3.2 Stencil opening design 3.3 Wettable flank profile 3.4 Solder paste 3.5 Placement 3.6 PCB design preference 3.7 Reflow profile 4 Ordering information Revision history
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark.
2.1 QFN-3L 1.1 x 1.0 x 0.55 package information Figure 15. QFN-3L 1.1 x 1.0 x 0.55 package outline
Note: The marking codes can be rotated to differentiate assembly location. In no case should this product marking be used to orient the component for its placement on a PCB. Only pin 1 mark is to be used for this purpose.
DS13559
-
Rev 2 page 7/15
Document Outline 1 Characteristics 1.1 Characteristics (curves) 2 Package information 2.1 QFN-3L 1.1 x 1.0 x 0.55 package information 2.2 Packing information 3 Recommendation on PCB assembly 3.1 Footprint 3.2 Stencil opening design 3.3 Wettable flank profile 3.4 Solder paste 3.5 Placement 3.6 PCB design preference 3.7 Reflow profile 4 Ordering information Revision history