Datasheet KMA210 (NXP) - 8

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NXP Semiconductors KMA210 Programmable angle sensor Table 5. System behavior
…continued
Supply voltage State Description
Minimum VDD to normal All analog circuits are active and the measured angle is maximum VDD operation available at the analog output. All parameters are within the specified limits. Maximum VDD to functional All analog circuits are active and the measured angle is Vth(ov) operation available at the analog output. Not all parameters are within the specified limits. Vth(ov) to 16 V overvoltage The digital core and the oscillator are active but all other circuits are in Power-down mode. The output is set to the lower diagnostic level. Table 6 describes the diagnostic behavior and the resulting output voltage depending on the error case. Furthermore the duration and termination condition to enter and leave the diagnostic mode are given, respectively.
Table 6. Diagnostic behavior Diagnostic condition Duration Analog output Termination condition
Low voltage 1 s < t < 10 s  4 %VDD functional or normal operation Overvoltage 1 s < t < 10 s  4 %VDD functional or normal operation Checksum error n/a  4 %V [2] DD or  96 %VDD power-on reset[1] Double-bit error n/a  4 %V [2] DD or  96 %VDD power-on reset[1] Magnet-loss 0.5 ms < t < 6 ms  4 %V [2] DD or  96 %VDD magnet present[1] Power-loss  2 ms  4 %V [2] DD or  96 %VDD power-on reset Broken bond wire 0.2 ms < t < 1 ms  4 %V [2] DD or  96 %VDD power-on reset[1] [1] Status bit stays set in command register until power-on reset. [2] Depending on the diagnostic level setting.
8. Limiting values Table 7. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VDD supply voltage 0.3 +16 V VO output voltage 0.3 +16 V V [1] O(ov) overvoltage output voltage Tamb < 140 C Vth(ov) 16 V at t < 1 h Ir reverse current Tamb < 70 C - 150 mA Tamb ambient temperature 40 +160 C Tamb(pr) programming ambient temperature 10 70 C Tstg storage temperature 40 +125 C
Non-volatile memory
tret(D) data retention time Tamb = 50 C 17 - year Nendu(W_ER) write or erase endurance Tamb(pr) = 70 C 100 - cycle [1] Overvoltage on analog output and supply within the specified operating voltage range. KMA210 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 7 December 2011 8 of 37
Document Outline 1. Product profile 1.1 General description 1.2 Features and benefits 2. Pinning information 3. Ordering information 4. Functional diagram 5. Functional description 5.1 Angular measurement directions 6. Analog output 7. Diagnostic features 7.1 CRC and EDC supervision 7.2 Magnet-loss detection 7.3 Power-loss detection 7.4 Broken bond wire detection 7.5 Low supply voltage detection and overvoltage protection 8. Limiting values 9. Recommended operating conditions 10. Thermal characteristics 11. Characteristics 12. Definition of errors 12.1 General 12.2 Hysteresis error 12.3 Linearity error 12.4 Microlinearity error 12.5 Temperature drift error 12.6 Angular error 13. Programming 13.1 General description 13.2 Timing characteristics 13.3 Sending and receiving data 13.3.1 Write access 13.3.2 Read access 13.3.3 Entering the command mode 13.4 Cyclic redundancy check 13.4.1 Software example in C 13.5 Registers 13.5.1 Command registers 13.5.2 Non-volatile memory registers 14. Electromagnetic compatibility 14.1 Emission (CISPR 25) 14.1.1 Conducted radio disturbance 14.1.2 Radiated radio disturbance 14.2 Radiated disturbances (ISO 11452-1 third edition (2005-02), ISO 11452-2, ISO 11452-4 and ISO 11452-5) 14.2.1 Absorber lined shielded enclosure 14.2.2 Bulk-current injection 14.2.3 Strip line 14.2.4 Immunity against mobile phones 14.3 Electrical transient transmission by capacitive coupling [ISO 7637-3, second edition (2007-07)] 15. ElectroStatic Discharge (ESD) 15.1 Human body model (AEC-Q100-002) 15.2 Human metal model (ANSI/ESD SP5.6-2009) 15.3 Machine model (AEC-Q100-003) 15.4 Charged-device model (AEC-Q100-011) 16. Application information 17. Test information 17.1 Quality information 18. Marking 19. Terminals 20. Package outline 21. Handling information 22. Solderability information 23. Revision history 24. Legal information 24.1 Data sheet status 24.2 Definitions 24.3 Disclaimers 24.4 Trademarks 25. Contact information 26. Contents