Datasheet KMA210 (NXP) - 9

link to page 9 link to page 9 link to page 9 link to page 9 link to page 9 link to page 9 link to page 9 link to page 9 link to page 9 link to page 9 link to page 9 link to page 9
NXP Semiconductors KMA210 Programmable angle sensor 9. Recommended operating conditions Table 8. Operating conditions
In a homogenous magnetic field.
Symbol Parameter Conditions Min Typ Max Unit
VDD supply voltage [1] 4.5 5.0 5.5 V Tamb ambient temperature 40 - +160 C Tamb(pr) programming ambient temperature 10 - 70 C CL(ext) external load capacitance [1][2] 0 - 22 nF [2][3] 0 - 6.8 nF RL(ext) external load resistance [4] 5 -  k Hext external magnetic field strength 35 - - kA/m [1] Normal operation mode. [2] Between ground and analog output. [3] Command mode. [4] Power-loss detection is only possible with a load resistance within the specified range connected to the supply or ground line.
10. Thermal characteristics Table 9. Thermal characteristics Symbol Parameter Conditions Typ Unit
Rth(j-a) thermal resistance from junction to 145 K/W ambient
11. Characteristics Table 10. Supply current
Characteristics are valid for the operating conditions, as specified in Section 9.
Symbol Parameter Conditions Min Typ Max Unit
IDD supply current [1][2] 5 - 10.5 mA [3][4] - - 13 mA Ioff(ov) overvoltage switch-off current [5] - - 6 mA [1] Normal operation and diagnostic mode excluding overvoltage and undervoltage within the specified operating supply voltage range. [2] Without load current at the analog output. [3] Normal operation and diagnostic mode over full voltage range up to limiting supply voltage at steady state. [4] With minimum load resistance at the analog output. [5] Diagnostic mode for a supply voltage above the overvoltage threshold voltage up to the limiting supply voltage. KMA210 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 7 December 2011 9 of 37
Document Outline 1. Product profile 1.1 General description 1.2 Features and benefits 2. Pinning information 3. Ordering information 4. Functional diagram 5. Functional description 5.1 Angular measurement directions 6. Analog output 7. Diagnostic features 7.1 CRC and EDC supervision 7.2 Magnet-loss detection 7.3 Power-loss detection 7.4 Broken bond wire detection 7.5 Low supply voltage detection and overvoltage protection 8. Limiting values 9. Recommended operating conditions 10. Thermal characteristics 11. Characteristics 12. Definition of errors 12.1 General 12.2 Hysteresis error 12.3 Linearity error 12.4 Microlinearity error 12.5 Temperature drift error 12.6 Angular error 13. Programming 13.1 General description 13.2 Timing characteristics 13.3 Sending and receiving data 13.3.1 Write access 13.3.2 Read access 13.3.3 Entering the command mode 13.4 Cyclic redundancy check 13.4.1 Software example in C 13.5 Registers 13.5.1 Command registers 13.5.2 Non-volatile memory registers 14. Electromagnetic compatibility 14.1 Emission (CISPR 25) 14.1.1 Conducted radio disturbance 14.1.2 Radiated radio disturbance 14.2 Radiated disturbances (ISO 11452-1 third edition (2005-02), ISO 11452-2, ISO 11452-4 and ISO 11452-5) 14.2.1 Absorber lined shielded enclosure 14.2.2 Bulk-current injection 14.2.3 Strip line 14.2.4 Immunity against mobile phones 14.3 Electrical transient transmission by capacitive coupling [ISO 7637-3, second edition (2007-07)] 15. ElectroStatic Discharge (ESD) 15.1 Human body model (AEC-Q100-002) 15.2 Human metal model (ANSI/ESD SP5.6-2009) 15.3 Machine model (AEC-Q100-003) 15.4 Charged-device model (AEC-Q100-011) 16. Application information 17. Test information 17.1 Quality information 18. Marking 19. Terminals 20. Package outline 21. Handling information 22. Solderability information 23. Revision history 24. Legal information 24.1 Data sheet status 24.2 Definitions 24.3 Disclaimers 24.4 Trademarks 25. Contact information 26. Contents