Datasheet MSPM0C110, MSPS003 (Texas Instruments) - 5

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MSPM0C1104 , MSPM0C1103 www.ti.com
SLASF90C – OCTOBER 2023 – REVISED FEBRUARY 2025
5 Device Comparison Table 5-1. Device Comparison 5V ADC UART / I2C / PACKAGE DEVICE NAME
(1) (3)
FLASH / TIMG TIMA GPIOs TOLERANT SRAM (KB) CHANNELS SPI [PACKAGE SIZE]
(2)
IO
MSPS003F4SPW20R 16 / 1 20 TSSOP 9 1 / 1 / 1 2 1 17 2 [6.5mm × 5.0mm] MSPS003F3SPW20R 8 / 1 MSPM0C1104SDGS20R 16 / 1 20 VSSOP 10 1 / 1 / 1 2 1 18 2 [5.1mm × 4.9mm] MSPM0C1103SDGS20R 8 / 1 MSPM0C1104SRUKR 16/ 1 20 WQFN 10 1 / 1 / 1 2 1 18 2 [3mm × 3mm] MSPM0C1103SRUKR 8 / 1 MSPM0C1104SDYYR 16 /1 16 SOT 8 1 / 1 / 1 2 1 14 2 [4.2mm × 3.26mm] MSPM0C1103SDYYR 8 / 1 MSPM0C1104SDSGR 16 / 1 8 WSON 3 1 / 1 / 1 2 1 6 2 [2mm × 2mm] MSPM0C1103SDSGR 8 / 1 MSPM0C1104SDDFR 16 / 1 8 SOT 3 1 / 1 / 1 2 1 6 2 [2.9mm × 2.8mm] MSPM0C1103SDDFR 8 / 1 MSPM0C1104S8YCJR 16 / 1 8 DSBGA 3 1 / 1 / 1 2 1 6 2 [ 1.6mm × 0.86mm] MSPM0C1103S8YCJR 8 / 1 (1) For the most current part, package, and ordering information for all available devices, see the Package Option Addendum in Section 12, or see the TI web site. (2) The package size (length × width) is a nominal value and includes pins, where applicable. For package dimensions with tolerances, see the Mechanical Data in Section 12. (3) For more information about the device name, see Section 10.1. Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 5 Product Folder Links: MSPM0C1104 MSPM0C1103 Document Outline 1 Features 2 Applications 3 Description 4 Functional Block Diagram Table of Contents 5 Device Comparison 6 Pin Configuration and Functions 6.1 Pin Diagrams 6.2 Pin Attributes 6.3 Signal Descriptions 6.4 Connections for Unused Pins 7 Specifications 7.1 Absolute Maximum Ratings 7.2 ESD Ratings 7.3 Recommended Operating Conditions 7.4 Thermal Information 7.5 Supply Current Characteristics 7.5.1 RUN/SLEEP Modes 7.5.2 STOP/STANDBY Modes 7.5.3 SHUTDOWN Mode 7.6 Power Supply Sequencing 7.6.1 POR and BOR 7.6.2 Power Supply Ramp 7.7 Flash Memory Characteristics 7.8 Timing Characteristics 7.9 Clock Specifications 7.9.1 System Oscillator (SYSOSC) 7.9.2 Low Frequency Oscillator (LFOSC) 7.10 Digital IO 7.10.1  Electrical Characteristics 7.10.2 Switching Characteristics 7.11 ADC 7.11.1 Electrical Characteristics 7.11.2 Switching Characteristics 7.11.3 Linearity Parameters 7.11.4 Typical Connection Diagram 7.12 Temperature Sensor 7.13 VREF 7.13.1 Voltage Characteristics 7.13.2 Electrical Characteristics 7.14 I2C 7.14.1 I2C Characteristics 7.14.2 I2C Filter 7.14.3 I2C Timing Diagram 7.15 SPI 7.15.1 SPI 7.15.2 SPI Timing Diagrams 7.16 UART 7.17 TIMx 7.18 Windowed Watchdog Characteristics 7.19 Emulation and Debug 7.19.1 SWD Timing 8 Detailed Description 8.1 CPU 8.2 Operating Modes 8.2.1 Functionality by Operating Mode (MSPM0C110x) 8.3 Power Management Unit (PMU) 8.4 Clock Module (CKM) 8.5 DMA 8.6 Events 8.7 Memory 8.7.1 Memory Organization 8.7.2 Peripheral File Map 8.7.3 Peripheral Interrupt Vector 8.8 Flash Memory 8.9 SRAM 8.10 GPIO 8.11 IOMUX 8.12 ADC 8.13 Temperature Sensor 8.14 VREF 8.15 CRC 8.16 UART 8.17 SPI 8.18 I2C 8.19 WWDT 8.20 Timers (TIMx) 8.21 Device Analog Connections 8.22 Input/Output Diagrams 8.23 Serial Wire Debug Interface 8.24 Device Factory Constants 8.25 Identification 9 Applications, Implementation, and Layout 9.1 Typical Application 9.1.1 Schematic 10 Device and Documentation Support 10.1 Device Nomenclature 10.2 Tools and Software 10.3 Support Resources 10.4 Trademarks 10.5 Electrostatic Discharge Caution 10.6 Glossary 11 Revision History 12 Mechanical, Packaging, and Orderable Information