Datasheet KMA210 (NXP) - 7

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NXP Semiconductors KMA210 Programmable angle sensor KMA210
VDD ZO(pl) OUT/DATA ZO(pl) GND 008aaa259
Fig 4. Equivalent output circuit in case of a power-loss condition
Table 4 describes the power-loss behavior and gives the resulting output voltage depending on the interrupted supply or ground line and the load resistance.
Table 4. Power-loss behavior Load resistance Interrupted supply line Interrupted ground line
R   L(ext) > 5 k VO 4 %VDD VO 96 %VDD
7.4 Broken bond wire detection
The broken bond wire detection circuit enables the detection of an interrupted supply or ground line of the MR sensor bridge. In the case of a broken bond wire the device goes into diagnostic mode and a status bit is set.
7.5 Low supply voltage detection and overvoltage protection
If the supply voltage is below the switch-off threshold voltage, a status bit is set and the device goes into diagnostic mode. If the supply voltage is above the overvoltage switch-on threshold voltage, the device enters diagnostic mode. Table 5 describes the system behavior depending on the voltage range of the supply voltage.
Table 5. System behavior Supply voltage State Description
0 V to  1.8 V start-up power The output buffer drives an active LOW or is powered down, but the switches of the power-loss detection circuit are not fully opened and set the output to a level between ground and half the supply voltage.  1.8 V to VPOR power-on The power-loss charge pump is fully operational and turns the reset switches of the detection circuit off. The output buffer drives an active LOW and sets the output to the lower diagnostic level. During the reset phase all circuits are in reset and/or Power-down mode. VPOR to Vth(on) or initialization The digital core and the oscillator are active. After reset the Vth(off) content of the non-volatile memory is copied into the shadow registers. The output buffer drives an active LOW and sets the output to the lower diagnostic level. Vth(on) or Vth(off) to functional All analog circuits are active and the measured angle is minimum VDD operation available at the analog output. Not all parameters are within the specified limits. KMA210 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 7 December 2011 7 of 37
Document Outline 1. Product profile 1.1 General description 1.2 Features and benefits 2. Pinning information 3. Ordering information 4. Functional diagram 5. Functional description 5.1 Angular measurement directions 6. Analog output 7. Diagnostic features 7.1 CRC and EDC supervision 7.2 Magnet-loss detection 7.3 Power-loss detection 7.4 Broken bond wire detection 7.5 Low supply voltage detection and overvoltage protection 8. Limiting values 9. Recommended operating conditions 10. Thermal characteristics 11. Characteristics 12. Definition of errors 12.1 General 12.2 Hysteresis error 12.3 Linearity error 12.4 Microlinearity error 12.5 Temperature drift error 12.6 Angular error 13. Programming 13.1 General description 13.2 Timing characteristics 13.3 Sending and receiving data 13.3.1 Write access 13.3.2 Read access 13.3.3 Entering the command mode 13.4 Cyclic redundancy check 13.4.1 Software example in C 13.5 Registers 13.5.1 Command registers 13.5.2 Non-volatile memory registers 14. Electromagnetic compatibility 14.1 Emission (CISPR 25) 14.1.1 Conducted radio disturbance 14.1.2 Radiated radio disturbance 14.2 Radiated disturbances (ISO 11452-1 third edition (2005-02), ISO 11452-2, ISO 11452-4 and ISO 11452-5) 14.2.1 Absorber lined shielded enclosure 14.2.2 Bulk-current injection 14.2.3 Strip line 14.2.4 Immunity against mobile phones 14.3 Electrical transient transmission by capacitive coupling [ISO 7637-3, second edition (2007-07)] 15. ElectroStatic Discharge (ESD) 15.1 Human body model (AEC-Q100-002) 15.2 Human metal model (ANSI/ESD SP5.6-2009) 15.3 Machine model (AEC-Q100-003) 15.4 Charged-device model (AEC-Q100-011) 16. Application information 17. Test information 17.1 Quality information 18. Marking 19. Terminals 20. Package outline 21. Handling information 22. Solderability information 23. Revision history 24. Legal information 24.1 Data sheet status 24.2 Definitions 24.3 Disclaimers 24.4 Trademarks 25. Contact information 26. Contents