Datasheet TS3702 (STMicroelectronics) - 6

Package information TS3702 4 Package information
In order to meet environmental requirements, STMicroelectronics offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an STMicroelectronics trademark. ECOPACK specifications are available at: www.st.com. 6/11 Document Outline 1 Schematic diagram Figure 1. Schematic diagram (for 1/2 TS3702) 2 Absolute maximum ratings and operating conditions Table 1. Absolute maximum ratings Table 2. Operating conditions 3 Electrical characteristics Table 3. VCC+ = 3V, Vcc- = 0V, Tamb = 25˚C (unless otherwise specified) Table 4. VCC+ = 5V, Vcc- = 0V, Tamb = 25˚C (unless otherwise specified) 4 Package information 4.1 DIP8 package mechanical data 4.2 SO8 package mechanical data 4.3 TSSOP8 package mechanical data 5 Ordering information Table 5. Order codes 6 Revision history