Datasheet ADG417 (Analog Devices) - 4

ADG417 ABSOLUTE MAXIMUM RATINGS1
Plastic Package, Power Dissipation . 400 mW (T θ A = +25°C unless otherwise noted) JA, Thermal Impedance . 100°C/W VDD to VSS . +44 V Lead Temperature, Soldering (10 sec) . +260°C VDD to GND . –0.3 V to +25 V SOIC Package, Power Dissipation . 400 mW V θ SS to GND . +0.3 V to –25 V JA, Thermal Impedance . 155°C/W VL to GND . –0.3 V to VDD + 0.3 V Lead Temperature, Soldering Analog, Digital Inputs2 . VSS – 2 V to VDD +2 V Vapor Phase (60 sec). +215°C or 30 mA, Whichever Occurs First Infrared (15 sec) . +220°C Continuous Current, S or D . 30 mA Peak Current, S or D . 100 mA NOTES 1 (Pulsed at 1 ms, 10% Duty Cycle Max) Stresses above those listed under Absolute Maximum Ratings may cause perma- nent damage to the device. This is a stress rating only; functional operation of the Operating Temperature Range device at these or any other conditions above those listed in the operational Industrial (B Version) . –40°C to +85°C sections of this specification is not implied. Exposure to absolute maximum rating Extended (T Version) . –55°C to +125°C conditions for extended periods may affect device reliability. Only one absolute Storage Temperature Range . –65°C to +150°C maximum rating may be applied at any one time. 2 Junction Temperature . 150°C Overvoltages at IN, S or D will be clamped by internal diodes. Current should be limited to the maximum ratings given.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
WARNING!
accumulate on the human body and test equipment and can discharge without detection. Although the ADG417 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
ESD SENSITIVE DEVICE
precautions are recommended to avoid performance degradation or loss of functionality.
TERMINOLOGY
VD (VS) Analog voltage on terminals D, S. VDD Most positive power supply potential. CS (OFF) “OFF” switch source capacitance. VSS Most negative power supply potential in dual CD (OFF) “OFF” switch drain capacitance. supplies. In single supply applications, it CD, CS (ON) “ON” switch capacitance. may be connected to GND. tON Delay between applying the digital control VL Logic power supply (+5 V). input and the output switching on. GND Ground (0 V) reference. tOFF Delay between applying the digital control S Source terminal. May be an input or an input and the output switching off. output. VINL Maximum input voltage for logic “0.” D Drain terminal. May be an input or an VINH Minimum input voltage for logic “1.” output. IINL (IINH) Input current of the digital input. IN Logic control input. Charge Injection A measure of the glitch impulse transferred RON Ohmic resistance between D and S. from the digital input to the analog output IS (OFF) Source leakage current with the switch during switching. “OFF.” Off Isolation A measure of unwanted signal coupling I through an “OFF” channel. D (OFF) Drain leakage current with the switch “OFF.” IDD Positive supply current. ID, IS (ON) Channel leakage current with the switch ISS Negative supply current. “ON.” IL Logic supply current. –4– REV. A