Datasheet ASMT-Rx45-xxxxx (Broadcom) - 4
| 制造商 | Broadcom |
| 描述 | 0.45mm Leadframe-Based Surface Mount ChipLED |
| 页数 / 页 | 9 / 4 — ASMT-Rx45-xxxxx. Figure 1: Relative Intensity vs. Wavelength. Figure 2: … |
| 文件格式/大小 | PDF / 511 Kb |
| 文件语言 | 英语 |
ASMT-Rx45-xxxxx. Figure 1: Relative Intensity vs. Wavelength. Figure 2: Forward Current vs. Forward Voltage. 100. ORANGE. AMBER
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ASMT-Rx45-xxxxx
Data Sheet 0.45-mm Leadframe-Based Surface Mount ChipLED
Figure 1: Relative Intensity vs. Wavelength Figure 2: Forward Current vs. Forward Voltage 1 100 ORANGE AMBER 0.9 RED 0.8 YELLOW 0.7 GREEN AMBER/ 0.6 ORANGE YELLOW GREEN RED 0.5 10 0.4 0.3 RELATIVE INTENSITY - FORWARD CURRENT - mA 0.2 IF 0.1 0 1 380 430 480 530 580 630 680 730 780 0.00 0.50 1.00 1.50 2.00 2.50 3.00 3.50 WAVELENGTH-nm V F - FORWARD VOLTAGE - V Figure 3: Luminous Intensity vs. Forward Current Figure 4: Maximum Forward Current vs. Ambient Temper- ature. Derated based on TJMAX = 110°C, R
JA = 465°C/W. 1.40 25 1.20 20 1.00 15 0.80 0.60 10 (NORMALIZED AT 20mA) 0.40 RELATIVE LUMINOUS INTENSITY MAX. FORWARD CURRENT - mA 5 0.20 0.00 0 0 5 10 15 20 25 30 0 20 40 60 80 100 120 IF - FORWARD CURRENT - mA AMBIENT TEMPERATURE - °C Figure 5: Radiation Pattern Figure 6: Recommended Soldering Land Pattern 1.0 0.9 0.8 0.8 (0.031) 0.7 0.6 0.5 0.4 0.8 0.7 0.8 (0.031) (0.028) (0.031) RELATIVE INTENSITY 0.3 0.2 0.1
1. All dimensions are in millimeters (inches).
0.0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
2. Tolerance is ±0.1 mm (±0.004 in.) unless otherwise
ANGLE
specified. Broadcom AV02-0378EN 4 Document Outline Description Features Applications Package Dimensions Device Selection Guide Part Numbering System Absolute Maximum Ratings at TA = 25°C Electrical Characteristics at TA = 25°C Optical Characteristics at TA = 25°C Intensity Bin Select (X3X4) Light Intensity (IV) Bin Limits Color Bin Select (X5) Packaging Option (X6) Forward Voltage (VF) Bin Limits Color Bin Limits Yellow Green Color Bin Yellow/Amber Color Bin Orange Color Bin Red Color Bin Red Orange Color Bin Moisture Sensitivity
Data Sheet 0.45-mm Leadframe-Based Surface Mount ChipLED
Figure 1: Relative Intensity vs. Wavelength Figure 2: Forward Current vs. Forward Voltage 1 100 ORANGE AMBER 0.9 RED 0.8 YELLOW 0.7 GREEN AMBER/ 0.6 ORANGE YELLOW GREEN RED 0.5 10 0.4 0.3 RELATIVE INTENSITY - FORWARD CURRENT - mA 0.2 IF 0.1 0 1 380 430 480 530 580 630 680 730 780 0.00 0.50 1.00 1.50 2.00 2.50 3.00 3.50 WAVELENGTH-nm V F - FORWARD VOLTAGE - V Figure 3: Luminous Intensity vs. Forward Current Figure 4: Maximum Forward Current vs. Ambient Temper- ature. Derated based on TJMAX = 110°C, R
JA = 465°C/W. 1.40 25 1.20 20 1.00 15 0.80 0.60 10 (NORMALIZED AT 20mA) 0.40 RELATIVE LUMINOUS INTENSITY MAX. FORWARD CURRENT - mA 5 0.20 0.00 0 0 5 10 15 20 25 30 0 20 40 60 80 100 120 IF - FORWARD CURRENT - mA AMBIENT TEMPERATURE - °C Figure 5: Radiation Pattern Figure 6: Recommended Soldering Land Pattern 1.0 0.9 0.8 0.8 (0.031) 0.7 0.6 0.5 0.4 0.8 0.7 0.8 (0.031) (0.028) (0.031) RELATIVE INTENSITY 0.3 0.2 0.1
1. All dimensions are in millimeters (inches).
0.0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
2. Tolerance is ±0.1 mm (±0.004 in.) unless otherwise
ANGLE
specified. Broadcom AV02-0378EN 4 Document Outline Description Features Applications Package Dimensions Device Selection Guide Part Numbering System Absolute Maximum Ratings at TA = 25°C Electrical Characteristics at TA = 25°C Optical Characteristics at TA = 25°C Intensity Bin Select (X3X4) Light Intensity (IV) Bin Limits Color Bin Select (X5) Packaging Option (X6) Forward Voltage (VF) Bin Limits Color Bin Limits Yellow Green Color Bin Yellow/Amber Color Bin Orange Color Bin Red Color Bin Red Orange Color Bin Moisture Sensitivity