Datasheet MSPM0C110, MSPS003 (Texas Instruments) - 10

MSPM0C1104 , MSPM0C1103
SLASF90C – OCTOBER 2023 – REVISED FEBRUARY 2025
www.ti.com PIN NO.
(1)
PIN FUNCTION SIGNAL NAME TYPE
(2)
DESCRIPTION 20 VSSOP 20 TSSOP 20 WQFN 16 SOT 8 SOT 8 WSON 8 DSBGA
General-purpose digital I/O with open-drain PA0 4 11 2 3 5 5 A2 I/O capability General-purpose digital I/O with open-drain PA1 5 12 3 4 2 2 B2 I/O capability PA2 8 8 6 7 - - - I/O General-purpose digital I/O PA4 9 5 7 - - - - I/O General-purpose digital I/O PA6 10 10 8 8 - - - I/O General-purpose digital I/O PA11 11 6 9 - - - - I/O General-purpose digital I/O PA16 12 - 10 - - - - I/O General-purpose digital I/O PA17 13 13 11 9 - - - I/O General-purpose digital I/O GPIO PA18 14 14 12 10 - - - I/O General-purpose digital I/O PA19 15 15 13 11 6 6 D1 I/O General-purpose digital I/O PA20 16 16 14 12 7 7 C1 I/O General-purpose digital I/O PA22 17 17 15 13 - - - I/O General-purpose digital I/O PA23 18 18 16 14 - - - I/O General-purpose digital I/O PA24 19 19 17 15 8 8 A1 I/O General-purpose digital I/O PA25 20 20 18 16 - - - I/O General-purpose digital I/O PA26 1 1 19 1 - - - I/O General-purpose digital I/O PA27 2 2 20 - 1 1 B1 I/O General-purpose digital I/O PA28 3 3 1 2 - - - I/O General-purpose digital I/O I2C0_SCL 5, 11 6 3, 9 4 2 2 B2 I/O I2C0 serial clock I2C I2C0_SDA 4 11 2 3 5 5 A2 I/O I2C0 serial data VSS 7 7 5 6 3 3 D2 P Ground supply VDD 6 9 4 5 4 4 C2 P Power supply Power QFN package exposed thermal pad. TI QFN Pad - - Pad - - Pad - P recommends connection to VSS. SPI0_CS0 8 8 6 7 - - - I/O SPI0 chip-select 0 11, SPI0_CS1 4, 13 2, 11 3, 9 5 5 A2 I/O SPI0 chip-select 1 13 SPI0_CS2 19 19 17 15 8 8 A1 I/O SPI0 chip-select 2 16, SPI0_CS3 2, 18 2, 18 14 1 1 B1 I/O SPI0 chip-select 3 20 10, 6, 10, 8, 9, SPI0 clock signal input – SPI peripheral 11, 8, 9, SPI0_SCK 13, 11, 6 6 D1 I/O mode SPI 13, 11 15 13 Clock signal output – SPI controller mode 15 7, 10, 1, 2, 1, 2, 13, 9, 12, 1, 11, D1, SPI0_POCI 5, 15, 15, 1, 6 1, 6 I/O SPI0 controller in/peripheral out 15, 13 B1 17 19, 17 20 14, 14, 12, 10, SPI0_PICO 16, 16, 14, 12, 7 7 C1 I/O SPI0 controller out/peripheral in 20 20 18 16 System NRST 5 4 3 4 2 2 B2 I Reset input active low 10 Submit Document Feedback Copyright © 2025 Texas Instruments Incorporated Product Folder Links: MSPM0C1104 MSPM0C1103 Document Outline 1 Features 2 Applications 3 Description 4 Functional Block Diagram Table of Contents 5 Device Comparison 6 Pin Configuration and Functions 6.1 Pin Diagrams 6.2 Pin Attributes 6.3 Signal Descriptions 6.4 Connections for Unused Pins 7 Specifications 7.1 Absolute Maximum Ratings 7.2 ESD Ratings 7.3 Recommended Operating Conditions 7.4 Thermal Information 7.5 Supply Current Characteristics 7.5.1 RUN/SLEEP Modes 7.5.2 STOP/STANDBY Modes 7.5.3 SHUTDOWN Mode 7.6 Power Supply Sequencing 7.6.1 POR and BOR 7.6.2 Power Supply Ramp 7.7 Flash Memory Characteristics 7.8 Timing Characteristics 7.9 Clock Specifications 7.9.1 System Oscillator (SYSOSC) 7.9.2 Low Frequency Oscillator (LFOSC) 7.10 Digital IO 7.10.1  Electrical Characteristics 7.10.2 Switching Characteristics 7.11 ADC 7.11.1 Electrical Characteristics 7.11.2 Switching Characteristics 7.11.3 Linearity Parameters 7.11.4 Typical Connection Diagram 7.12 Temperature Sensor 7.13 VREF 7.13.1 Voltage Characteristics 7.13.2 Electrical Characteristics 7.14 I2C 7.14.1 I2C Characteristics 7.14.2 I2C Filter 7.14.3 I2C Timing Diagram 7.15 SPI 7.15.1 SPI 7.15.2 SPI Timing Diagrams 7.16 UART 7.17 TIMx 7.18 Windowed Watchdog Characteristics 7.19 Emulation and Debug 7.19.1 SWD Timing 8 Detailed Description 8.1 CPU 8.2 Operating Modes 8.2.1 Functionality by Operating Mode (MSPM0C110x) 8.3 Power Management Unit (PMU) 8.4 Clock Module (CKM) 8.5 DMA 8.6 Events 8.7 Memory 8.7.1 Memory Organization 8.7.2 Peripheral File Map 8.7.3 Peripheral Interrupt Vector 8.8 Flash Memory 8.9 SRAM 8.10 GPIO 8.11 IOMUX 8.12 ADC 8.13 Temperature Sensor 8.14 VREF 8.15 CRC 8.16 UART 8.17 SPI 8.18 I2C 8.19 WWDT 8.20 Timers (TIMx) 8.21 Device Analog Connections 8.22 Input/Output Diagrams 8.23 Serial Wire Debug Interface 8.24 Device Factory Constants 8.25 Identification 9 Applications, Implementation, and Layout 9.1 Typical Application 9.1.1 Schematic 10 Device and Documentation Support 10.1 Device Nomenclature 10.2 Tools and Software 10.3 Support Resources 10.4 Trademarks 10.5 Electrostatic Discharge Caution 10.6 Glossary 11 Revision History 12 Mechanical, Packaging, and Orderable Information