CharacteristicsESDAxxSCx1 CharacteristicsTable 2. Absolute ratings (Tamb = 25 °C)SymbolParameterValueUnit MIL STD 883E - Method 3015-7 VPP ESD discharge IEC61000-4-2 air discharge 30 kV IEC61000-4-2 contact discharge ESDA5V3SCx 300 W ESDA6V1SCx PPP Peak pulse power (8/20µs) ESDA14V2SCx ESDA19SC6 400 W ESDA25SC6 ESDA5V3SCx 22 ESDA6V1SCx 18 IPP Peak pulse current ESDA14V2SCx 14 A ESDA19SC6 13 ESDA25SC6 9 Tstg Storage temperature range -55 to +150 °C TL Maximum lead temperature for soldering during 10 s 260 °C Top Operating junction temperature range -55 to +150 °C Table 3. Electrical characteristics - definitions (Tamb = 25 °C)SymbolParameterI V I RM Stand-off voltage F VBR Breakdown voltage VVCL Clamping voltage BRVV I RMF RM Leakage current @ VRM VCLV I I PP Peak pulse current RM αT Voltage temperature coefficient C Capacitance R Rd d Dynamic resistance I PP VF Forward voltage drop 2/9 DocID7056 Rev 10 Document Outline Figure 1. ESDAxxSC5 functional diagram Figure 2. ESDAxxSC6 functional diagram Table 1. Device summary 1 Characteristics Table 2. Absolute ratings (Tamb = 25 °C) Table 3. Electrical characteristics - definitions (Tamb = 25 °C) Table 4. Electrical characteristics - values (Tamb = 25 °C) Figure 3. Peak power dissipation versus initial junction temperature Figure 4. Peak pulse power versus exponential pulse duration (Tj initial = 25 °C) Figure 5. Clamping voltage versus peak pulse current (Tj initial = 25 °C). Rectangular waveform tp = 2.5 µs Figure 6. Capacitance versus reverse applied voltage Figure 7. Relative variation of leakage current versus junction temperature Figure 8. Peak forward voltage drop versus peak forward current 2 Ordering information Figure 9. Ordering information scheme 3 Package information Table 5. SOT23-5L dimensions Figure 10. SOT23-5L footprint (dimensions in mm) Table 6. SOT23-6L dimensions Figure 11. SOT23-6L footprint (dimensions in mm) 4 Ordering information Table 7. Ordering information 5 Revision history Table 8. Document revision history